Richard Baisl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A method for producing a light-emitting semiconductor component is specified. A light-emitting semiconductor chip is arranged on a mounting area of a carrier. The semiconductor chip is electrically connected to electrical contact regions on the mounting area. An encapsulation layer is applied to the semiconductor chip by means of atomic layer deposition. All surfaces of the semiconductor chip which are free after mounting and electrical connection are covered with an encapsulation layer. Furthermore, a light-emitting semiconductor component is specified.
April 11, 2012
November 28, 2013
OSRAM OPTO SEMICONDUCTORS GmbH
Karl Engl, Richard Baisl, Tilman Schlenker, Lutz Hoeppel, Sebastian Taeger, Christian Gaertner
Abstract: An organic light-emitting device (100) comprising: an active layer for producing electroluminescent radiation and decoupling the electroluminescent radiation; and a thermally-conducting layer (206) located in a decoupling path of the electroluminescent radiation for dissipating heat generated during an electroluminescence process; wherein the thermally-conducting layer (206) has a thermal conductivity of more than 200 W/mK, in particular more than 500 W/mK.