Patents by Inventor Rio Rivas

Rio Rivas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170122912
    Abstract: A fluidic device includes at least one bulk acoustic wave (BAW) resonator structure with a functionalized active region, and at least one first (inlet) port defined through a cover structure arranged over a fluidic passage containing the active region. At least a portion of the at least one inlet port is registered with the active region, permitting fluid to be introduced in a direction orthogonal to a surface of the active region bearing functionalization material. Such arrangement promotes mixing proximate to a BAW resonator structure surface, thereby reducing analyte stratification, increasing analyte binding rate, and reducing measurement time.
    Type: Application
    Filed: November 2, 2016
    Publication date: May 4, 2017
    Inventors: Gernot Fattinger, Rio Rivas
  • Publication number: 20170117871
    Abstract: A micro-electrical-mechanical system (MEMS) resonator device includes a top side electrode overlaid with an interface layer including a material having a surface (e.g., gold or other noble metal, or a hydroxylated oxide) that may be functionalized with a functionalization (e.g., specific binding or non-specific binding) material. The interface layer and/or an overlying blocking material layer are precisely patterned to control locations of the interface layer available to receive a self-assembled monolayer (SAM), thereby addressing issues of misalignment and oversizing of a functionalization zone that would arise by relying solely on microarray spotting. Atomic layer deposition may be used for deposition of the interface layer and/or an optional hermeticity layer. Sensors and microfluidic devices incorporating MEMS resonator devices are also provided.
    Type: Application
    Filed: October 26, 2016
    Publication date: April 27, 2017
    Inventors: Rio Rivas, John Belsick, Matthew Ryder
  • Patent number: 9623657
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: April 18, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Patent number: 9624101
    Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.
    Type: Grant
    Filed: October 21, 2010
    Date of Patent: April 18, 2017
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter Mardilovich, Anthony M. Fuller, Qingqiao Wei, Rio Rivas, David Kamp
  • Patent number: 9597873
    Abstract: In one embodiment, a printhead includes a substrate comprising a single fluid slot with sidewall surfaces. The printhead also includes a plurality of fluid chambers in fluid communication with the fluid slot. The printhead includes a membrane disposed between the fluid slot and the fluid chambers. The membrane comprises membrane side surfaces that form fluid feed holes to provide the fluid communication between the fluid slot and the fluid chambers. A protective coating is disposed on each of the surfaces.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 21, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventor: Rio Rivas
  • Patent number: 9579893
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: February 28, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Patent number: 9573369
    Abstract: In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: February 21, 2017
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen
  • Publication number: 20160368267
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Application
    Filed: September 6, 2016
    Publication date: December 22, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Patent number: 9498953
    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: November 22, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M. Fuller, Rio Rivas, Kellie Susanne Jensen
  • Patent number: 9475278
    Abstract: Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: October 25, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Ed Friesen, Lawrence Thurber, Garrett E. Clark, Rosanna L. Bigford
  • Patent number: 9463485
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening through the substrate, with the opening having a long axis profile and a short axis profile, and with the long axis profile including a first portion extending from a minimum dimension of the long axis profile to a first side of the substrate, and a second portion including and extending from the minimum dimension of the long axis profile to a second side of the substrate opposite the first side. The method also includes forming a protective layer on sidewalls of the second portion of the long axis profile of the opening and excluding the protective layer from sidewalls of the first portion of the long axis profile of the opening.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: October 11, 2016
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Corey Deyo, Ed Friesen
  • Patent number: 9352568
    Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate, a chamber layer formed over the thin-film layer, the chamber layer defining a fluidic channel that leads to a firing chamber, a slot extending through the substrate and into the chamber layer through an ink feed hole in the thin-film layer, and a particle tolerant thin-film extension of the thin-film layer that protrudes into the slot from between the substrate and the chamber layer.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: May 31, 2016
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Publication number: 20160114581
    Abstract: In one embodiment, a printhead includes a substrate comprising a single fluid slot with sidewall surfaces. The printhead also includes a plurality of fluid chambers in fluid communication with the fluid slot. The printhead includes a membrane disposed between the fluid slot and the fluid chambers. The membrane comprises membrane side surfaces that form fluid feed holes to provide the fluid communication between the fluid slot and the fluid chambers. A protective coating is disposed on each of the surfaces.
    Type: Application
    Filed: September 12, 2012
    Publication date: April 28, 2016
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventor: Rio RIVAS
  • Publication number: 20160101620
    Abstract: In an embodiment, a fluid ejection device includes a substrate with a fluid slot formed therein, a chamber layer formed on the substrate defining fluid chambers on both sides of the fluid slot, a thin-film layer between the substrate and chamber layer that defines an ink feedhole (IFH) between the fluid slot and the chamber layer, and a chamber layer extension that forms a bridge across the IFH between two chambers.
    Type: Application
    Filed: April 30, 2013
    Publication date: April 14, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Rio Rivas, Anthony M. Fuller, Ed Friesen
  • Publication number: 20160082732
    Abstract: Fluid ejection devices with particle tolerant thin-film extensions are disclosed. An example apparatus includes a printer; a reservoir; and a printhead including: a firing chamber; a channel to receive fluid from the reservoir, the channel is coupled to the firing chamber, the channel having an opening; and a particle-tolerant film disposed adjacent the opening of the channel, the particle-tolerant film disposed between the channel and the reservoir, the particle-tolerant film to deter particles within the fluid from settling in an area adjacent the opening.
    Type: Application
    Filed: December 3, 2015
    Publication date: March 24, 2016
    Inventors: Rio Rivas, Ed Friesen, Kellie Susanne Jensen
  • Publication number: 20160031216
    Abstract: A method of forming a substrate for a fluid ejection device includes forming an opening in the substrate from a second side toward a first side, and further forming the opening in the substrate to the first side, including increasing the opening to the first side and increasing the opening at the second side, and forming the opening with substantially parallel sidewalls intermediate the first side and the second side and converging sidewalls to the first side.
    Type: Application
    Filed: February 13, 2013
    Publication date: February 4, 2016
    Inventors: Ed Friesen, Rio Rivas, Kelly Ronk
  • Publication number: 20160001555
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Application
    Filed: September 10, 2015
    Publication date: January 7, 2016
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Patent number: 9211713
    Abstract: A fluid dispenser is disclosed herein. An example of such a fluid dispenser includes a member configured to define a plurality of orifices through which a fluid is ejected and a manifold including a plurality of fluid passageways each of which is configured to have a different angle relative to the member. This example of a fluid dispenser additionally includes a plurality of slots each of which is coupled to a different one of the fluid passageways of the manifold to conduct the fluid from the fluid passageways towards the orifices. Additional features and modifications of this fluid dispenser are disclosed herein, as are other examples of fluid dispensers.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: December 15, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Silam J. Choy, Garrett E. Clark, Rio Rivas, Ed Friesen, Kelly Ronk
  • Publication number: 20150352843
    Abstract: A printhead die includes a SiO2 layer grown into a surface of a silicon substrate, and a dielectric layer deposited onto an interior surface area of a substrate. Multiple termination rings are formed around the interior surface area. Each ring is defined by an absence of the dielectric layer. A berm is located in between each termination ring. Each berm is defined by the presence of the dielectric layer.
    Type: Application
    Filed: January 23, 2013
    Publication date: December 10, 2015
    Inventors: Anthony M. Fuller, Rio Rivas, Kellie Susanne Jensen
  • Publication number: 20150314601
    Abstract: In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.
    Type: Application
    Filed: December 20, 2012
    Publication date: November 5, 2015
    Applicant: Hewlett-Packard Devekopment Company, L.P.
    Inventor: Rio Rivas