Abstract: An ethylene oxide sterilization sensor, and method of use, wherein the sensor includes: a heat-shrinkable film; an acid-functional porous sorbent in thermal contact with the heat-shrinkable film; and an acid having a boiling point above 120° C. and a pKa of no greater than 2.5, wherein the acid is impregnated in or covalently attached to the porous sorbent.

Abstract: A hearing-protective earplug (1) with a resilient polymeric foam body (10) and with a grippable stem (110) that includes a forward portion (111) with an annular sleeve (112) that at least partially defines an open-ended, front-facing cavity (114) within which a rearward portion (21) of the resilient polymeric foam body resides.

Abstract: A hearing-protective earplug (1) with a resilient polymeric foam body (10) and with a grippable stem (110) that includes a forward portion (111) with an annular sleeve (112) that at least partially defines an open-ended, front-facing cavity (114) within which a rearward portion (21) of the resilient polymeric foam body resides.

Abstract: A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.

Abstract: The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.

Abstract: A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.

Abstract: A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a layered body including a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body including a substrate to be ground, a joining layer having a curable acrylate polymer and a curable acrylate adhesion modifying agent in contact with the substrate to be ground, a photothermal conversion layer having a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a layered body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body comprising a substrate to be ground, a joining layer including a curable adhesive in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Abstract: A multi-layer label is described. The label includes a polymeric substrate having a print receptive layer on one major surface and a print contrast layer on the opposite major surface. The label also includes both an electrically conductive adhesive and an electrically conductive layer.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Abstract: A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: A modular in-wall medical services unit for medical care facilities. A frame supports a cabinet with a cover panel providing electrical and/or gas outlets. Built-in electrical and gas conduits are included. A junction box and ends of the gas conduits near the top of the frame are accessible after wallboard is applied. Thus, wallboard can be installed before or after wiring is completed and gas connections are made. The self-aligning cover panel is “floatingly” supported on the frame so that a bead of sealant can be applied around the edge before the cover panel is “snugged up” to the wall and secured. The trim flanges on the cover panel include vertical equipment mounting tracks. Manufacturing is simplified by making the height of the frame adjustable; the same frame elements can be used to assemble units for different ceiling heights, decreasing the number of required parts in inventory and expediting assembly.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.