Patents by Inventor Richard O. Collins
Richard O. Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240318351Abstract: A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit.Type: ApplicationFiled: June 4, 2024Publication date: September 26, 2024Inventors: Zhiyuan YE, Shu-Kwan LAU, Brian BURROWS, Lori D. WASHINGTON, Herman DINIZ, Martin A. HILKENE, Richard O. COLLINS, Nyi Oo MYO, Manish HEMKAR, Schubert S. CHU
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Patent number: 12037701Abstract: A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit.Type: GrantFiled: March 31, 2021Date of Patent: July 16, 2024Assignee: Applied Materials, Inc.Inventors: Zhiyuan Ye, Shu-Kwan Danny Lau, Brian H. Burrows, Lori Washington, Herman Diniz, Martin A. Hilkene, Richard O. Collins, Nyi O. Myo, Manish Hemkar, Schubert S. Chu
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Publication number: 20240038575Abstract: Embodiments described herein relate to a susceptor kit. The susceptor kit includes a susceptor support plate including a plurality of susceptor lift pin holes and a plurality of susceptor support holes, a plurality of susceptor supports recessed within the plurality of susceptor support holes and coupled to the susceptor support plate, and a lift pin assembly. The plurality of susceptor supports receive a plurality of susceptor support pins. The support body supports the support pin link in a spaced apart relation to the susceptor support plate. The lift pin assembly is received in the plurality of susceptor lift pin holes. The lift pin assembly includes a lift pin cap and a susceptor lift pin comprising a susceptor stop plate. The susceptor support plate stop is receivable within the susceptor lift pin holes.Type: ApplicationFiled: July 27, 2022Publication date: February 1, 2024Inventors: Zhepeng CONG, Ashur J. ATANOS, Nimrod SMITH, Richard O. COLLINS
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Publication number: 20240026522Abstract: Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.Type: ApplicationFiled: October 2, 2023Publication date: January 25, 2024Inventors: Zhepeng CONG, Schubert CHU, Nyi Oo MYO, Kartik Bhupendra SHAH, Zhiyuan YE, Richard O. COLLINS
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Publication number: 20230420279Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.Type: ApplicationFiled: September 11, 2023Publication date: December 28, 2023Inventors: Masato ISHII, Richard O. COLLINS, Richard GILJUM, Alexander BERGER
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Publication number: 20230402268Abstract: A plasma processing system for cleaning a substrate is provided. The plasma processing system includes a process chamber that includes: a chamber body enclosing an interior volume; and a substrate support disposed in the interior volume. The plasma processing system includes a vacuum pump; a first exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump; and a second exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump. The first exhaust line and the second exhaust line are arranged to provide alternative paths for the exhaust between the interior volume and the vacuum pump, and the first exhaust line has an internal diameter that is at least 50% smaller than the internal diameter of the second exhaust line.Type: ApplicationFiled: June 9, 2022Publication date: December 14, 2023Inventors: Songjae LEE, Masato ISHII, Martin TRUEMPER, Richard O. COLLINS, Martin Jeffrey SALINAS, Yong ZHENG, Anita ZHAO, Adele MARIADASS, Christophe MARCADAL, Henry BARANDICA, Ernesto J. ULLOA
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Patent number: 11781212Abstract: Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.Type: GrantFiled: April 7, 2021Date of Patent: October 10, 2023Assignee: Applied Material, Inc.Inventors: Zhepeng Cong, Schubert Chu, Nyi Oo Myo, Kartik Bhupendra Shah, Zhiyuan Ye, Richard O. Collins
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Patent number: 11784076Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.Type: GrantFiled: July 15, 2022Date of Patent: October 10, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Masato Ishii, Richard O. Collins, Richard Giljum, Alexander Berger
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Publication number: 20220351999Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.Type: ApplicationFiled: July 15, 2022Publication date: November 3, 2022Inventors: Masato ISHII, Richard O. COLLINS, Richard GILJUM, Alexander BERGER
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Publication number: 20220325400Abstract: Embodiments disclosed herein generally provide improved control of gas flow in processing chambers. In at least one embodiment, a liner for a processing chamber includes an annular body having a sidewall and a vent formed in the annular body for exhausting gas from inside to outside the annular body. The vent comprises one or more vent holes disposed through the sidewall. The liner further includes an opening in the annular body for substrate loading and unloading.Type: ApplicationFiled: April 7, 2021Publication date: October 13, 2022Inventors: Zhepeng CONG, Schubert CHU, Nyi Oo MYO, Karlik Bhupendra SHAH, Zhiyuan YE, Richard O. COLLINS
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Publication number: 20220322492Abstract: A process chamber includes a chamber body having a ceiling disposed above a floor with a chassis and an injector ring disposed therebetween. Upper and lower clamp rings secure the upper and floors, respectively, in place. An upper heating module is coupled to the upper clamp ring above the ceiling. A lower heating module is coupled to the lower clamp ring below the floor.Type: ApplicationFiled: April 6, 2021Publication date: October 6, 2022Inventors: Shu-Kwan LAU, Brian Hayes BURROWS, Zhiyuan YE, Richard O. COLLINS, Enle CHOO, Danny D. WANG, Shainish NELLIKKA, Toshiyuki NAKAGAWA, Abhishek DUBE, Ala MORADIAN, Kartik Bhupendra SHAH
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Patent number: 11424149Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.Type: GrantFiled: June 11, 2020Date of Patent: August 23, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Masato Ishii, Richard O. Collins, Richard Giljum, Alexander Berger
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Publication number: 20220195617Abstract: An apparatus as disclosed herein relates to a chamber body design for use within a thermal deposition chamber, such as an epitaxial deposition chamber. The chamber body is a segmented chamber body design and includes an inject ring and a base plate. The base plate includes a substrate transfer passage and one or more exhaust passages disposed therethrough. The inject ring includes a plurality of gas inject passages disposed therethrough. The inject ring is disposed on top of the base plate and attached to the base plate. The one or more exhaust passages and the gas inject passages are disposed opposite one another. One or more seal scaling grooves are formed in both the base plate and the inject ring to enable the inject ring and the base plate to seal to one another as well as other components within the process chamber.Type: ApplicationFiled: December 22, 2020Publication date: June 23, 2022Inventors: Shu-Kwan LAU, Zhiyuan YE, Richard O. COLLINS, Brian Hayes BURROWS
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Patent number: 11171023Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber may include a substrate support, a first plurality of heating elements disposed over the substrate support, and one or more high-energy radiant source assemblies disposed over the first plurality of heating elements. The one or more high-energy radiant source assemblies are utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.Type: GrantFiled: October 7, 2016Date of Patent: November 9, 2021Assignee: Applied Materials, Inc.Inventors: Schubert S. Chu, Douglas E. Holmgren, Kartik Shah, Palamurali Gajendra, Nyi O. Myo, Preetham Rao, Kevin Joseph Bautista, Zhiyuan Ye, Martin A. Hilkene, Errol Antonio C. Sanchez, Richard O. Collins
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Publication number: 20210324514Abstract: A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit. The process chamber described herein enables for the processing of multiple substrates simultaneously with improved process gas flow and heat distribution.Type: ApplicationFiled: March 31, 2021Publication date: October 21, 2021Inventors: Zhiyuan YE, Shu-Kwan Danny LAU, Brian H. BURROWS, Lori WASHINGTON, Herman DINIZ, Martin A. HILKENE, Richard O. COLLINS, Nyi O. MYO, Manish HEMKAR, Schubert S. CHU
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Patent number: 10837121Abstract: Embodiments described herein generally relate to a susceptor support for supporting a susceptor in a deposition process. The susceptor support includes a shaft, a plate with a first major surface coupled to the shaft, and a support element extending from a second major surface of the plate. The plate may be made of a material that is optically transparent to the radiation energy from a plurality of energy sources disposed below the plate. The plate may have a thickness that is small enough to minimize radiation transmission loss and large enough to be thermally and mechanically stable to support the susceptor during processing. The thickness of the plate may range from about 2 mm to about 20 mm.Type: GrantFiled: March 27, 2017Date of Patent: November 17, 2020Assignee: Applied Materials, Inc.Inventors: Richard O. Collins, Errol Antonio C. Sanchez, David K. Carlson, Mehmet Tugrul Samir
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Publication number: 20200303228Abstract: A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.Type: ApplicationFiled: June 11, 2020Publication date: September 24, 2020Inventors: Masato Ishii, Richard O. Collins, Richard Giljum, Alexander Berger
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Patent number: 10755955Abstract: A substrate processing system is disclosed which includes a substrate input/output chamber coupled to a transfer chamber, and one or more processing chambers coupled to the transfer chamber, wherein the substrate input/output chamber includes a plurality of stacked carrier holders, and a platen, wherein the platen includes a plurality of alignment pads and a plurality of openings formed in a recessed flange along a peripheral edge of the platen.Type: GrantFiled: February 12, 2018Date of Patent: August 25, 2020Assignee: Applied Materials, Inc.Inventors: Masato Ishii, Richard O. Collins, Richard Giljum, Alexander Berger
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Publication number: 20190252229Abstract: A substrate processing system is disclosed which includes a substrate input/output chamber coupled to a transfer chamber, and one or more processing chambers coupled to the transfer chamber, wherein the substrate input/output chamber includes a plurality of stacked carrier holders, and one of the carrier holders includes a substrate carrier to support a substrate thereon.Type: ApplicationFiled: February 12, 2018Publication date: August 15, 2019Inventors: Masato ISHII, Richard O. COLLINS, Richard GILJUM, Alexander BERGER
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Patent number: 10269614Abstract: Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.Type: GrantFiled: October 16, 2015Date of Patent: April 23, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Schubert S. Chu, Kartik Shah, Anhthu Ngo, Karthik Ramanathan, Nitin Pathak, Nyi O. Myo, Paul Brillhart, Richard O. Collins, Kevin Joseph Bautista, Edric Tong, Zhepeng Cong, Anzhong Chang, Kin Pong Lo, Manish Hemkar