Patents by Inventor Richard W. Brown

Richard W. Brown has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11945082
    Abstract: Systems and methods are provided for locating a pair of components relative to one another using complex surfaces. One component has a complex surface, where the complex surface is smoothly contoured. Another component is shaped to be connected with the first component. A fixture locates the first component relative to the second component. The fixture includes a locator with a complex surface region shaped to mate with the complex surface of the one component to locate the fixture relative to that component. The fixture includes another locator to locate the fixture relative to the second component.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: April 2, 2024
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Richard J. Skurkis, Tyson W. Brown, Mark A. Smith, Miguel A. Saez, John P. Spicer
  • Patent number: 11942217
    Abstract: A system including a range of motion, quality of sleep, overall, and control modules. The range of motion module, prior to a procedure being performed on a patient, determines a first range of motion score of the patient based on a first signal generated by a sensor. The quality of sleep module, prior to the procedure being performed on the patient, determines a first quality of sleep score or a first pain score based on the first signal. The overall module determines a combined score based on the first range of motion score and the first quality of sleep score or the first pain score. The control module compares the combined score to a predetermined threshold and predicts an outcome of the procedure based on the comparison. The control module, based on the combined score, determines whether to perform the procedure, adjust the procedure or refrain from performing the procedure.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: March 26, 2024
    Assignee: WARSAW ORTHOPEDIC, INC.
    Inventors: Randal Schulhauser, Richard L. Brown, Matthew M. Morrison, Patrick W. Kinzie, Jeffrey R. VanRaaphorst, Emily C. Byrne
  • Patent number: 11927210
    Abstract: A lock nut and tang washer mechanism preloads and locks components in a rotating environment. A drive system mechanism preloads and locks the device in a rotating environment and provides a double locking safety requirement needed in most aircraft for applications operating in an enclosed environment. The mechanism holds a required torque for the duration of the drive system operating life without the need for periodic visual inspections.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: March 12, 2024
    Assignee: AVX Aircraft Company
    Inventors: Ian W. Brown, Richard F. Murray
  • Patent number: 11177572
    Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: November 16, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Jonathon C. Veihl, Michael L. Brobston, Richard W. Brown, Charles D. L. Bernardo
  • Publication number: 20200343640
    Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Inventors: Jonathon C. Veihl, Michael L. Brobston, Richard W. Brown, Charles D. L. Bernardo
  • Patent number: 10741920
    Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: August 11, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Jonathon C. Veihl, Michael L. Brobston, Richard W. Brown, Charles D. L. Bernardo
  • Publication number: 20190115664
    Abstract: A stacked patch radiating element includes a dielectric substrate, a ground plane on a first surface of the dielectric substrate, a patch radiator on a second surface of the dielectric substrate, a feed that is configured to connect the patch radiator to a transmission line, a solder layer on the patch radiator opposite the dielectric substrate, and a parasitic radiating element on the solder layer opposite the patch radiator. The parasitic radiating element includes a metal layer on the solder, a parasitic radiator dielectric substrate on the first metal layer opposite the solder, and a parasitic radiator on the parasitic radiator dielectric substrate opposite the first metal layer.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 18, 2019
    Inventors: Jonathon C. Veihl, Michael L. Brobston, Richard W. Brown, Charles D.L. Bernardo
  • Patent number: 10103692
    Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
    Type: Grant
    Filed: April 29, 2015
    Date of Patent: October 16, 2018
    Assignee: CommScope Technologies LLC
    Inventors: Sammit A. Patel, Yongjie Xu, Qiyun Gu, Richard W. Brown
  • Publication number: 20170230011
    Abstract: In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.
    Type: Application
    Filed: April 29, 2015
    Publication date: August 10, 2017
    Inventors: Sammit A. Patel, Yongjie Xu, Qiyun Gu, Richard W. Brown
  • Patent number: 8720369
    Abstract: The present invention relates to the application of surface coatings to treated aluminum articles utilized on aircraft, and more particularly to a system for masking portions of aluminum aircraft wheel and brake components for application of surface coatings to reduce or prevent wear and/or corrosion to the aluminum article. The system may be utilized for new aluminum aircraft components as well as aircraft components that have been subjected to non-destructive testing. The masking components are constructed and arranged to cooperate with portions of the aluminum component in a sequential manner to allow for application of multiple layers of primer and/or topcoat without removal of prior masking components so that a coated component complies with the manufacturer's written requirements for that component.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: May 13, 2014
    Assignee: The Lost Boy Group, LLC
    Inventors: Jason E. Rayman, Richard W. Brown
  • Publication number: 20130125812
    Abstract: The present invention relates to the application of surface coatings to treated aluminum articles utilized on aircraft, and more particularly to a system for masking portions of aluminum aircraft wheel and brake components for application of surface coatings to reduce or prevent wear and/or corrosion to the aluminum article. The system may be utilized for new aluminum aircraft components as well as aircraft components that have been subjected to non-destructive testing. The masking components are constructed and arranged to cooperate with portions of the aluminum component in a sequential manner to allow for application of multiple layers of primer and/or topcoat without removal of prior masking components so that a coated component complies with the manufacturer's written requirements for that component.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Inventors: Jason E. Rayman, Richard W. Brown
  • Patent number: 7933673
    Abstract: A system for demand breakout for a supply chain includes a memory operable to store a plurality of orders for at least one product. Each product may be produced using at least one precursor. The memory is also operable to store a production schedule identifying one or more resources in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources, and a time period associated with production of each product and precursor. The system also includes one or more processors collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: April 26, 2011
    Assignee: i2 Technologies US, Inc.
    Inventors: Richard W. Brown, Paul T. Chapman
  • Patent number: 7685113
    Abstract: A system for demand breakout for a supply chain includes a memory operable to store a plurality of orders for at least one product. Each product may be produced using at least one precursor. The memory is also operable to store a production schedule identifying one or more resources in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources, and a time period associated with production of each product and precursor. The system also includes one or more processors collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Grant
    Filed: October 19, 2007
    Date of Patent: March 23, 2010
    Assignee: i2 Technologies US, Inc.
    Inventors: Richard W. Brown, Paul T. Chapman
  • Publication number: 20090276275
    Abstract: A system for demand breakout for a supply chain includes a memory operable to store a plurality of orders for at least one product. Each product may be produced using at least one precursor. The memory is also operable to store a production schedule identifying one or more resources in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources, and a time period associated with production of each product and precursor. The system also includes one or more processors collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Application
    Filed: July 15, 2009
    Publication date: November 5, 2009
    Inventors: Richard W. Brown, Paul T. Chapman
  • Patent number: 7590555
    Abstract: A system for demand breakout for a supply chain includes a memory operable to store a plurality of orders for at least one product. Each product may be produced using at least one precursor. The memory is also operable to store a production schedule identifying one or more resources in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources, and a time period associated with production of each product and precursor. The system also includes one or more processors collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Grant
    Filed: April 13, 2004
    Date of Patent: September 15, 2009
    Assignee: i2 Technologies US, Inc.
    Inventors: Richard W. Brown, Paul T. Chapman
  • Patent number: 7248937
    Abstract: A system (100) for demand breakout for a supply chain includes a memory (112) operable to store a plurality of orders (118) for at least one product. Each product may be produced using at least one precursor. The memory (112) is also operable to store a production schedule (120) identifying one or more resources (108) in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources (108), and a time period associated with production of each product and precursor. The system (100) also includes one or more processors (114) collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors (114) are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: July 24, 2007
    Assignee: i2 Technologies US, Inc.
    Inventors: Richard W. Brown, Paul T. Chapman
  • Publication number: 20040193500
    Abstract: A system for demand breakout for a supply chain includes a memory operable to store a plurality of orders for at least one product. Each product may be produced using at least one precursor. The memory is also operable to store a production schedule identifying one or more resources in the supply chain, a quantity of each product and precursor scheduled to be produced by the resources, and a time period associated with production of each product and precursor. The system also includes one or more processors collectively operable to identify one or more particular units of the product that correspond to each product order. The one or more processors are also collectively operable to identify one or more particular units of one or more precursors that correspond to each product order.
    Type: Application
    Filed: April 13, 2004
    Publication date: September 30, 2004
    Applicant: i2 Technologies US, Inc., a Nevada corporation
    Inventors: Richard W. Brown, Paul T. Chapman
  • Patent number: 6676094
    Abstract: A deck appurtenance includes an item to be supported, a support pole supporting the item, and a support bracket. The support bracket includes a first end detachably coupled to a midline portion of the support pole, a second end detachably coupled to a component of a deck rail, and a body connecting the first end to the second end.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: January 13, 2004
    Inventor: Richard W. Brown
  • Patent number: 6006465
    Abstract: A soft-bodied crank-bait lure comprising a rigid interior skeleton and a rubbery body molded or formed thereover, where the skeleton includes: a first channel extending downward and rearward from the anterior end of the lure; and a second channel extending downward and forward from the posterior end of the lure. The rearward opening of the first channel is spaced from and substantially faces the forward opening of the second channel, and the first channel and the second channel are angled with respect to each other. Fishing line or leader line is threaded through the first channel and then through second channel, and the hooks are coupled to the line rather than to the skeleton or to the rubbery body. Therefore, the lure will "free-flow" on the line, so that when a fish strikes the lure and becomes hooked, the lure will slide away from the fish.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: December 28, 1999
    Assignee: Boomerang Marketing, Inc.
    Inventors: Frank Brown, Richard W. Brown, Richard M. Brown
  • Patent number: 5688983
    Abstract: This invention relates to a process for the preparation of tetraethyl methylenebisphosphonate by the reaction of dichloromethane with diethyl phosphite, wherein the reaction is performed in a polar aprotic solvent or mixtures thereof.
    Type: Grant
    Filed: March 12, 1996
    Date of Patent: November 18, 1997
    Assignee: Zeneca Limited
    Inventors: Michael R. Leadbetter, Richard W. Brown, Maureen M. McKenna