Patents by Inventor Rina Tanaka

Rina Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150287789
    Abstract: A silicon carbide semiconductor device includes trenches formed in a lattice shape on the surface of a silicon carbide substrate on which a semiconductor layer is formed, and gate electrodes formed inside of the trenches via a gate insulating film. The depth of the trenches is smaller in a portion where the trenches are crossingly formed than in a portion where the trenches are formed in parallel to each other. Consequently, the silicon carbide semiconductor device is obtained that increases a withstand voltage between the gate electrodes and corresponding drain electrodes on the semiconductor device rear surface to prevent dielectric breakdown and, at the same time, has a large area of the gate electrodes, high channel density per unit area, and low ON resistance.
    Type: Application
    Filed: July 25, 2013
    Publication date: October 8, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Nobuo Fujiwara, Yasuhiro Kagawa, Rina Tanaka, Yutaka Fukui
  • Publication number: 20150236119
    Abstract: A silicon-carbide semiconductor device that relaxes field intensity in a gate insulating film, and that has a low ON-resistance. The silicon-carbide semiconductor device includes: an n-type silicon-carbide substrate; a drift layer formed on a topside of the n-type silicon-carbide substrate; a trench formed in the drift layer and that includes therein a gate insulating film and a gate electrode; a p-type high-concentration well region formed parallel to the trench with a spacing therefrom and that has a depth larger than that of the trench; and a p-type body region formed to have a depth that gradually increases when nearing from a position upward from the bottom end of the trench by approximately the thickness of the gate insulating film at the bottom of the trench toward the lower end of the p-type high-concentration well region.
    Type: Application
    Filed: September 5, 2013
    Publication date: August 20, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Rina Tanaka, Yasuhiro Kagawa, Shiro Hino, Naruhisa Miura, Masayuki Imaizumi
  • Publication number: 20150048384
    Abstract: In a JBS diode using a wide band gap semiconductor, the wide band gap semiconductor has a large built-in voltage, which sometimes causes difficulties for the pn diode portion to turn on, resulting in a problem that resistance to surge currents is not sufficiently ensured. In order to solve this problem, in the wide-band-gap JBS diode, a pn junction of the pn diode is formed away from the Schottky electrode, and well regions are formed so as to have a width narrowed at a portion away from the Schottky electrode.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 19, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Rina Tanaka, Akihiko Furukawa, Masayuki Imaizumi, Yuji Abe