Abstract: A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.

Abstract: A memory cell array comprises a two dimensional array of memory cells fabricated on a semiconductor substrate. The memory cells are arranged in a plurality of rows and a plurality columns. Each column of memory cells comprising a plurality of alternating channel regions and source/drain regions. A conductive interconnect is positioned above each source/drain region and coupled to only one other source/drain region. The one other source/drain region is in a second column that is adjacent to the column. The conductive interconnects are positioned such that every other conductive interconnect connects to the adjacent column to a right side of the column and every other conductive interconnect connects to adjacent column to the left side of the column. A plurality of source/drain control lines extends between adjacent columns of memory cells and electrically couples to each conductive interconnect that couples between the adjacent columns.

Abstract: A method and system for improving short channel effect on a floating gate device is disclosed. In one embodiment, a p-type implant is applied to a source side of the floating gate device. In addition, the present embodiment applies a p-type implant to a drain side of the floating gate device. The p-type implant to the drain side is performed at a different angle than the p-type implant to the source side. The p-type implant to the drain side is implanted to a greater depth than that of the p-type implant to the source side.

Abstract: Methods of forming flash memory EEPROM devices having lightly doped source region near the critical gate region and a heavily doped source region away from the critical gate region. In a first embodiment a first source mask is formed exposing source regions and portions of the gates and implanting n dopant ions, replacing the first source mask with a second source mask that exposes a portion of the source regions and implanting n+ dopant ions. In a second embodiment a source mask is formed exposing a portion of the source regions and implanting n+ dopant ions.

Abstract: In programming the threshold voltage of a memory cell transistor having a substrate, a gate insulator on the substrate, a floating gate on the gate insulator, an insulating layer on the floating gate, and a control gate on the insulating layer, and a source and drain in the substrate, a voltage difference is applied between the drain and source of the transistor and negative voltage is applied to the substrate of the transistor. An increasing voltage is applied to the control gate of the transistor, and, during application of that increasing voltage, a succession of verification tests are undertaken at a corresponding succession of times separated by chosen time intervals to verify if the transistor has been programmed to a chosen threshold voltage.

Abstract: According to one exemplary embodiment, a method for fabricating a floating gate memory array comprises a step of removing a dielectric material from an isolation region situated in a substrate to expose a trench, where the trench is situated between a first source region and a second source region, where the trench defines sidewalls in the substrate. The method further comprises implanting an N type dopant in the first source region, the second source region, and the sidewalls of the trench, where the N type dopant forms an N+ type region. The method further comprises implanting a P type dopant in the first source region, the second source region, and the sidewalls of the trench, where the P type dopant forms a P type region, and where the P type region is situated underneath the N+ type region.

Abstract: The present memory includes a plurality of transistors laid out in a number of rows and columns. First and second series-connected transistors are included in a first column, and are connected between first and second bit lines and are respectively associated with first and second word lines. A region between the series-connected first and second transistors is connected to a first bit line. Third and fourth series-connected transistors are included in a second column, and are connected between the second bit line and a third bit line and are respectively associated with third and fourth word lines. A region between the series-connected third and fourth transistors is connected to a second bit line. The first, second, third and fourth transistors are respective parts of first, second, third and fourth rows of transistors.

Abstract: In the present method of programming a selected flash EEPROM memory cell of a pair thereof in series, a positive voltage is applied to the drain of the selected cell to be programmed, a voltage lower than the voltage applied to the drain is applied to the source of the selected cell, a negative voltage is applied to the substrate, and a positive voltage is applied to the control gate sufficient to induce hot electron injection from the drain to the floating gate of the selected cell.

Abstract: In a memory device, a substrate has a plurality of source/drain regions in the substrate. Between the source/drain regions are trenches filled with oxide. Individual bit lines in the form of conductive regions are provided in the substrate, each bit line being under and running along the oxide in a trench. Each bit line connects to source/drain regions by means of connecting conductive regions extending from that bit line to source/drain regions.

Abstract: One aspect of the invention relates to a virtual ground array floating gate flash memory device with salicided buried bit lines. The bit lines are implanted and salicided after formation of memory cell stacks, but before formation of word lines. The salicide can form over control gates for the memory cells and can contact a third poly layer from which the word lines are patterned. According to another aspect of the invention, an interpoly dielectric coats the sides of the floating gates and significantly improves the capacitance between the floating gate and the memory cell channel. The present invention provides very compact and reliable non-volatile memory.

Abstract: In a memory array, a plurality of sectors are included. Each sector includes a plurality of parallel bit lines which lie in a plane. Sector connecting lines connect the sectors. These sector connecting lines are parallel to each other and to the bit lines. The sector connecting lines include a first set of sector connecting lines which lie in a plane parallel to and adjacent and spaced from the plane of the bit lines, and a second set of sector connecting lines which lie in a plane parallel to and adjacent and spaced from the plane of the first set of sector connecting lines. When viewed across the sector, consecutive sector connecting lines lie in the two different planes thereof in alternating manner, i.e., the sector connecting lines are in a staggered relation.

Abstract: In a method of reading a memory cell of a memory cell array, electrical potentials are applied to a conductive structure connected to the drain, a conductive structure connected to the source, and the gate of the transistor of a cell to be read. Electrical potential are also applied to a conductive structure connected to the drain, a conductive structure connected to the source, and the gate of the transistor of a reference cell, providing current through the reference cell. The level of resistance to current through the reference cell is chosen by selecting the level of resistance in the conductive structure connected to the source of the transistor of the reference cell.

Abstract: A memory array includes a plurality of sets of transistors, each set including a pair of transistors in series. Each such pair of transistors is connected between a pair of adjacent bit lines. Each of the pair of transistors in each set is associated with a different one of an adjacent pair of word lines. The array is configured by providing substantially strait elongated source/drain regions in side-by-side, parallel relation. Each bit line has a zigzag configuration and connects to a pair of adjacent source/drain regions in alternating manner along the bit line length.

Abstract: The invention relates to a flash memory devices and a method associated therewith in which combined source/drain regions are shared by more than two memory cells. For example, source/drain regions can be shared by four adjacent memory cells. Such sharing can be accomplished by providing memory cells along main branches of word lines and additional memory cells along dead end branches extending off the main branches. Another aspect of the invention relates to a flash memory device wherein the memory cells are arrayed and a first portion of the memory cells are read with source and drain regions sharing a row of the array and a second portion of the memory cells are read with source and drain regions sharing a column of the array.

Abstract: A method of forming flash memory EEPROM devices having a low energy source implant and a high-energy VSS connection implant such that the intrinsic source defect density is reduced and the VSs resistance is low. The source regions are implanted with a low energy, low dosage dopant ions and the VSS regions are implanted with a high energy, high dosage dopant ions.

Abstract: A flash memory array is disclosed. The memory array includes multiple memory cells, each cell having a source, a drain, a floating gate and a control gate organized in rows and columns. In addition the array includes wordlines connecting the control gates of memory cells in a row, bitlines connecting the drains of memory cells in a column, source lines connecting the sources of memory cells in a row and a terminal line connecting the source lines to a source voltage supply. Moreover, the array includes conductive lines connecting the source lines, where each source in each cell in a row of memory cells is coupled to a source coupled resistor, and each source coupled resistor is coupled to the source coupled resistor of an adjacent cell through a separate resistor.

Abstract: A flash electrically eraseable programmable read only memory (EEPROM) includes a plurality of flash memory cells formed on a semiconductor substrate, the plurality of memory cells being arranged in a matrix of m rows and n columns. The memory cells in each column are connected in series and include a drain coupled to a common bit line. In addition, the EEPROM includes a plurality of trenches formed in the semiconductor substrate, each of the plurality of trenches being formed between a corresponding pair of the n columns of memory cells. Moreover, the EEPROM includes a plurality of transistors formed at least in part in a corresponding sidewall of the plurality of trenches, each of the plurality of transistors connecting a source of a corresponding one of the memory cells to a Vss supply voltage.

Abstract: A method of forming flash memory EEPROM devices having a low energy source implant and a high-energy VSS connection implant such that the intrinsic source defect density is reduced and the VSs resistance is low. The source regions are implanted with a low energy, low dosage dopant ions and the VSS regions are implanted with a high energy, high dosage dopant ions.

Abstract: Methods of programming and soft programming short channel NOR flash memory cells that reduce the programming currents and column leakages during both programming and soft programming while maintaining fast programming speeds. During programming, a voltage of between 7 and 10 volts is applied to the control gate, a voltage of between 4 and 6 volts; is applied to the drain, a voltage of between 0.5 and 2.0 volts is applied to the source and a voltage of between minus 2 and minus 0.5 volts is applied to the substrate of the selected cell to be programmed. During soft programming, a voltage of between 0.5 and 4.5 volts is applied to the control gates, between 4 and 5.5 volts is applied to the drains, between 0.5 and 2 volts is applied to the sources and between minus 2.0 and minus 0.5 volts is applied to the substrates of the memory cells.

Abstract: A source resistor or a positive voltage is coupled to the source and a negative bias voltage is applied at the substrate or p-well of flash memory cells for enhanced efficiency during programming and/or during an APDE (Automatic Program Disturb after Erase) process for a flash memory device. Furthermore, in a system and method for programming the flash memory device, a flash memory cell of the array of multiple flash memory cells is selected to be programmed. A control gate programming voltage is applied to the control gate of the selected flash memory cell, and a bit line programming voltage is applied to the drain of the selected flash memory cell via the common bit line terminal to which the drain of the selected flash memory cell is connected.