Abstract: A method of fabricating a mandrel for electroformation of an orifice plate. An array of mask elements may be created adjacent a substrate. Surface regions of the substrate disposed generally between the mask elements may be removed, to create a base having a base surface and a plurality of pillars extending from the base surface according to the array of mask elements. Each pillar may have a perimeter defined by an orthogonal projection of one of the mask elements onto the substrate. An electrical-conduction enhancer may be deposited adjacent the base surface and terminating at least substantially at the perimeter, to create a conductive layer to support growth of the orifice plate.

Abstract: The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment includes a substrate for supporting overlying layers. The embodiment also includes at least one feature formed in the substrate, the feature being formed with at least a first substrate removal process and a second different substrate removal process.

Abstract: A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.

Abstract: The described embodiments relate to slotted substrates. One exemplary method removes substrate material from a substrate to form a fluid-handling slot through the substrate. This particular method also mechanically conditions the substrate proximate the fluid-handling slot, at least in part, to remove debris created by the removing.

Abstract: The orifice plate has a central area with an orifice. The plate further has an edge area that surrounds the central area and is proximate to the edges of the orifice plate. The edge area has an aperture therein.

Abstract: A high resolution printer includes a printhead having optimized features including 12 to 14 micron diameter orifices spaced apart from adjacent orifices by a distance of between 76 to 94 microns. The orifice plate is electroformed and plated to a thickness ranging from 20 to 25 microns. A polymeric barrier layer secures the orifice plate to a printhead substrate.