Abstract: A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.

Abstract: A case and a semiconductor device including the case are provided for solving the following issues: when fixing a lid body to a case body by an adhesive, a process of attaching the lid body to the case body by applying the adhesive and curing the adhesive by heating is necessary, which requires much labor; also, when fixing the lid body to the case body by an engaging claw, it still requires much labor due to forming the engaging claw. The case includes a first member and a second member that is engaged with the first member to form an accommodation space inside the case, and the first member has a protruding portion extending from the first member side toward the second member side and having an end portion crushed from the opposite side of the first member to fix the second member to the first member.

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

Abstract: After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

Abstract: A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.

Abstract: A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate, and forming a convex curve on an insulating substrate side of the radiator plate; obtaining a first concave curve by reversing the convex curve; setting a second concave curve on an insulating substrate side of a radiator plate after soldering, a bottom of the second concave curve being positioned under clearance between the plurality of insulating substrates; adding the first curve and the second curve to calculate a third concave curve on the insulating substrate side; and forming the third curve on a flat plate to form a radiator plate before soldering.

Abstract: A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.

Abstract: A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.

Abstract: In a semiconductor device, protective films are formed on facing side surfaces of a plurality of circuit patterns and a plating process or the like is not performed on parts aside from the side surfaces where the protective films are formed. This means that when semiconductor elements and contact elements are directly bonded via solder onto the plurality of circuit patterns, a drop-in wettability of the plurality of circuit patterns for the solder is avoided.

Abstract: After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

Abstract: A case and a semiconductor device including the case are provided for solving the following issues: when fixing a lid body to a case body by an adhesive, a process of attaching the lid body to the case body by applying the adhesive and curing the adhesive by heating is necessary, which requires much labor; also, when fixing the lid body to the case body by an engaging claw, it still requires much labor due to forming the engaging claw. The case includes a first member and a second member that is engaged with the first member to form an accommodation space inside the case, and the first member has a protruding portion extending from the first member side toward the second member side and having an end portion crushed from the opposite side of the first member to fix the second member to the first member.

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

Abstract: A semiconductor device having a tubular part is able to prevent the solder from spattering when soldering the tubular part. The semiconductor device has a insulated substrate that has a circuit layer on a front surface thereof, a tubular part that is soldered to the circuit layer, and an external terminal that is inserted into the tubular part and connected electrically to the tubular part. The tubular part has a cylinder portion and a flange portion that is connected to one longitudinal end of the cylinder portion. The flange portion has a first projection, a second projection and a third projection that face the circuit layer. The distance between the first projection and the second projection, the distance between the second projection and the third projection, and the distance between the third projection and the first projection each are greater than the inner diameter of the cylinder portion.

Abstract: A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

Abstract: A terminal pressing frame of a semiconductor device is disposed so as to form a first gap partially from the bottom surface of an L-shaped leg portion of an external terminal and a second gap from an inside surface of a resin case. Adhesive spreads to the second gap and further spreads to the first gap connected to the second gap, consequent to the pressure when a metal base is assembled. The spreading of the adhesive to the first gap fixes an L-shaped leg portion of the external terminal and the terminal pressing frame to each other; and the spreading of adhesive to the second gap fixes the resin case and the terminal pressing frame to each other.

Abstract: A semiconductor module includes a plurality of insulating circuit boards including semiconductor chips, each of the plurality of insulating circuit boards including a first outer edge among outer edges of the insulating circuit board facing an adjacent insulating circuit board of the plurality of insulating circuit boards, and a second outer edge among the outer edges excluding the first outer edge; a resin frame body having a crosspiece abutting against the first outer edges, and a frame element abutting against the second outer edges; a conductive component striding over the crosspiece to electrically connect the insulating circuit boards to each other; and an upper lid having a lid element covering an opening disposed at an upper part of the resin frame body and a partition protruding from a face of the lid element facing the insulating circuit boards to abut against a part of the crosspiece.

Abstract: A terminal pressing frame of a semiconductor device is disposed so as to form a first gap partially from the bottom surface of an L-shaped leg portion of an external terminal and a second gap from an inside surface of a resin case. Adhesive spreads to the second gap and further spreads to the first gap connected to the second gap, consequent to the pressure when a metal base is assembled. The spreading of the adhesive to the first gap fixes an L-shaped leg portion of the external terminal and the terminal pressing frame to each other; and the spreading of adhesive to the second gap fixes the resin case and the terminal pressing frame to each other.

Abstract: A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate, and forming a convex curve on an insulating substrate side of the radiator plate; obtaining a first concave curve by reversing the convex curve; setting a second concave curve on an insulating substrate side of a radiator plate after soldering, a bottom of the second concave curve being positioned under clearance between the plurality of insulating substrates; adding the first curve and the second curve to calculate a third concave curve on the insulating substrate side; and forming the third curve on a flat plate to form a radiator plate before soldering.

Abstract: A semiconductor device having a tubular part is able to prevent the solder from spattering when soldering the tubular part. The semiconductor device has a insulated substrate that has a circuit layer on a front surface thereof, a tubular part that is soldered to the circuit layer, and an external terminal that is inserted into the tubular part and connected electrically to the tubular part. The tubular part has a cylinder portion and a flange portion that is connected to one longitudinal end of the cylinder portion. The flange portion has a first projection, a second projection and a third projection that face the circuit layer. The distance between the first projection and the second projection, the distance between the second projection and the third projection, and the distance between the third projection and the first projection each are greater than the inner diameter of the cylinder portion.

Abstract: A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.