Patents by Inventor Richard Hart

Richard Hart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11753179
    Abstract: A ramjet including: a combustion area having an air inlet and an exhaust outlet; and a fuel cell in fluid communication with the air inlet and a fuel supply of the ramjet, wherein the fuel cell is in thermal communication with the combustion area.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: September 12, 2023
    Assignee: General Electric Company
    Inventors: Andrew Wickersham, Richard Hart
  • Patent number: 11535811
    Abstract: A system for recovering gel-mass from a gel-mass-containing waste material. The system includes mangle rolls, a heated accumulator for receiving and melting the gel-mass-containing waste material to provide an oil phase and a non-oil phase; a pumping system; an optional mixer; and a control system.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: December 27, 2022
    Assignee: R.P. Scherer Technologies, LLC
    Inventors: Lester David Fulper, Werner Stange, Norton Richard Hart, Shawn P. McKee, Neftali Tosado
  • Patent number: 11346599
    Abstract: Example systems have a defrost system that can receive a first RF signal at a first frequency to defrost a load. An air treatment device can receive a second RF signal at a second frequency and perform an air treatment process. An RF signal source has a power output, and a switching arrangement selectively electrically connects the defrost system and the first air treatment device to the power output of the RF signal source. A controller can electrically connect one of the defrost system and the first air treatment device to the power output of the RF signal source. When the defrost system is electrically connected, the RF signal source outputs the first RF signal at the first frequency, and when the first air treatment device is electrically connected, the RF signal source outputs the second RF signal at the second frequency.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: May 31, 2022
    Assignee: NXP USA, Inc.
    Inventors: Pierre Marie Jean Piel, Lionel Mongin, Paul Richard Hart
  • Publication number: 20220111974
    Abstract: A ramjet including: a combustion area having an air inlet and an exhaust outlet; and a fuel cell in fluid communication with the air inlet and a fuel supply of the ramjet, wherein the fuel cell is in thermal communication with the combustion area.
    Type: Application
    Filed: October 14, 2020
    Publication date: April 14, 2022
    Inventors: Andrew Wickersham, Richard Hart
  • Patent number: 11291216
    Abstract: The invention relates to an oil-and-water emulsion comprising an aqueous phase and an oil phase, said emulsion containing: —15-40 wt. % water; —30-60 wt. % oil; —1.5-18 wt. % of cyclodextrin selected from alpha-cyclodextrin, beta-cyclodextrin and combinations thereof; —12-50 wt. % of saccharides selected from monosaccharides, disaccharides, non-cyclic oligosaccharides, sugar alcohols and combinations thereof. The emulsions according to the present invention are highly stable under ambient conditions, can easily be used as a base for the manufacture of a variety of icings, fillings and toppings. These base emulsions can suitably be aerated (creamed) to produce a creamed icing or filling, or a whipped topping that has excellent ambient temperature stability.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: April 5, 2022
    Assignee: BRILL, INC.
    Inventors: William Michael Hesler, Orelia Elizabeth Dann, Andrew Richard Hart
  • Publication number: 20210171294
    Abstract: A detachable, self-contained robotic arm system includes: a mounting subsystem configured to releasable engage an operating platform; a robotic arm subsystem coupled to the mounting subsystem; a control subsystem coupled to the mounting subsystem and configured to effectuate movement of the robotic arm assembly; and a connectivity subsystem configured to detachably couple the detachable, self-contained robotic arm system to one or more external systems.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 10, 2021
    Inventors: Brian Hart, Martin Cosgrove, James Dowling, Richard Hart, Ryan Mulley, Jonathan Roche
  • Patent number: 11026865
    Abstract: A method of drying soft capsules including steps of: a) supplying a flow of air to said soft capsules at a velocity of the air across the soft capsules of from about 0.15 m/s to about 13 m/s; b) increasing, over time, a drying temperature to which said soft capsules are exposed while ensuring that the drying temperature remains below a melting temperature of a capsule shell of the soft capsules; c) exposing said soft capsules to an initial relative humidity of from about 49% RH to about 79% RH; d) decreasing the relative humidity to which the soft capsules are exposed as the capsules dry until an equilibrium relative humidity of the soft capsules reaches a desired relative humidity; and e) exposing the soft capsules from step d) to a temperature of from 20-25° C. Also disclosed is a drying system for carrying out the method.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: June 8, 2021
    Assignee: R.P. Scherer Technologies, LLC
    Inventors: Norton Richard Hart, Lester David Fulper
  • Patent number: 10806021
    Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 13, 2020
    Assignee: NXP USA, Inc.
    Inventors: Lakshminarayan Viswanathan, Lu Li, Mahesh K. Shah, Paul Richard Hart
  • Publication number: 20200224960
    Abstract: Example systems have a defrost system that can receive a first RF signal at a first frequency to defrost a load. An air treatment device can receive a second RF signal at a second frequency and perform an air treatment process. An RF signal source has a power output, and a switching arrangement selectively electrically connects the defrost system and the first air treatment device to the power output of the RF signal source. A controller can electrically connect one of the defrost system and the first air treatment device to the power output of the RF signal source. When the defrost system is electrically connected, the RF signal source outputs the first RF signal at the first frequency, and when the first air treatment device is electrically connected, the RF signal source outputs the second RF signal at the second frequency.
    Type: Application
    Filed: March 25, 2020
    Publication date: July 16, 2020
    Inventors: Pierre Marie Jean PIEL, Lionel MONGIN, Paul Richard HART
  • Patent number: 10648728
    Abstract: Example systems have a defrost system that can receive a first RF signal at a first frequency to defrost a load. An air treatment device can receive a second RF signal at a second frequency and perform an air treatment process. An RF signal source has a power output, and a switching arrangement selectively electrically connects the defrost system and the first air treatment device to the power output of the RF signal source. A controller can electrically connect one of the defrost system and the first air treatment device to the power output of the RF signal source. When the defrost system is electrically connected, the RF signal source outputs the first RF signal at the first frequency, and when the first air treatment device is electrically connected, the RF signal source outputs the second RF signal at the second frequency.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 12, 2020
    Assignee: NXP USA, Inc.
    Inventors: Pierre Marie Jean Piel, Lionel Mongin, Paul Richard Hart
  • Patent number: 10595890
    Abstract: A minimally invasive laparoscopic tissue removal device, namely a morcellator. The device includes, from proximal end to distal end, a handle, handle guard, elongate sheath, and mouth, finally terminating in a safety tip. The elongate sheath and mouth are concentric, such that two elongate, rotating cutting/shredding blades/teeth and one elongate auger feed screw can be positioned along the length of the sheath and mouth. The teeth are opposingly disposed and staggered, such that contact with tissue mass grabs and pulls tissue inwards toward the auger, which transports the tissue proximally toward the outside of the patient's body. A motor unit and gear assembly can be coupled to the teeth and auger to drive rotation of the teeth and auger. A cup assembly can be disposed in overlying relation to the mouth for guiding the tissue mass towards the mouth. Various mechanisms of safely covering the mouth are contemplated as well.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: March 24, 2020
    Assignee: University of South Florida
    Inventors: Stuart Richard Hart, Erik James Esinhart, Adam Thomas Lytle, Daniel Ryan Kamsler, Charles William Drake, III, Yasin Ahamed Junaideen, Mario Alves Simoes
  • Patent number: 10593035
    Abstract: A system and methodology for the automated localization, extraction, and analysis of MRI-based features with clinical information to improve the diagnosis of pelvic organ prolapse (POP). The system can automatically identify reference points for pelvic floor measurements on MRI rapidly and consistent. It provides a prediction model that analyzes the correlation between current and new MRI-based features with clinical information to differentiate patients with and without POP. This system will enable the high throughput analysis of MR images for their correlation with clinical information to better detect POP. The presented system can also be applied to the automated localization and extraction of MRI features for the diagnosis of other diseases where clinical examination is not adequate.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 17, 2020
    Assignee: University of South Florida
    Inventors: Sinan Onal, Susana Karina Lai-Yuen, Alfredo Weitzenfeld, Stuart Richard Hart
  • Publication number: 20200069525
    Abstract: A method of drying soft capsules including steps of: a) supplying a flow of air to said soft capsules at a velocity of the air across the soft capsules of from about 0.15 m/s to about 13 m/s; b) increasing, over time, a drying temperature to which said soft capsules are exposed while ensuring that the drying temperature remains below a melting temperature of a capsule shell of the soft capsules; c) exposing said soft capsules to an initial relative humidity of from about 49% RH to about 79% RH; d) decreasing the relative humidity to which the soft capsules are exposed as the capsules dry until an equilibrium relative humidity of the soft capsules reaches a desired relative humidity; and e) exposing the soft capsules from step d) to a temperature of from 20-25° C. Also disclosed is a drying system for carrying out the method.
    Type: Application
    Filed: December 8, 2017
    Publication date: March 5, 2020
    Applicant: R.P. Scherer Technologies, LLC
    Inventors: Norton Richard Hart, Lester David Fulper
  • Publication number: 20200017797
    Abstract: A system for recovering gel-mass from a gel-mass-containing waste material. The system includes mangle rolls, a heated accumulator for receiving and melting the gel-mass-containing waste material to provide an oil phase and a non-oil phase; a pumping system; an optional mixer; and a control system.
    Type: Application
    Filed: September 26, 2019
    Publication date: January 16, 2020
    Applicant: R.P. Scherer Technologies, LLC
    Inventors: Lester David Fulper, Werner Stange, Norton Richard Hart, Shawn P. McKee, Neftali Tosado
  • Patent number: 10517642
    Abstract: A laparoscopic device with obturator. The device facilitates extraction of specimens from a female subject's abdominal cavity through the subject's vagina by also facilitating the suturing of a mesh to the anterior and posterior walls of the subject's vagina. The device includes an elongate sheath that has a flat surface on the front, a curved shape on the back, and an inner port opening formed within the flat surface, where the port opening that enables introduction of instruments or removal of specimens from the peritoneal cavity. An internal obturator can be inserted into the sheath to reduce the size of the port opening into the peritoneal cavity, or can be used to close the inner port opening into the peritoneal cavity. The obturator and sheath can be utilized as firm surfaces against which a user can suture a sacrocolpopexy mesh to the anterior and posteriors vaginal walls.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: December 31, 2019
    Assignee: University of South Florida
    Inventors: Stuart Richard Hart, Mario Alves Simoes, Mark Antoine Zakaria
  • Publication number: 20190342988
    Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Lakshminarayan Viswanathan, Lu Li, Mahesh K. Shah, Paul Richard Hart
  • Patent number: 10465143
    Abstract: A process and system for recovering gel-mass from a gel-mass-containing waste material. The process comprises retrieving the gel-mass-containing waste material from an encapsulation process; melting the retrieved waste material to provide an oil phase and a non-oil phase; retrieving the non-oil phase to produce a recovered gel-mass; and recycling the recovered gel-mass for combination with fresh encapsulating material to provide a combined encapsulating material for use in encapsulating a same lot of the same product which was being encapsulated in the step that produced the gel-mass-containing waste material from which the gel-mass was obtained. The system comprises a heated accumulator for receiving and melting the gel-mass-containing waste material to provide an oil phase and a non-oil phase; a pumping system; an optional mixer; and a control system.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: November 5, 2019
    Assignee: R.P. Scherer Technologies, LLC
    Inventors: Lester David Fulper, Werner Stange, Norton Richard Hart, Shawn P. McKee, Neftali Tosado
  • Publication number: 20190328025
    Abstract: The invention relates to an oil-in-water (O/W) emulsions that can be aerated to produce foamed emulsions. More particularly, the present invention relates to an aeratable or aerated O/W emulsion comprising a continuous aqueous phase and a dispersed oil phase, said emulsion containing: —25-55 wt. % water; —4-50 wt. % oil; —3-12 wt. % of cyclodextrin selected from alpha-cyclodextrin, beta-cyclodextrin and combinations thereof; —20-60 wt. % of saccharides selected from monosaccharides, disaccharides, non-cyclic oligosaccharides, sugar alcohols and combinations thereof; —1-20 wt. % of polysaccharides; —0-30 wt. % of other edible ingredients; wherein the saccharides are contained in the emulsion in a concentration of at least 60% by weight of water and wherein the polysaccharides are contained in the emulsion in a concentration at least 2% by weight of water. The O/W emulsions of the present invention are capable of forming foamed emulsions with high firmness and excellent shape retaining properties.
    Type: Application
    Filed: August 3, 2017
    Publication date: October 31, 2019
    Applicant: CSM Bakery Solutions Europe Holding B.V.
    Inventors: William Michael HESLER, Orelia Elizabeth DANN, Andrew Richard HART
  • Patent number: 10405417
    Abstract: A packaged microelectronic component includes a substrate and a semiconductor die coupled to a top surface of the substrate. A method of attaching the packaged microelectronic component to a secondary structure entails applying a metal particle-containing material to at least one of a bottom surface of the substrate and a mounting surface of the secondary structure. The packaged microelectronic component and the secondary structure are arranged in a stacked relationship with the metal particle-containing material disposed between the bottom surface and the mounting surface. A low temperature sintering process is performed at a maximum process temperature less than a melt point of the metal particles to transform the metal particle-containing material into a sintered bond layer joining the packaged microelectronic component and the secondary structure. In an embodiment, the substrate may be a heat sink for the packaged microelectronic component and the secondary structure may be a printed circuit board.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 3, 2019
    Assignee: NXP USA, Inc.
    Inventors: Lakshminarayan Viswanathan, Lu Li, Mahesh K. Shah, Paul Richard Hart
  • Patent number: 10382311
    Abstract: The disclosure is directed to benchmarking a server computer (“server”), e.g., a storage system of the server. The process can benchmark a candidate server using data from a production server that is handling live traffic of an application, e.g., a social networking application. The process includes collecting, from the production server, production data that is indicative of a workload of the production server, and generating a benchmark program using the production data. Upon execution of the benchmark program, the candidate server is made to process a workload generated based on the production data. The benchmark program records the performance of the candidate server, which is indicative of a performance of the candidate server in processing a workload similar to the production data. The performance results can be used in determining whether to upgrade the configuration of the production server to that of the candidate server, e.g., to improve performance.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: August 13, 2019
    Assignee: Facebook, Inc.
    Inventors: Steven Richard Hart, Jiaxin Lu, Darryl Edward Gardner, Zhanhai Qin