Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: A method of detachment of a connector which is provided with a housing having connector pins to be inserted into a board and with a first member which is arranged between the housing and the board and through which the connector pins are inserted, the method including a process of pulling out the connector pins from the board. This process utilizes the lever principle, which uses the first member as a fulcrum and which uses any point on the housing as a point of action, so as to pull out the connector pins from the board.

Abstract: A method of repairing a semiconductor device includes turning a press member to apply pressure on an electronic component which is mounted on a substrate. A heat sink which is provided on the electronic component via a bonding layer is thus displaced with respect to the electronic component in a transverse direction. The heat sink is removed from the electronic component by shearing the bonding layer with the press member.

Abstract: In the initial state, a part having a bottom electrode such as a BGA is attached to a substrate. A heat transfer material such as low melting point solder is allowed to fill a gap between the substrate and the part having the bottom electrode, and the heat transfer material and the BGA serving as the bottom electrode are heated. The heat transfer material and the BGA are melted by the heating so that the part having the bottom electrode is removed from the substrate.

Abstract: A semiconductor device module includes a first substrate layer on which a first semiconductor device is surface-mounted, a second substrate layer that is a layer laminated on a side of the first substrate layer on which the first semiconductor device is not surface-mounted, a second semiconductor device being surface-mounted on a surface of the second substrate layer and not on a side of the first substrate layer, and a hollow section that is a space sandwiched between the first substrate layer and the second substrate layer and formed on back sides of areas on which the first semiconductor device and the second semiconductor device are surface-mounted.

Abstract: A printed circuit board unit includes a printed circuit board including through holes arranged in a grid array on which an integrated circuit is mounted; and a flexible substrate provided on a back side of the printed circuit board, covering the through holes. First lands to which the integrated circuit is connected are formed on a front side of the printed circuit board. Second lands to which the flexible substrate is connected are formed on the back side of the printed circuit board. The first lands and the second lands are connected to first ends and second ends of the through holes, respectively. Third lands are formed on a front side of the flexible substrate so as to face the second lands of the printed circuit board. Fourth lands are formed on a back side of the flexible substrate. The fourth lands are electrically connected to the third lands.

Abstract: An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.

Abstract: A method for manufacturing a product involving solder joining wherein components placed on a board on which the components are to be mounted are solder-joined to the board by subjecting the board to reflow heating under prescribed heating conditions, the method comprising: calculating, at each designated site on the board, a component volume that is occupied by the components mounted within a given area; determining the heating conditions in accordance with the calculated component volume; and performing the reflow heating based on the determined heating conditions.

Abstract: A heater that attaches an electronic component having a ball grid array structure to and detaches the electronic component from a substrate on which the electronic component operates includes a body fixed onto the electronic component, and a heating element, provided on the body, which heats and melts soldering balls having the ball grid array structure when receiving power supply.

Abstract: The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.

Abstract: The present invention relates to an electrical connector assembly capable of achieving a high-precision fit starting with fairly rough positioning, the assembly consisting of a first connector which is equipped with multiple substrates secured in an array and a second connector which is equipped with female terminals and mates with the first connector. The electrical connector has a rough guide mechanism (first guides and second guides as well as first complementary guides and second complementary guides) which guides a mating between the first connector and the second connector relatively roughly at an initial stage of mating, and a precision guide mechanism (chamfers on substrates and corresponding tapers on a housing of the second connector) which guides the mating between the first connector and the second connector relatively precisely at an advanced stage of mating.

Abstract: The present invention is an electrical connector, having multiple terminals equipped with compliant sections to be inserted into through-holes in a main board; multiple sub-boards equipped with lands connected to the terminals and a contact section to be connected to a mating connector. The lands consist of a conductor formed on an insulator and a housing used to secure the multiple sub-boards in an array, wherein owing to a conductor which extends close to the terminal-side edge of the insulator, the lands prevent the sub-boards from being buckled by being bitten by the terminals when the compliant sections are inserted into the through-holes in the main board.

Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.