Patents by Inventor Richard C. Chu

Richard C. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6714412
    Abstract: A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: March 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
  • Publication number: 20040050231
    Abstract: A scalable coolant conditioning unit (SCCU) is designed to accommodate removable modular pumping units (MPU's). The MPU's may comprise one or a plurality of pump/pump motor combinations. The MPU's are connected to coolant supply and discharge mechanisms by an insertion facilitation mechanism comprising an automatic coupling assembly and an isolation valve mechanism and are placed into and removed from the SCCU body with the aid of a seating mechanism. MPU's are added to an operating SCCU as needed to support increased heat loads of electronics frames. A plate heat exchanger is physically integrated within the expansion tank, reducing volumetric requirements for the SCCU and is sized to accommodate the maximum heat load.
    Type: Application
    Filed: September 13, 2002
    Publication date: March 18, 2004
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Roger R. Schmidt, Robert E. Simons
  • Patent number: 6705089
    Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: March 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Publication number: 20040012914
    Abstract: An electronic module, substrate assembly, and fabrication method, the assembly providing thermal conduction between an electronic device to be cooled and an aqueous coolant, while maintaining physical separation between the coolant and electronic device. The assembly includes a substrate, one or more electronic devices to be cooled, and a multilayer, impermeable barrier. The multilayer barrier includes a first layer, providing mechanical support for a second layer. The second, thinner layer provides an impermeable barrier, and a high effective thermal conductivity path between an electronic device and a cooling fluid in contact with an upper surface of the second barrier layer. Mechanical stresses are minimized by appropriate material selection for the first layer, and a thin second layer.
    Type: Application
    Filed: July 17, 2002
    Publication date: January 22, 2004
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons, Prabjit Singh, Paul A. Zucco
  • Patent number: 6674642
    Abstract: A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer. The heat exchange assembly includes a hollow channel for carrying coolant, as well as a thermally conductive plate and air-cooled fins. The hollow channel is coupled to one main surface of the plate, while the air-cooled fins are coupled to an opposite main surface of the plate. A conduit carries coolant between the cold plate assembly and the hollow channel of the heat exchange assembly, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner to remove heat from the heat-generating electronic component.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: January 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Publication number: 20040001310
    Abstract: A cooling system and method of fabrication are provided for cooling a heat-generating electronic element within a portable computer. The cooling system includes a cold plate assembly coupled to a heat-generating electronic element, and a heat exchange assembly disposed within the cover of the portable computer. The heat exchange assembly includes a hollow channel for carrying coolant, as well as a thermally conductive plate and air-cooled fins. The hollow channel is coupled to one main surface of the plate, while the air-cooled fins are coupled to an opposite main surface of the plate. A conduit carries coolant between the cold plate assembly and the hollow channel of the heat exchange assembly, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange assembly in a manner to remove heat from the heat-generating electronic component.
    Type: Application
    Filed: June 27, 2002
    Publication date: January 1, 2004
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Patent number: 6650538
    Abstract: A cooling apparatus and method of fabrication are provided for cooling one or more heat generating components. The cooling apparatus includes a heat sink structure and an airflow tube assembly. In one embodiment, the heat sink structure has a first surface for coupling to one or more heat generating components, and a second surface having at least one fin extending therefrom. The airflow tube assembly has at least one airflow tube which is sized to at least partially receive the at least one fin of the heat sink structure, wherein an annular airflow can be established between the at least one airflow tube and the at least one fin of the heat sink structure, thereby enhancing heat transfer from the heat sink structure to the airflow and cooling of the heat generating component(s).
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: November 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Publication number: 20030205363
    Abstract: A cooling apparatus for an electronic module, to enhance air cooling of electronic devices using a closed loop, phase change fluid heat transfer mechanism to transfer thermal energy from electronic devices to air cooled fins. The evaporator includes a surface for making thermal contact with an electronic module to be cooled. The boiling chamber is disposed within the evaporator, and includes a plurality of fluid inlet ports disposed near one end, and a plurality of fluid outlet ports disposed near an opposite end. The condenser includes a plurality of tubes and a plurality of thermally conductive fins. Each tube is in fluid flow communication with one fluid inlet port and one fluid outlet port, forming a fluid flow path. Each fin is in thermal contact with one or more tubes. A check valve is disposed within each fluid flow path proximate an inlet port.
    Type: Application
    Filed: November 9, 2001
    Publication date: November 6, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Publication number: 20030188538
    Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.
    Type: Application
    Filed: April 4, 2002
    Publication date: October 9, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Patent number: 6591898
    Abstract: An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: July 15, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Publication number: 20030122245
    Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
    Type: Application
    Filed: February 18, 2003
    Publication date: July 3, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Patent number: 6587336
    Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: July 1, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 6587345
    Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.
    Type: Grant
    Filed: November 9, 2001
    Date of Patent: July 1, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons, Prabjit Singh
  • Publication number: 20030090872
    Abstract: An electronic module substrate assembly and fabrication method, the assembly providing good thermal conductivity between an electronic device and an aqueous coolant, while maintaining physical separation between the coolant and electronic device, and relieving mechanical stresses caused by mismatches in thermal coefficients of expansion of materials within the device assembly. The assembly includes a substrate, at least one electronic device, and a preformed, thermally conductive, impermeable barrier. The barrier is preformed into a plurality of regions, some of which are bonded to other structures. One barrier region preferably forms a fluid tight seal with the substrate perimeter. At least one other barrier region forms a low thermal resistance bond with the at least one electronic device.
    Type: Application
    Filed: November 9, 2001
    Publication date: May 15, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons, Prabjit Singh
  • Patent number: 6557354
    Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: May 6, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Patent number: 6548894
    Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: April 15, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons
  • Publication number: 20030060108
    Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Publication number: 20030056940
    Abstract: A transpiration cooled heat sink, a self contained coolant supply and a method of using a transpiration cooled heat sink and a self contained coolant supply is provided and includes a heat sink base structure, the heat sink base structure having a coolant inlet for receiving a coolant and a coolant outlet for distributing a coolant, wherein the heat sink base structure defines at least one coolant channel disposed so as to be communicated with the coolant inlet and the coolant outlet and a coolant distribution structure, wherein the coolant distribution structure defines at least one distribution cavity and includes at least one distribution inlet communicated with the distribution cavity and wherein the coolant distribution structure is disposed relative to the heat sink base structure such that the distribution inlet is communicated with the coolant outlet.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Publication number: 20030056939
    Abstract: An integrated cooling unit configured to effect the removal of heat via a circulating liquid coolant includes a reservoir to contain the liquid coolant, a tubing arrangement disposed at an outer surface of the reservoir, a pump disposed within the reservoir, and a fan configured to provide a flow of air across the tubing arrangement to remove the heat. The tubing arrangement is fluidly communicable with a heat exchanging device, and the pump is configured to circulate the liquid coolant through the tubing arrangement to the heat exchanging device.
    Type: Application
    Filed: September 27, 2001
    Publication date: March 27, 2003
    Applicant: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Robert E. Simons
  • Patent number: 6519151
    Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons