Abstract: An encapsulation structure for an optoelectronic component, may include: a thin-film encapsulation for protecting the optoelectronic component against chemical impurities; an adhesive layer formed on the thin-film encapsulation; and a cover layer formed on the adhesive layer and serving for protecting the thin-film encapsulation and/or the optoelectronic component against mechanical damage, wherein the adhesive layer is formed such that particle impurities situated at the surface of the thin-film encapsulation are at least partly enclosed by the adhesive layer.

Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Abstract: An organic light-emitting device (100) comprising: an active layer for producing electroluminescent radiation and decoupling the electroluminescent radiation; and a thermally -conducting layer (206) located in a decoupling path of the electroluminescent radiation for dissipating heat generated during an electroluminescence process; wherein the thermally -conducting layer (206) has a thermal conductivity of more than 200 W/mK, in particular more than 500 W/mK.

Abstract: A method for producing a light-emitting semiconductor component is specified. A light-emitting semiconductor chip is arranged on a mounting area of a carrier. The semiconductor chip is electrically connected to electrical contact regions on the mounting area. An encapsulation layer is applied to the semiconductor chip by means of atomic layer deposition. All surfaces of the semiconductor chip which are free after mounting and electrical connection are covered with an encapsulation layer. Furthermore, a light-emitting semiconductor component is specified.

Abstract: An organic light-emitting device (100) comprising: an active layer for producing electroluminescent radiation and decoupling the electroluminescent radiation; and a thermally-conducting layer (206) located in a decoupling path of the electroluminescent radiation for dissipating heat generated during an electroluminescence process; wherein the thermally-conducting layer (206) has a thermal conductivity of more than 200 W/mK, in particular more than 500 W/mK.