Patents by Inventor Richard Volant

Richard Volant has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6800503
    Abstract: A method of fabricating an encapsulated micro electro-mechanical system (MEMS) and making of same that includes forming a dielectric layer, patterning an upper surface of the dielectric layer to form a trench, forming a release material within the trench, patterning an upper surface of the release material to form another trench, forming a first encapsulating layer that includes sidewalls within the another trench, forming a core layer within the first encapsulating layer, and forming a second encapsulating layer above the core layer, where the second encapsulating layer is connected to the sidewalls of the first encapsulating layer. Alternatively, the method includes forming a multilayer MEMS structure by photomasking processes to form a first metal layer, a second layer including a dielectric layer and a second metal layer, and a third metal layer. The core layer and the encapsulating layers are made of materials with complementary electrical, mechanical and/or magnetic properties.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: October 5, 2004
    Assignee: International Business Machines Corporation
    Inventors: Joseph T. Kocis, James Tornello, Kevin S. Petrarca, Richard Volant, Seshadri Subbanna
  • Publication number: 20040097003
    Abstract: A method of fabricating an encapsulated micro electro-mechanical system (MEMS) and making of same that includes forming a dielectric layer, patterning an upper surface of the dielectric layer to form a trench, forming a release material within the trench, patterning an upper surface of the release material to form another trench, forming a first encapsulating layer that includes sidewalls within the another trench, forming a core layer within the first encapsulating layer, and forming a second encapsulating layer above the core layer, where the second encapsulating layer is connected to the sidewalls of the first encapsulating layer.
    Type: Application
    Filed: November 20, 2002
    Publication date: May 20, 2004
    Applicant: International Business Machines Corporation
    Inventors: Joseph T. Kocis, James Tornello, Kevin S. Petrarca, Richard Volant, Seshadri Subbanna
  • Publication number: 20030211312
    Abstract: A dielectric material formed by contacting a low dielectric constant polymer with liquid or supercritical carbon dioxide, under thermodynamic conditions which maintain the carbon dioxide in the liquid or supercritical state, wherein a porous product is formed. Thereupon, thermodynamic conditions are changed to ambient wherein carbon dioxide escapes from the pores and is replaced with air.
    Type: Application
    Filed: June 6, 2003
    Publication date: November 13, 2003
    Applicant: International Business Machines Corporation
    Inventors: John M. Cotte, Kenneth John McCullough, Wayne Martin Moreau, Kevin Petrarca, John P. Simons, Charles J. Taft, Richard Volant
  • Publication number: 20030008129
    Abstract: A dielectric material formed by contacting a low dielectric constant polymer with liquid or supercritical carbon dioxide, under thermodynamic conditions which maintain the carbon dioxide in the liquid or supercritical state, wherein a porous product is formed. Thereupon, thermodynamic conditions are changed to ambient wherein carbon dioxide escapes from the pores and is replaced with air.
    Type: Application
    Filed: June 27, 2001
    Publication date: January 9, 2003
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: John M. Cotte, Kenneth John McCullough, Wayne Martin Moreau, Kevin Petrarca, John P. Simons, Charles J. Taft, Richard Volant
  • Patent number: 6489857
    Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: December 3, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kevin Petrarca, Robert A. Groves, Brian Herbst, Christopher Jahnes, Richard Volant
  • Publication number: 20020063610
    Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.
    Type: Application
    Filed: November 30, 2000
    Publication date: May 30, 2002
    Inventors: Kevin Petrarca, Robert A. Groves, Brian Herbst, Christopher Jahnes, Richard Volant