Abstract: An aspect of the present invention computationally determines the metal density of each metal layer supporting a power grid structure providing power to the elements of an integrated circuits. The metal densities are computed such that the power grid would support aggregate power and IR drop constraints. The metal densities thus computed are provided as inputs to a router block, which places the grid structure along with the signal paths on the layout of the eventual integrated circuit sought to be fabricated. Due to the computation of the metal densities upfront and providing to the router block, the iterative design of the IC might be avoided.

Abstract: Performing approximate analysis of modules based on corresponding layout files while requiring fewer computations than performing a transistor level simulation of a design of a module or integrated circuit. One feature enables IR/voltage drop and EM (electro migration) violations to be determined. Another features improves such analysis in case of memory modules. One more feature enables determination of whether sufficient voltages will be applied to program efuses in a module containing the efuses. Yet another feature enables the signal characteristics of an output path/pin to be determined to check for any EM violations.