Abstract: A method is provided for fabricating a flexible circuit having at least one raised bump associated with a contact pad. A sacrificial conductive mandrel is provided having a depression located to correspond with each raised bump contact. A conductive metal pattern is electroformed on selected portions of the sacrificial conductive mandrel, corresponding to a desired electrical lead pattern and the contact pad. A non-conductive polymeric sheet is applied as a base material for the flexible circuit, and laminated to the sacrificial conductive mandrel on the face having the conductive metal pattern thereon. An etchant, capable of removing the sacrificial conductive mandrel without etching or removing metal of the conductive metal pattern, is employed to remove the sacrificial conductive mandrel from the polymeric sheet to which the mandrel and the conductive metal pattern are laminated.

Abstract: A method of proximity imaging photolithographic structures for the fabrication of high resolution ink jet orifice plates is used in ink jet printers. The method comprises the step of providing a positive-acting photoresist coating onto an electrically conducting plating substrate. A clear glass photomask is brought into planar proximity and a planar gap is established by means of screen shims permanently bonded to the glass photomask. It is desirable to ensure that the shims are uniformly distributed about the mask with at least one shim in the center. An atmospheric pressure sufficient to ensure that the shims are settled against the resist-coated substrate is then applied, before exposing the surface with an ultraviolet light source and developing to produce a non-conductive peg pattern corresponding to the desired orifice pattern.

Abstract: A method for electroforming linear orifice plates includes the steps of: placing electrically conductive robber panels adjacent edges of an electrically conductive plating substrate bearing a linear insulative peg pattern; coupling the plating surface of the plating substrate to the adjacent robber panels with a thin strip of electrically conductive material; and electroplating to form an orifice plate with precisely uniform diameter orifices.

Abstract: An improved orifice plate for use in ink jet printing, includes a first elongated lamina composed of electroformed metal or metal-alloy having tensile or compressive stress condition and a second elongated lamina composed of a metal or metal-alloy electroformed onto said first lamina and having a counterbalancing stress condition.

Abstract: A method of fabricating an orifice plate for ink jet printing includes the steps of: (i) providing a reusable mandrel having an electrically conductive bottom surface of an oxidizable metal such as aluminum and integral raised relief portions comprising an oxide of the metal (e.g. aluminum oxide) and (ii) electroforming metal onto said mandrel conductive surfaces to form an orifice plate.

Abstract: Glass or ceramic fibers or other fibers such as graphite properly protected by a suitable adherent ceramic or metal coating are immersed in a liquid metallo-organic solution containing a noble metal compound as a primary ingredient, then dried and fired in air or in a slightly oxidizing atmosphere so as to produce a noble metal coating on the fibers. Fibers may be in the form of individual filaments, as a multifilament tow or yarn or as a woven fabric. The fibers coated with a nobel metal are then incorporated into a metal matrix composite material by immersion in a molten bath of the desired matrix metal, placing the fibers in a suitable mold and casting the molten matrix metal around them or placing the fibers between solid sheets of matrix metal and effecting consolidation by diffusion bonding. The coating thickness on the fibers should be at least 0.30 microns and should not exceed 0.50 microns.

Abstract: The present invention comprises a process of forming a copper base alloy composite which is reinforced by graphite fibers, wherein the fibers are first coated with a continuous coating of an alloy constituent and then continuously coated with a coating of copper or a copper base alloy. The coated fibers are then heated in a vacuum under applied load, in combination with copper or a copper base alloy at a temperature above the melting point of the copper or copper base alloy but below the melting point of the alloy to be formed from the copper or copper base alloy and the alloy constituent with which said graphite fiber has first been coated.

Abstract: The present invention comprises a process of preparing metal matrix composites which are reinforced by ceramic or graphite fibers, wherein the fibers are pretreated; first by a nickel coating, then by a second coating which is sacrificed when the fibers are ultimately immersed in a liquid metallic bath which becomes the matrix of the composite material formed. Usually the second coating is copper.In addition, a third coating on the fibers comprising a noble metal such as silver may also be used for certain matrix metal materials. Preferably the thickness of the nickel coating is a minimum of 0.5 micrometers and the second sacrificial coating is a minimum of 0.5 micrometers. After the fibers have been coated with the two or more successive coatings, they are incorporated into a metal matrix composite material by immersion in a molten bath of the desired matrix metal, or by placing the fibers in a suitable mold and casting the molten metal matrix around them, or by other suitable means.

Abstract: This method of copper plating aluminum and aluminum alloy wire or strip applies an adherent and ductile plating while the wire is moving rapidly and continuously through the plating apparatus. An improved chemical zincating step followed by a copper pyrophosphate strike plating, within critical thickness limits, reduces the plating time and makes practical plating of the wire while moving at speeds of about 100 feet per minute or more in relation to the processing solution.