Patents by Inventor Richard Crisp

Richard Crisp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070094874
    Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
    Type: Application
    Filed: December 20, 2006
    Publication date: May 3, 2007
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Masud Beroz, David Tuckerman, Giles Humpston, Richard Crisp
  • Publication number: 20060138647
    Abstract: A packaged microelectronic device having a first and second electrically interconnected microelectronic elements and a method for its manufacture. Conductive posts extend from one major surface of the first microelectronic element. The first microelectronic element is electrically interconnected to the second microelectronic element via the conductive posts. The first microelectronic element preferably has an interposer element from which the conductive posts extend. The second microelectronic element is interconnected to the interposer element via contacts on the second microelectronic element via the conductive posts. The so interconnected microelectronic elements have coordinated functionality, such as a programmable logic device wherein one microelectronic element is a field programmable gate array and the other microelectronic element is a memory device.
    Type: Application
    Filed: December 23, 2004
    Publication date: June 29, 2006
    Applicant: Tessera, Inc.
    Inventors: Richard Crisp, Belgacem Haba, Giles Humpston
  • Publication number: 20060108402
    Abstract: A method of forming and applying a solder mass comprised of depositing solder paste containing a carrier and a solder onto a first substrate, not wettable by said solder; reflowing the solder paste on the first substrate to cause the solder to coalesce into a solder mass; and transferring the solder mass from the first substrate to a second substrate.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 25, 2006
    Applicant: Tessera, Inc.
    Inventors: Richard Crisp, Giles Humpston
  • Publication number: 20060032670
    Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.
    Type: Application
    Filed: August 13, 2004
    Publication date: February 16, 2006
    Applicant: Tessera, Inc.
    Inventors: Belgacem Haba, Masud Beroz, David Tuckerman, Giles Humpston, Richard Crisp
  • Publication number: 20050139984
    Abstract: According to one aspect of the invention, a capped chip is provided which includes a chip having a front surface, a back surface opposite the front surface and a plurality of bond pads exposed at at least one of the front and back surfaces. A cap is joined to the chip, the cap overlying one of the front and back surfaces of the chip. The cap includes a plurality of contacts which are conductively interconnected to the bond pads, and one or more temporary ties which conductively connect two or more of the contacts. The temporary ties are severable after the contacts are conductively interconnected to the bond pads.
    Type: Application
    Filed: December 17, 2004
    Publication date: June 30, 2005
    Applicant: Tessera, Inc.
    Inventors: David Tuckerman, Richard Crisp, Belgacem Haba, Giles Humpston, Jae Park
  • Patent number: D446518
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: August 14, 2001
    Assignee: International Business Machines Corporation
    Inventors: Julie Elaine Tierney, Richard Crisp
  • Patent number: D514557
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: February 7, 2006
    Assignee: International Business Machines Corporation
    Inventor: Richard Crisp
  • Patent number: D532418
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: November 21, 2006
    Assignee: Interantional Business Machines Corporation
    Inventor: Richard Crisp
  • Patent number: D558321
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: December 25, 2007
    Assignee: Dell Products L.P.
    Inventors: Paul Kramer, Richard Crisp, Vincent Lam
  • Patent number: D566119
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: April 8, 2008
    Assignee: Dell Products L.P.
    Inventors: Timothy C. Dearborn, Glen Clifton, Richard Crisp, Scott Lauffer, Timothy Uys
  • Patent number: D566120
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: April 8, 2008
    Assignee: Dell Products L.P.
    Inventors: Timothy C. Dearborn, Glen Clifton, Richard Crisp, Scott Lauffer, Timothy Uys
  • Patent number: D573987
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: July 29, 2008
    Assignee: Dell Products L.P.
    Inventors: Timothy C. Dearborn, Scott Lauffer, Richard Crisp