Patents by Inventor Richard Cooper

Richard Cooper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7099040
    Abstract: A method for serving an image from a server to a client, e.g., a computer having a browser or other graphics viewing engine. The user of the client first specifies a set of one or more bitmap characteristics for an image transfer, with at least one of the bitmap characteristics including a number of bits per pixel. Preferably, this specification is accomplished using an applet or other piece of code that is downloaded to the client from the server. Later, when the server receives a client request that includes data identifying a specified bitmap characteristic, a server processing routine (e.g., a servlet) generates a version of the image that conforms to the specified bitmap characteristic. This version is then delivered back to the client in response to the original request. In this way, the user of the client machine can control the particular characteristics of the image files that are delivered to his or her machine.
    Type: Grant
    Filed: November 4, 1999
    Date of Patent: August 29, 2006
    Assignee: International Business Machines Corporation
    Inventors: Michael Richard Cooper, Mark Joseph Hamzy, Scott Thomas Jones, Mark Wayne VanderWiele
  • Patent number: 7092915
    Abstract: A mechanism is provided for storing user identifications and passwords in a mobile device, such as a personal digital assistant. A modified keyboard device driver may be installed on each platform the user accesses. When the user is prompted for a password from a functioning terminal, the user may select the appropriate account on the mobile device. The mobile device then may send the user identification and password for the account to the terminal. The modified keyboard device driver receives the user identification and password from the mobile device and converts it into keyed text. The accounts with user identifications and passwords may be protected by a password. Thus, the user must only remember the one mobile device password to access a plurality of resources and computer systems. Furthermore, the communications between the mobile device and terminal may be encrypted to prevent snooping.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: August 15, 2006
    Assignee: International Business Machines Corporation
    Inventors: Steven Francis Best, Michael Richard Cooper, James Lee Gray, Jonathan Mark Wagner
  • Patent number: 7076495
    Abstract: In the system, method, and program of the present invention, the browser renders a multimedia object to the screen. The multimedia object may be one or more advertisements having links to one or more advertisers. The browser periodically captures screen images having the multimedia object. In one embodiment, the screen images are captured at configurable time intervals. In another embodiment, the screen images are captured when there is a change in content of a screen image. Each screen capture contains the necessary link(s) to access the advertiser. The screen captures are stored, during a configurable duration of time, in a chronological list. A user can replay at a later time some or all of the stored screen images that were captured. The user will have various identifiable snapshots of the advertisements and access to the necessary links to get back to a desired advertiser.
    Type: Grant
    Filed: April 26, 2001
    Date of Patent: July 11, 2006
    Assignee: International Business Machines Corporation
    Inventors: Rabindranath Dutta, Michael Richard Cooper, Kamal Chandrakant Patel
  • Publication number: 20060020476
    Abstract: A billing system for determining package transportation charges. The billing system includes a reader to read a package identifier associated with said package and the reader generates a package identifier signal and transmits the same to a microprocessor. The billing system also includes a package sizer having a plurality of non-contact optical sensors located along each of an x, y and z axis, where each optical sensor is in a known position. The sensors are oriented relative to the conveyor so that packages passing over the sensors are detected by the sensors and produce a signal correlated to said package size. Also provided is a microprocessor to receive and correlate said package size and identifier signals, and to determine an appropriate shipping charge based upon the same. A weigh scale may also be incorporated into the system. A method of determining a transportation charge is also comprehended, which includes a selfdiagnostic initialization procedure.
    Type: Application
    Filed: May 30, 2003
    Publication date: January 26, 2006
    Inventors: Gordon Cooper, Todd Teal, Richard Cooper
  • Patent number: 6986101
    Abstract: A method and apparatus for converting programs and source code files written in a programming language to equivalent markup language files is provided. The conversion may be accomplished by a static process or by a dynamic process. In a static process, a programming source code file is converted by an application to a markup language file. A document type definition file for a markup language is parsed; a source code statement from a source code file is parsed; an element defined in the document type definition file is selected based on an association between the element and an identifier of a routine in the source code statement; and the selected element is written to a markup language file. In a dynamic process, the program is executed to generate the markup language file that corresponds to the source code file or presentation steps of the program.
    Type: Grant
    Filed: May 6, 1999
    Date of Patent: January 10, 2006
    Assignee: International Business Machines Corporation
    Inventors: Michael Richard Cooper, Rabindranath Dutta, Kelvin Roderick Lawrence
  • Publication number: 20050262154
    Abstract: A method for allocating access to data is disclosed. The method includes storing proprietary data in a first database accessible only by an entity designated by an owner of the proprietary data. The proprietary data are time indexed and are automatically transferred to a second database being accessible by an entity other than the designated entity at a time at which the proprietary data lose proprietary status.
    Type: Application
    Filed: May 18, 2004
    Publication date: November 24, 2005
    Inventor: Richard Cooper
  • Patent number: 6963265
    Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
    Type: Grant
    Filed: September 10, 2004
    Date of Patent: November 8, 2005
    Assignee: CTS Corporation
    Inventors: Richard Cooper, Yinggang Tu, Cynthia A. Christian, legal representative, David A. Christian, deceased
  • Patent number: 6946733
    Abstract: A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: September 20, 2005
    Assignee: CTS Corporation
    Inventors: David Poole, Terry R. Bloom, Richard Cooper
  • Patent number: 6941368
    Abstract: The system, method, and program of the invention enables a Web server to ensure that any prerequisite resource is served before, or in conjunction with, a requested resource. Upon receipt of a request for a resource, e.g., a page, the Web server determines if the requested resource requires a prerequisite resource. If it does, a different resource is sent that has been modified to include the prerequisite resource. In a further embodiment, the Web server keeps track of each client's request for a prerequisite resource in order to determine whether the prerequisite resource had been previously requested when a resource is requested that requires the prerequisite resource. The different resource is sent if the resource requires a prerequisite resource and if it is determined that the previous request by the requester for the prerequisite resource has not been made within a configurable amount of time or within a predetermined number of hits.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: September 6, 2005
    Assignee: International Business Machines Corporation
    Inventors: Mark Joseph Hamzy, Michael Richard Cooper, Mark Wayne VanderWiele
  • Patent number: 6917753
    Abstract: A heater including an electrically insulative panel having a decorative image on a first side and a resistive heating layer on the second side. The resistive heating layer is preferably a graphite containing sol gel material. The invention can also include a surface or support for supporting an article such as a towel or piece of clothing adjacent to the heated surface to heat and/or dry the article.
    Type: Grant
    Filed: March 28, 2003
    Date of Patent: July 12, 2005
    Inventor: Richard Cooper
  • Publication number: 20050126530
    Abstract: Chaotic air flow structures in internal combustion engine manifolds may lead to poor combustion performance and hence undesirable emissions such as visible smoke. Manifolds with flow characteristics compromised by other design requirements are especially prone to these poor characteristics. To overcome these, an engine air induction arrangement comprises a feed passage having an end portion in a manifold with cylinder ports. The end portion is formed in such a manner that air exiting the end portion via an opening is hindered from travelling away from the cylinder ports. This improves the flow structure and evens air distribution to the cylinder ports, hence improving the combustion process and reducing emission levels.
    Type: Application
    Filed: December 10, 2003
    Publication date: June 16, 2005
    Inventor: Richard Cooper
  • Publication number: 20050103900
    Abstract: A fuel swirler plate for improving atomization of fuel in a fuel injector. A plurality of identical fuel supply passages is formed in the plate, each passage including an outer fuel reservoir region; a region having converging walls wherein fuel is accelerated and turned partially tangential to the axis of the plate and fuel injector; a metering region wherein flow is regulated; and an exit region wherein the fuel is combined with similar fuel flows from the other passages to form a high velocity swirl annulus between the swirler plate and a pintle ball of the fuel injector. An advantage of the novel swirl plate over prior art plates is that, when the injector valve is closed, only a very small volume of fuel resides in the swirl annulus between the pintle ball and the exit region of the plate, and such residual fuel is urged rotationally and becomes the leading edge of a new vortex the next time the valve is opened, thus minimizing SAC spray formation.
    Type: Application
    Filed: December 21, 2004
    Publication date: May 19, 2005
    Applicant: DELPHI TECHNOLOGIES, INC.
    Inventors: Daniel Varble, Harry Mieney, Richard Cooper, David Rogers, Kevin Allen
  • Publication number: 20050084253
    Abstract: An elongate heating element that includes an insulative substrate and a resistive coating that heats to a predetermined temperature when an electrical current is passed through the coating. The insulative material forming the substrate is preferably a ceramic such as cordierite, but the invention is not limited to any particular insulative material.
    Type: Application
    Filed: October 19, 2004
    Publication date: April 21, 2005
    Inventors: Richard Cooper, Thomas Fich-Pedersen
  • Publication number: 20050084254
    Abstract: An elongate heating element that includes an insulative substrate and a resistive coating that heats to a predetermined temperature when an electrical current is passed through the coating. The insulative material forming the substrate is preferably a ceramic such as cordierite, but the invention is not limited to any particular insulative material. An air moving device directs an air stream over the resistive coating in order to heat the air stream.
    Type: Application
    Filed: October 20, 2003
    Publication date: April 21, 2005
    Inventors: Richard Cooper, Thomas Fich-Pedersen
  • Publication number: 20050085169
    Abstract: A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.
    Type: Application
    Filed: October 14, 2004
    Publication date: April 21, 2005
    Inventors: Richard Cooper, Paul Fathauer, Angela Mroczek - Petroski, David Perry
  • Patent number: 6882266
    Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: April 19, 2005
    Assignee: CTS Corporation
    Inventors: Cynthia A. Christian, Richard Cooper, Yinggang Tu, David A. Christian
  • Patent number: 6873790
    Abstract: An elongate heating element that includes an insulative substrate and a resistive coating that heats to a predetermined temperature when an electrical current is passed through the coating. The insulative material forming the substrate is preferably a ceramic such as cordierite, but the invention is not limited to any particular insulative material. An air moving device directs an air stream over the resistive coating in order to heat the air stream.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: March 29, 2005
    Inventors: Richard Cooper, Thomas Fich-Pedersen
  • Publication number: 20050046544
    Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.
    Type: Application
    Filed: September 10, 2004
    Publication date: March 3, 2005
    Inventors: Richard Cooper, Yinggang Tu, David Christian, Cynthia Christian
  • Publication number: 20050035450
    Abstract: A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.
    Type: Application
    Filed: August 13, 2003
    Publication date: February 17, 2005
    Inventors: David Poole, Terry Bloom, Richard Cooper
  • Publication number: 20050026554
    Abstract: A novel retaining ring having a wear pad of such construction, design and material such that it provides improved resistance to wear and/or degradation as compared to currently available products for use in the chemical mechanical planarization (CMP) of semiconductor wafers and similar materials. The retaining ring with wear pad of the invention is able to withstand increased operating temperatures and pressures at the polishing surface of the wafer with less wear than would normally be encountered with currently used materials and designs. The ability to operate at increased temperature and pressure can accelerate the rate of removal of material from a semiconductor wafer in some processes.
    Type: Application
    Filed: August 24, 2004
    Publication date: February 3, 2005
    Inventors: Richard Cooper, Paul Fathauer, Angela Mroczek-Petroski, David Perry, James Macey