Patents by Inventor Richard Hamilton

Richard Hamilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive foil based metallization of solar cells
    Patent number: 10115855
    Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 30, 2018
    Assignee: SunPower Corporation
    Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse
  • COATED FOIL-BASED METALLIZATION OF SOLAR CELLS
    Publication number: 20180286991
    Abstract: Coated foil-based approaches for metallization of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate. A semiconductor region is disposed in or above the substrate. A conductive contact structure is disposed on and is in electrical contact with the semiconductor region. The conductive contact structure includes a metal foil portion having a first side facing the semiconductor region, and a second side opposite the first side. The second side of the metal foil portion is at least partially coated with an etch-resistant insulating film.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: Paul Loscutoff, Richard Hamilton Sewell
  • WIRE-BASED METALLIZATION FOR SOLAR CELLS
    Publication number: 20180286994
    Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 4, 2018
    Inventors: RICHARD HAMILTON SEWELL, ROBERT WOEHL, JENS DIRK MOSCHNER, NILS-PETER HARDER
  • Foil-based metallization of solar cells
    Patent number: 10090421
    Abstract: Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. In an example, a solar cell includes a substrate. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the substrate. A conductive contact structure is disposed above the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal seed material regions providing a metal seed material region disposed on each of the alternating N-type and P-type semiconductor regions. A metal foil is disposed on the plurality of metal seed material regions, the metal foil having anodized portions isolating metal regions of the metal foil corresponding to the alternating N-type and P-type semiconductor regions.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: October 2, 2018
    Assignees: SunPower Corporation, Total Marketing Services
    Inventors: Gabriel Harley, Taeseok Kim, Richard Hamilton Sewell, Michael Morse, David D. Smith, Matthieu Moors, Jens-Dirk Moschner
  • Metallization of conductive wires for solar cells
    Patent number: 10084098
    Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: September 25, 2018
    Assignees: SunPower Corporation, Total Marketing Services and Total Energies Nouvelles Activities USA
    Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder, Douglas Rose
  • Firing metal with support
    Patent number: 10056506
    Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a paste, a first metal, and a first conductive portion that includes a conductive alloy formed from the first metal at an interface of the substrate and the semiconductor region.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: August 21, 2018
    Assignees: SunPower Corporation, Total Marketing Services
    Inventors: Richard Hamilton Sewell, Paul Loscutoff, Michel Arsène Olivier Ngamo Toko
  • THERMO-COMPRESSION BONDING TOOL WITH HIGH TEMPERATURE ELASTIC ELEMENT
    Publication number: 20180229488
    Abstract: A thermo-compression bonding tool with a high temperature elastic element, and methods of bonding a metal sheet to a substrate using a thermo-compression bonding tool are described. In an example, a system for bonding a metal sheet to a substrate includes a stage to support the substrate and an elastic roller located above the stage. The elastic roller includes a high temperature material. The system also includes a heated backing plate located above the elastic roller. The backing plate is configured to apply pressure and heat to the elastic roller as the elastic roller rolls across a metal sheet disposed above the substrate.
    Type: Application
    Filed: April 12, 2018
    Publication date: August 16, 2018
    Inventors: RICHARD HAMILTON SEWELL, THOMAS P. PASS
  • Thermo-compression bonding tool with high temperature elastic element
    Patent number: 9944055
    Abstract: A thermo-compression bonding tool with a high temperature elastic element, and methods of bonding a metal sheet to a substrate using a thermo-compression bonding tool are described. In an example, a system for bonding a metal sheet to a substrate includes a stage to support the substrate and an elastic roller located above the stage. The elastic roller includes a high temperature material. The system also includes a heated backing plate located above the elastic roller. The backing plate is configured to apply pressure and heat to the elastic roller as the elastic roller rolls across a metal sheet disposed above the substrate.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 17, 2018
    Assignee: SunPower Corporation
    Inventors: Richard Hamilton Sewell, Thomas Pass
  • SOLAR CELL INTERCONNECTION
    Publication number: 20180102453
    Abstract: A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.
    Type: Application
    Filed: December 7, 2017
    Publication date: April 12, 2018
    Inventors: Thomas P. Pass, Gabriel Harley, David Fredic Joel Kavulak, Richard Hamilton Sewell
  • METALLIZATION OF CONDUCTIVE WIRES FOR SOLAR CELLS
    Publication number: 20180097125
    Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include placing conductive wires in a wire guide, where conductive wires are placed over a first semiconductor substrate having first doped regions and second doped regions. The method can include aligning the conductive wires over the first and second doped regions, where the wire guide aligns the conductive wires substantially parallel to the first and second doped regions. The method can include bonding the conductive wires to the first and second doped regions. The bonding can include applying a mechanical force to the semiconductor substrate via a roller or bonding head of the wire guide, where the wire guide inhibits lateral movement of the conductive wires during the bonding.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse, Nils-Peter Harder
  • CONDUCTIVE FOIL BASED METALLIZATION OF SOLAR CELLS
    Publication number: 20180097141
    Abstract: Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Richard Hamilton Sewell, David Aaron Randolph Barkhouse
  • Wire-based metallization for solar cells
    Patent number: 9935213
    Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.
    Type: Grant
    Filed: June 26, 2015
    Date of Patent: April 3, 2018
    Assignees: SunPower Corporation, Total Marketing Services
    Inventors: Richard Hamilton Sewell, Robert Woehl, Jens Dirk Moschner, Nils-Peter Harder
  • BOLT ACTION UPPER RECEIVER FOR AR RIFLE
    Publication number: 20180045476
    Abstract: A bolt action AR rifle can be prepared using a standard AR lower assembly and coupling it to a bolt action upper assembly. The bolt action upper assembly has a bolt action receiver containing a bolt. The method of forming a bolt action AR rifle can include: providing the bolt action upper receiver assembly; providing the standard AR lower AR receiver assembly having a pivot pin and takedown pin; inserting the pivot pin into the pivot pin receiver hole; pivoting the bolt action upper receiver assembly at the pivot pin until the takedown pin is aligned with the takedown pin receiver hole; and inserting the takedown pin into the takedown pin receiver hole.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 15, 2018
    Inventor: Richard Hamilton
  • BONDS FOR SOLAR CELL METALLIZATION
    Publication number: 20180019364
    Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
    Type: Application
    Filed: September 27, 2017
    Publication date: January 18, 2018
    Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
  • Solar cell interconnection
    Patent number: 9865759
    Abstract: A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: January 9, 2018
    Assignee: SunPower Corporation
    Inventors: Thomas P. Pass, Gabriel Harley, David Fredric Joel Kavulak, Richard Hamilton Sewell
  • MULTI-AXIS FLATTENING TOOL AND METHOD
    Publication number: 20180005855
    Abstract: A multi-axis flattening tool and method are described. In an example, the multi-axis flattening tool includes a support structure to constrain a bowed wafer along a support perimeter, and a pair of flattening structures independently movable relative to the support structure. For example, a first flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a first plane, and a second flattening structure may grip the wafer within the support perimeter and move axially relative to the support structure to bend the wafer about a second plane orthogonal to the first plane. The multi-axis bending of the wafer may flatten the wafer.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 4, 2018
    Inventor: Richard Hamilton Sewell
  • Die-cutting approaches for foil-based metallization of solar cells
    Patent number: 9831377
    Abstract: Die-cutting approaches for foil-based metallization of solar cells, and the resulting solar cells are disclosed herein. Die-cutting approaches for foil-based metallization of solar cells include forming a plurality of semiconductor regions in or above a substrate and forming a patterned damage buffer in alignment with locations between the plurality of semiconductor regions. Additionally, a metal layer comprising a metal seed layer and/or metal foil is formed over the patterned damage buffer. The metal layer is cut by a cutting die at locations between the plurality of semiconductor regions by applying a mechanical force to the cutting die.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: November 28, 2017
    Assignee: SunPower Corporation
    Inventors: Richard Hamilton Sewell, Benjamin Ian Hsia
  • ROLL-TO-ROLL METALLIZATION OF SOLAR CELLS
    Publication number: 20170330993
    Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 16, 2017
    Inventors: Richard Hamilton Sewell, Gabriela Elena Bunea
  • Bonds for solar cell metallization
    Patent number: 9818903
    Abstract: A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: November 14, 2017
    Assignees: SunPower Corporation, Total Marketing Services
    Inventors: Richard Hamilton Sewell, Michel Arsène Olivier Nagamo Toko, Matthieu Moors, Jens Dirk Moschner
  • THERMOCOMPRESSION BONDING APPROACHES FOR FOIL-BASED METALLIZATION OF NON-METAL SURFACES OF SOLAR CELLS
    Publication number: 20170288072
    Abstract: Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Richard Hamilton Sewell, Gabriel Harley, Nils-Peter Harder