Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: A process for planarizing, polishing, or providing other modification of a wafer surface or other workpiece. The process includes using an abrasive article having a textured abrasive coating affixed to a backing. The abrasive article includes a monitoring element, such as a window, to allow transmission of radiation therethrough. The radiation level is monitored throughout the planarization process to determine the approach of the desired endpoint. The window in the abrasive coating can be an area devoid of abrasive coating or having minimal or a thinned abrasive coating.

Abstract: An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

Abstract: A method of modifying an exposed surface of a semiconductor wafer that includes the steps of:(a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and(b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.

Abstract: An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.

Abstract: The present invention provides an abrasive article that has abrasive composite members secured firmly in recesses in a backing sheet in a precise pattern whereby there is desired lateral spacing between each abrasive composite member. The present invention also provides a method for preparing the abrasive article comprising the steps of providing an embossed backing sheet having a plurality of recesses in the front surface of the backing sheet. The recesses are filled with an abrasive slurry that includes a plurality of abrasive grains dispersed in a binder precursor. An expanding agent is also provided in the recesses, either separate from the slurry or dispersed in the slurry. The expanding agent, when activated, expands the abrasive slurry outward and above the front surface of the embossed backing sheet. After the binder precursor of the abrasive slurry is hardened, individual abrasive composite members extend above the front surface of the embossed backing sheet.