Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: A cooling system and method of fabrication are provided for cooling one or more heat-generating electronic elements within a portable computer. The cooling system includes a cold plate assembly thermally coupled to a heat-generating electronic element, and a heat exchange structure disposed within the cover of the portable computer. The heat exchange structure includes a hollow channel and an expansion chamber in fluid communication with the channel. A conduit carries coolant between the cold plate assembly and the hollow channel in the heat exchange structure, and a circulation pump circulates coolant through the conduit between the cold plate assembly and the heat exchange structure in a manner to remove heat from the heat-generating electronic component. The expansion chamber integrated within the heat exchange structure provides a reservoir for the circulation pump from which to draw coolant for circulation through the cold plate assembly.

Abstract: A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

Abstract: A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

Abstract: An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.

Abstract: A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.

Abstract: An electronic module is provided having an integrated refrigerant evaporator assembly coupled to a closed-cycle cooling system, as well as a method for controlling the system. The module and integrated assembly includes a plurality of integrated circuit chips arrayed on a substrate. The evaporator assembly is disposed over the chips and substrate such that a chamber is formed between the assembly and the substrate within which the chips reside. A lower plate of the assembly has a plurality of jet orifices which direct coolant onto individual chips of the plurality of chips arrayed on the substrate. In addition, the lower plate includes a plurality of channels formed between at least some of the jet orifices. The plurality of channels remove coolant from the chamber after the coolant has been heated by impinging upon the integrated circuit chips. A control system is provided to prevent excessive pressure from building up within the assembly at startup and shutdown of the closed-cycle cooling system.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a first plurality of channels for carrying coolant fluid. The first plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. The heat sink member further includes a second plurality of channels disposed above the first plurality of channels such that the first and second pluralities of channels comprise tiered channels. The second plurality of channels further includes a third group of channels and a fourth group of channels, wherein the third group of channels and fourth group of channels are positioned generally alternately across the member so that coolant flow also alternates direction therebetween.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one cross-flow opening is provided between at least some adjacent channels of the plurality of channels so that coolant flow can flow within the member between the first group of channels and the second group of channels.

Abstract: A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a plurality of channels for carrying coolant fluid. The plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. At least one channel of the plurality of channels has a fluid flow cross-section that varies over a length thereof to selectively enhance a heat transfer coefficient of the coolant fluid within the channel and thereby produce a more uniform temperature at the surface of the heat sink member when making thermal contact with the electronic device.

Abstract: Supplemental heat mechanisms are employed to ensure that refrigerant in evaporative cold plates for electronic modules not only returns to the compressor in a vapor phase but also further operates to maintain electronic circuit junction temperatures at relatively constant temperature levels. Furthermore, the supplemental heating system responds within a time frame which is faster than other methods which may be employed to achieve the same or similar objectives. In particular, in preferred embodiments of the present invention pressure and temperature measurements of refrigerant exiting the evaporative cold plate are employed to control the turning on of supplemental electrical resistive heating elements to make up for thermal dissipation fluctuations occurring in the electronic module. The supplemental heat may be provided either with a single flat element or through the use of in-line heating elements.

Abstract: A thermosyphon system is employed in conjunction with compact and/or dense configurations of electrical and/or electronic components to provide cooling. The thermosyphon cooling system is particularly advantageous in those systems in which the compact arrangement of circuit modules precludes the use of direct air cooling. The thermosyphon cooling system repositions the air cooling aspect of its cooling function to an exterior cabinet location distant from the circuit modules which can therefore be placed more closely together to shorten signal paths.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from a computer system. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, pre-designed load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided. In one embodiment, the cooling system includes a refrigeration cooled cold plate thermally coupled to an electronic module of a computer system, and an auxiliary air cooled heat sink thermally coupled to the refrigeration cooled cold plate.