Abstract: Example portable grills including a base having supports for storing removable side tables are disclosed. An example portable grill includes a cookbox, a base, and a side table. The base is coupled to the cookbox. The base is configured to support the cookbox above an underlying surface onto which the base is to be placed. The side table is configured to be removably coupled to the base in a storage position. The side table is to be located beneath the cookbox when the side table is coupled to the base in the storage position.

Abstract: Example portable grills having reversible steam tray assemblies are disclosed. An example portable grill includes a cookbox, a heating element, a water pan, and a steam tray. The heating element is located within the cookbox. The water pan is located within the cookbox above the heating element. The water pan includes a bottom wall. The steam tray is located within the water pan. The steam tray includes a horizontally-oriented support wall having a plurality of openings extending therethrough. The steam tray is configured to be reversibly positioned within the water pan in a first orientation and a second orientation. The support wall is spaced from the bottom wall by a first distance when the steam tray is positioned in the first orientation. The support wall is spaced from the bottom wall by a second distance greater than the first distance when the steam tray is positioned in the second orientation.

Abstract: The disclosure provides for an oral composition, the oral composition including at least one active agent, at least one filler component, and water in an amount sufficient such that the oral composition has a total moisture content of about 15% to about 30% by weight or greater based on the total weight of the oral composition.

Abstract: The disclosure provides for an oral composition, the oral composition including at least one active agent, at least one filler component, and water in an amount sufficient such that the oral composition has a total moisture content of about 15% to about 30% by weight or greater based on the total weight of the oral composition.

Abstract: The disclosure provides for an oral composition, the oral composition including at least one active agent, at least one filler component, and water in an amount sufficient such that the oral composition has a total moisture content of about 15% to about 30% by weight or greater based on the total weight of the oral composition.

Abstract: A smokeless tobacco composition that contains bleached tobacco material in which at least 50% by weight of the bleached tobacco material has a particle size of from about 1 mm to about 50 mm.

Abstract: The disclosure provides compositions and products configured for oral use. For example, a composition is provided that includes a foam containing a lipid and an active agent and/or a flavorant, and a carrier, wherein the foam is adsorbed onto the carrier. Such a foam can be incorporated, e.g., within lozenges and/or pouched oral products. The disclosure further provides an oral product (e.g., a lozenge and/or pouched oral product) including an encapsulated agent, wherein the encapsulated agent is a porous bead with an exterior portion and an interior portion containing a lipid and an active agent and/or a flavorant.

Abstract: The disclosure provides for an oral composition, the oral composition including at least one active agent, at least one filler component, and water in an amount sufficient such that the oral composition has a total moisture content of about 15% to about 30% by weight or greater based on the total weight of the oral composition.

Abstract: The disclosure provides compositions and products configured for oral use. For example, a composition is provided that includes a foam containing a lipid and an active agent and/or a flavorant, and a carrier, wherein the foam is adsorbed onto the carrier. Such a foam can be incorporated, e.g., within lozenges and/or pouched oral products. The disclosure further provides an oral product (e.g., a lozenge and/or pouched oral product) including an encapsulated agent, wherein the encapsulated agent is a porous bead with an exterior portion and an interior portion containing a lipid and an active agent and/or a flavorant.

Abstract: A semiconductor device package includes: a redistribution stack including a dielectric layer defining a first opening; and a redistribution layer (RDL) disposed over the dielectric layer and including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending from the first portion of the first trace, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, the first opening in the dielectric layer has a maximum width along the first transverse direction, and the maximum width of the second portion of the first trace is less than the maximum width of the first opening.

Abstract: A semiconductor device package comprises a bottom electronic device, an interposer module, a top electronic device, and a double sided redistribution layer (RDL) structure. The interposer module includes a plurality of conductive vias. The top electronic device has an active surface and is disposed above the bottom electronic device and above the interposer module. The double sided RDL structure is disposed between the bottom electronic device and the top electronic device. The active surface of the bottom electronic device faces toward the double sided RDL structure. The active surface of the top electronic device faces toward the double sided RDL structure. The double sided RDL structure electrically connects the active surface of the bottom electronic device to the active surface of the top electronic device. The double sided RDL structure electrically connects the active surface of the top electronic device to the interposer module.

Abstract: Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes.

Abstract: A semiconductor device package includes: a redistribution stack including a dielectric layer defining a first opening; and a redistribution layer (RDL) disposed over the dielectric layer and including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending from the first portion of the first trace, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, the first opening in the dielectric layer has a maximum width along the first transverse direction, and the maximum width of the second portion of the first trace is less than the maximum width of the first opening.

Abstract: A method of forming a semiconductor device package includes: (1) providing an electronic device including an active surface and a contact pad adjacent to the active surface; (2) forming a package body encapsulating portions of the electronic device; and (3) forming a redistribution stack, including: forming a dielectric layer over a front surface of the package body, the dielectric layer defining a first opening exposing at least a portion of the contact pad; and forming a redistribution layer (RDL) over the dielectric layer, the RDL including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and

Abstract: A semiconductor device package includes: (1) an electronic device including an active surface and a contact pad adjacent to the active surface; and (2) a redistribution stack including a dielectric layer disposed over the active surface and defining a first opening exposing at least a portion of the contact pad; and a redistribution layer (RDL) disposed over the dielectric layer and including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the sec

Abstract: A semiconductor device package includes: (1) an electronic device including an active surface and a contact pad adjacent to the active surface; and (2) a redistribution stack including a dielectric layer disposed over the active surface and defining a first opening exposing at least a portion of the contact pad; and a redistribution layer (RDL) disposed over the dielectric layer and including a first trace, wherein the first trace includes a first portion extending over the dielectric layer along a first longitudinal direction adjacent to the first opening, and a second portion disposed in the first opening and extending between the first portion of the first trace and the exposed portion of the contact pad, wherein the second portion of the first trace has a maximum width along a first transverse direction orthogonal to the first longitudinal direction, and the maximum width of the second portion of the first trace is no greater than 3 times of a width of the first portion of the first trace, wherein the sec