Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.

Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.

Abstract: In a photobiomodulation therapy (PBT) process, defined patterns (e.g., sequences of square-wave pulses, sine waves, or combinations thereof) of electromagnetic radiation (EMR) having one or more wavelengths, or spectral bands of wavelengths, are introduced into a living organism (e.g. a human being or animal) using a distributed system comprising two or more distributed components or “nodes” communicating using a bus or transceiver to send instructions or files between or among the constituent components. The distributed PBT system prevents intentional usurpation of system control (hacking), thwarts unauthorized monitoring of data (surveillance), and reduces the likelihood and severity of accidental system malfunction arising from corrupted command and control packets or ambient EMI.

Abstract: A phototherapy system includes a channel driver, a first microcontroller and a pad comprising a string of light-emitting diodes (LEDs). The pad also comprises a second microcontroller that autonomously controls the string of LEDs such that the LEDs are controlled even if communication between the first microcontroller and the pad is interrupted.

Abstract: The LEDs in a phototherapy LED pad are controlled so that the intensity of the light varies in accordance with a sinusoidal function, thereby eliminating the harmonics that are generated when the LEDs are pulsed digitally, in accordance with a square-wave function. This is accomplished analogically by using a sinusoidal wave to control the gate of a MOSFET connected in series with the LEDs or by using a digital-to-analog converter to control the gate of the MOSFET with a stair step function representative of the values of a sinusoidal function at predetermined intervals. Alternatively, pulse-width modulation is used to control the gate of the MOSFET in such a way that the average current through the LEDs simulates a sinusoidal function. In additional to using a simple sine wave function, the LED current may also be controlled in accordance with “chords” containing multiple sine waves of different frequencies.

Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.

Abstract: A variety of techniques for concealing the content of a communication between a client device, such as a cell phone or laptop, and a network or cloud of media nodes are disclosed. Among the techniques are routing data packets in the communication to different gateway nodes in the cloud, sending the packets over different physical media, such as an Ethernet cable or WiFi channel, and disguising the packets by giving them different source addressees. Also disclosed are a technique for muting certain participants in a conference call and a highly secure method of storing data files.

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.

Abstract: An isolation structure formed in a semiconductor substrate of a first conductivity type includes a region of a second conductivity type opposite to the first conductivity type. The region of the second conductivity type is saucer-shaped and has a floor portion substantially parallel to the top surface of the substrate and a sloped sidewall portion. The sloped sidewall portion extends downward from the top surface of the substrate at an oblique angle and merges with the floor portion. The floor portion and the sloped sidewall portion together form an isolated pocket of the substrate.

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.

Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with as electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die.

Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed, in particular a method of fabricating a package including an exposed die pad.

Abstract: In a flexible LED pad for use in phototherapy treatment of humans or animals, the PCBs in the pad are securely linked together with electrical connectors and ribbon cables to prevent the connections from being broken as the flexible pad is bent or otherwise deformed during the treatment. In one embodiment, low-profile socket connectors are mounted to the PCBs and mate with plug connectors at the ends of the ribbon cables. For similar reasons, the LED pad may be connected to an LED control unit by means of an electrical connector (e.g. a USB socket) mounted to a PCB in the LED pad. The PCBs, on which the LEDs are mounted, are fitted into a downset in the flexible pad to prevent the LEDs from becoming misaligned with openings in the flexible pad.

Abstract: In a secure cloud for transmitting packets of digital data, the packets may be repeatedly scrambled (i.e., their data segments reordered) and then unscrambled, split and then mixed, and/or encrypted and then decrypted as they pass through media nodes in the cloud. The methods used to scramble, split, mix and encrypt the packets may be varied in accordance with a state such as time, thereby making the task of a hacker virtually impossible inasmuch as he or she may be viewing only a fragment of a packet and the methods used to disguise the data are constantly changing.

Abstract: A phototherapy or photobiomodulation process employing the application of electromagnetic radiation (EMR) to a living organism, typically a human being. The EMR is generated by one or more strings of LEDs and is programmed to emit one or more wavelengths, typically in the visible and infrared portions of the spectrum, the EMR in each wavelength being delivered in pulses having specified on-times, off-times, photoexcitation frequencies, duty factors, phase delays, and power amplitudes. A system for providing such EMR includes a microcontroller having a pattern library of algorithms, each of which defines a particular sequence of synthesized pulses, and an application pad, preferably flexible, containing the LED strings.

Abstract: An isolation structure formed in a semiconductor substrate of a first conductivity type includes a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate. A first trench extends downward from a surface of the substrate and overlaps onto the floor isolation region. The first trench includes walls lined with a dielectric material and contains a conductive material. The first trench and the floor isolation region electrically isolate a pocket of the first conductivity type from the substrate.