Abstract: A method and system provides for execution of calibration cycles from time to time during normal operation of the communication channel. A calibration cycle includes de-coupling the normal data source from the transmitter and supplying a calibration pattern in its place. The calibration pattern is received from the communication link using the receiver on the second component. A calibrated value of a parameter of the communication channel is determined in response to the received calibration pattern. The steps involved in calibration cycles can be reordered to account for utilization patterns of the communication channel. For bidirectional links, calibration cycles are executed which include the step of storing received calibration patterns on the second component, and retransmitting such calibration patterns back to the first component for use in adjusting parameters of the channel at first component.

Abstract: A method and system that provides for execution of a first calibration sequence, such as upon initialization of a system, to establish an operation value, which utilizes an algorithm intended to be exhaustive, and executing a second calibration sequence from time to time, to measure drift in the parameter, and to update the operation value in response to the measured drift. The second calibration sequence utilizes less resources of the communication channel than does the first calibration sequence. In one embodiment, the first calibration sequence for measurement and convergence on the operation value utilizes long calibration patterns, such as codes that are greater than 30 bytes, or pseudorandom bit sequences having lengths of 2N?1 bits, where N is equal to or greater than 7, while the second calibration sequence utilizes short calibration patterns, such as fixed codes less than 16 bytes, and for example as short as 2 bytes long.

Abstract: A memory system architecture/interconnect topology includes a configurable width buffered memory module having a configurable width buffer device with at least one switch element. A buffer device, such as a configurable width buffer device, is positioned between or with at least one integrated circuit memory device positioned on a substrate surface of a memory module, such as a DIMM. A switch element is positioned on or off a memory module and includes two transistors in embodiments of the invention. One or more switch elements are coupled to one or more channels to allow for upgrades of memory modules in a memory system. An asymmetrical switch topology allows for increasing the number of memory modules to more than two memory modules without adding switch elements serially on each channel. Switch elements allow for increasing the number of ranks of memory modules in a system, while also achieving many of the benefits associated with point-to-point topology.

Abstract: Described is a memory system in which the memory core organization changes with device width. The number of physical memory banks accessed reduces with device width, resulting in reduced power usage for relatively narrow memory configurations. Increasing the number of logic memory banks for narrow memory widths reduces the likelihood of bank conflicts, and consequently improves speed performance.

Abstract: A computer system includes a controller device having an interface disposed on a circuit board. A first socket is disposed on the circuit board and receives a first memory module having a first integrated circuit buffer device. The first memory module has a first plurality of integrated circuit memory devices coupled to the first integrated circuit buffer device. A first point-to-point link is coupled to the interface of the controller device. When the first memory module is received by the first socket, the first integrated circuit buffer device receives control information, address information, and data from the controller device over the first point-to-point link. A second socket is disposed on the circuit board and receives a second memory module having a second integrated circuit buffer device. The second memory module has a second plurality of memory devices coupled to the second integrated circuit buffer device.

Abstract: A memory architecture includes a memory controller coupled to multiple modules. Each module includes a computing engine coupled to a shared memory. Each computing engine is capable of receiving instructions from the memory controller and processing the received instructions. The shared memory is configured to store main memory data and graphical data. Certain computing engines are capable of processing graphical data. The memory controller may include a graphics controller that provides instructions to the computing engine. An interconnect on each module allows multiple modules to be coupled to the memory controller.

Abstract: A system comprises a master device and a first integrated circuit buffer device. A first plurality of integrated circuit memory devices are coupled to the first integrated circuit buffer device. A first plurality of signal lines are coupled to the first integrated circuit buffer device and the master device, wherein the first plurality of signal lines communicate control information, address information and data from the master device to the first integrated circuit buffer device. A second plurality of signal lines are coupled to the first integrated circuit buffer device. A second integrated circuit buffer device is coupled to the second plurality of signal lines, the second integrated circuit buffer device receives the control information, the address information and the data from the first integrated circuit buffer device over the second plurality of signal lines. A second plurality of integrated circuit memory devices are coupled to the second integrated circuit buffer device.

Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.

Abstract: A memory system includes a memory controller and a memory component coupled to each other. The memory controller includes an interface to receive a first signal and a second signal from the memory component, wherein the first signal comprises a first symbol and the second signal comprises a second symbol. A first circuit of the memory controller receives the first signal by sampling the first symbol using a first timing offset relative to a reference clock signal, and a second circuit of the memory controller receives the second signal by sampling the second symbol using a second timing offset relative to the reference clock signal. The first timing offset is independent of the second timing offset.

Abstract: A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems.

Abstract: A memory system architecture/interconnect topology that includes at least one point-to-point link between a master, and at least one memory subsystem. The memory subsystem includes a buffer device coupled to a plurality of memory devices. The memory system may be upgraded through dedicated point-to-point links and corresponding memory subsystems.

Abstract: A method and apparatus provides a mask key that is used instead of mask data. In an embodiment of the present invention, a write mask key is generated by a memory controller and transferred to a memory device that uses the write mask key to determine whether to write a data value to a storage array. A plurality of decoders, an OR logic gate tree and a binary propagation tree is used to provide the write mask key that reduces latency while using the approximate same circuit area and allows for the use of standard software tools in an embodiment of the present invention. A plurality of log2 decoders is coupled to a plurality of OR logic gates in the OR logic gate tree.

Abstract: A memory system architecture/interconnect topology includes a configurable width buffered memory module having a configurable width buffer device and at least one flyby element. A buffer device, such as a configurable width buffer device, is positioned between or with at least one integrated circuit memory device positioned on a substrate surface of a memory module, such as a DIMM. A flyby element is positioned on a memory module and/or in the buffer device and includes conductive element or signal line in embodiments of the invention. One or more flyby elements are coupled to one or more memory modules to allow for upgrades of memory modules in a memory system. An asymmetrical flyby topology allows for increasing the number of memory modules to more than two memory modules without increasing any more delay than is present in with two memory modules.

Abstract: A memory system architecture/interconnect topology includes a configurable width buffered memory module having a configurable width buffer device and at least one splitter element. A buffer device, such as a configurable width buffer device, is positioned between or with at least one integrated circuit memory device positioned on a substrate surface of a memory module, such as a DIMM. A splitter element is positioned on or off a memory module and includes three resistors in embodiments of the invention. Three resistors form a Y or D topology in embodiments of the invention. One or more splitter elements are coupled to one or more channels to allow for upgrades of memory modules in a memory system. An asymmetrical splitter topology allows for increasing the number of memory modules to more than two memory modules without adding splitter elements serially on each channel.

Abstract: A memory system architecture/interconnect topology includes a configurable width buffered memory module having a configurable width buffer device with at least one bypass circuit. A buffer device, such as a configurable width buffer device, is positioned between or with at least one integrated circuit memory device positioned on a substrate surface of a memory module, such as a DIMM. The configurable width buffer device is coupled to at least one memory device (by way of an internal channel), entry pin and exit pin on the memory module. The configurable width buffer device includes a multiplexer/demultiplexer circuit coupled to the entry pin and the internal channel for accessing the memory device. A bypass circuit is coupled to the entry pin and the exit pin in order to allow information to be transferred through the memory module to another coupled memory module in the memory system by way of an external channel.

Abstract: A method and apparatus for testing and characterizing circuits is provided. In one embodiment, a high-speed interface of a semiconductor component includes high-speed test circuitry. The high-speed test circuitry obviates the need for an external high-speed testing system for testing and characterization. In one embodiment, the high-speed test circuitry includes a test pattern generation circuit, and various differential comparators to compare low bandwidth reference signals with interface signals during testing and characterization. In one embodiment, an interface that includes the test circuitry can test itself or another interface. In one embodiment, a timing reference signal decouples the individual parameters of two interfaces testing each other to avoid any errors introduced by the combination of individual interface circuit parameters, such as receiver parameters and transmitter parameters. The testing can be performed at the wafer stage, at the component stage, and in a system.

Abstract: A memory system architecture/interconnect topology includes a configurable width buffered module having a configurable width buffer device. The configurable width buffer device is coupled to at least one memory device on the configurable width memory module. The configurable width buffer device includes an interface and a configurable serialization circuit capable of varying a data path width or a number of contacts used at the interface of the configurable width buffer device in accessing the at least one memory device. In an alternate embodiment of the present invention, a multiplexer/demultiplexer circuit is provided. A state storage provides a data width for the configurable width buffer and a SPD provides the configurable width buffer and/or module capabilities to the memory system.