Abstract: A capacitor, a method for producing a capacitor, and the use of a capacitor of for producing an electric cable, a coaxial cable and/or a resonant heating cable are disclosed. The method may be suitable for mass production of a capacitor, e.g., a cylindrical capacitor. The method may include alternately coating a main member with dielectric and electrically conducting layers using thermal spraying and/or spraying, and then sintering the resulting structure. The resulting capacitor may provide advantageous design variability, e.g., with respect to the capacitance and breakdown voltage, as well as excellent temperature resistance.

Abstract: A capacitor assembly structure may include multiple capacitors, and may be used for an electric cable, a coaxial cable, and/or a resonant heat output, for example. Accordingly, a capacitor device formed by a single cylinder may be replaced by a number of cylindrical capacitors that are electrically connected in parallel and have a smaller diameter, with or without connecting a centrally arranged, large tube which optionally is also in the form of a cylindrical capacitor. Every single cylinder may have the same structure. Further, the single cylinder may be electrically contacted via both end surfaces thereof, and therefore suitable for being integrated in series into a current-carrying electrical conductor, e.g., a cable and/or a conductive tube.

Abstract: A sensor for determining a temperature is provided, having a first insulating layer made of a first dielectric, which layer is arranged between a first and a second conductive layer made of a conductive material, and having a second insulating layer made of a second dielectric, which layer is arranged between the second and a third conductive layer made of a conductive material, wherein the first and the second dielectric have a different temperature dependency of the respective permittivity thereof. A method for determining a temperature by such a sensor is also provided.

Abstract: The embodiments to a method for producing a capacitor, (e.g., a cylindrical capacitor). The method includes: a) providing a main body; b) producing a layer system on the main body, the layer system including at least two electrically conductive layers each layer galvanically separated from the other layer by at least one dielectric layer, the at least one dielectric layer being produced from at least one green film; and c) sintering the layer system. The invention further relates to a capacitor, (e.g., a cylindrical capacitor), including a layer system that has at least two electrically conductive layers each layer galvanically separated from the other layer by at least one dielectric layer made from at least one sintered green film.

Abstract: A method for producing a cast metal piece and a cast metal piece are provided. An information element includes at least one piece of information. The information element is produced from a magnetizable material and the information is deposited n the magnetizable material and is cast into the information element during casting of the price, the casting temperature being above the Curie temperature of the magnetizable material of the information element.

Abstract: A method for manufacturing a monolithic inductive component is provided. The method may include providing a green body comprising a green sheet composite for forming a multilayer ceramic body with an integrated winding and a shaped body of ferritic core material, the green sheet composite being combined with an encapsulation so as to create a cavity with a cavity opening between the encapsulation and the green sheet composite, and the cavity being filled with the ferritic core material through the cavity opening; and heat-treating the green body, a multilayer ceramic body with an integrated winding being created from the green sheet composite and a magnetic core comprising the ferritic core material being created from the green sheet composite.

Abstract: An electronic component module includes at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by the cooling arrangement (23, 33, 43).

Abstract: An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).

Abstract: A method for manufacturing an inductive component which is formed from a plurality of layers, wherein the method comprises the steps of a) arrangement of an electrically conductive material as a winding of the component on a first non-magnetic, dielectric ceramic layer; b) formation of at least one cutout which passes all the way through in the non-magnetic, dielectric ceramic layer; c) arrangement of a first magnetic ceramic layer on an upper face and a second magnetic ceramic layer on a lower face of the non-magnetic, dielectric ceramic layer; and d) carrying out a process step in which at least one of the magnetic ceramic layers is plastically deformed such that contact is made with the two magnetic ceramic layers in the area of the cutout, and the two magnetic ceramic layers form a magnetic core of the component.

Abstract: A method for manufacturing a monolithic inductive component is provided. The method may include providing a green body comprising a green sheet composite for forming a multilayer ceramic body with an integrated winding and a shaped body of terrific core material, the green sheet composite being combined with an encapsulation so as to create a cavity with a cavity opening between the encapsulation and the green sheet composite, and the cavity being filled with the ferritic core material through the cavity opening; and heat-treating the green body, a multilayer ceramic body with an integrated winding being created from the green sheet composite and a magnetic core comprising the ferritic core material being created from the green sheet composite.

Abstract: An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composite layer being formed for reactive connection to the ceramic circuit carrier (2, 3) during a primary process and for connection to the cooling device (4).

Abstract: A method for producing a cast metal piece and a cast metal piece are provided. An information element includes at least one piece of information. The information element is produced from a magnetizable material and the information is deposited n the magnetizable material and is cast into the information element during casting of the price, the casting temperature being above the Curie temperature of the magnetizable material of the information element.

Abstract: An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).

Abstract: A method for manufacturing an inductive component which is formed from a plurality of layers, wherein the method comprises the steps of a) arrangement of an electrically conductive material as a winding of the component on a first non-magnetic, dielectric ceramic layer; b) formation of at least one cutout which passes all the way through in the non-magnetic, dielectric ceramic layer; c) arrangement of a first magnetic ceramic layer on an upper face and a second magnetic ceramic layer on a lower face of the non-magnetic, dielectric ceramic layer; and d) carrying out a process step in which at least one of the magnetic ceramic layers is plastically deformed such that contact is made with the two magnetic ceramic layers in the area of the cutout, and the two magnetic ceramic layers form a magnetic core of the component.

Abstract: The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by means of the cooling arrangement (23, 33, 43).

Abstract: A capacitor (10) with a variable capacitance, includes at least one electrode (11) and at least one counter-electrode (12) situated opposite the electrode at a variable distance (13) therefrom. The capacitor is characterized in that a dielectric shaped part (15) with a dielectric molding compound for evening out a surface roughness (113) of the electrode surface is arranged inside the space between the electrode and the counter-electrode on one of the electrode surfaces (111) of at least one of the electrodes. The method for producing the capacitor includes the following steps: a) providing the electrode of the capacitor; b) applying a dielectric molding compound to the surface of the electrode so that the electrode surface is shaped by the molding compound, and; c) transforming the dielectric molding compound into the shaped part thereby evening out the surface roughness of the electrode surface.

Abstract: A capacitor structure with variable capacitance, has at least one capacitor. More specifically, the structure has a capacitor electrode, a capacitor counter-electrode arranged opposite said capacitor electrodes at a variable capacitor electrode distance in relation hereto and at least one actuator for varying the capacitor electrode distance, and an actuator electrode for electrically controlling the actuator by which the variation in the capacitor electrode distance is effected. The the actuator electrode and one of the capacitor electrodes of the capacitor are arranged next to one another on a common carrier. Advantageously, the actuator electrode and the capacitor electrode arranged next to said actuator electrode are electrically isolated from one another. By this, the control circuit and function circuit are decoupled. Advantageously, the actuator is a piezoceramic bending transducer. The capacitor structure is deployed for example in a voltage-controlled oscillator (VCO).

Abstract: A radiation detector is disclosed, in particular an x-ray or gamma detector, having a number of photodetector elements that are arranged next to one another and establish a detection surface. A converter layer is further included, above the detection surface, that converts incident radiation of a first wavelength region into radiation of a second wavelength region. The photodetector elements are sensitive to radiation of the second wavelength region. The converter layer is designed as an at least two-dimensional photonic crystal that has a bandgap or at least a reduced transmission in all directions parallel to the detection surface for the radiation of the second wavelength region. The detector may reduce or even prevent crosstalk between individual channels without the need for dividing septa in the converter layer.

Abstract: A component carrier is for at least one x-ray sensitive detector element. On the carrier, at least one signal-processing component can be arranged. The carrier includes an x-ray absorbing material for the protection of the signal-processing component from x-rays.

Abstract: A detector module for an X-ray computer tomograph, includes a number of sensor arrays provided next to one another on a printed circuit board. Each of the sensor arrays includes a plurality of first contact elements on a top side, averted from the printed circuit board. In order to make contact with the sensor array, the first contact elements are electrically connected to second contact elements with the aid of conductor tracks that are accommodated in or on an electrically insulating flexible carrier.