Patents by Inventor Rkia ACHEHBOUNE
Rkia ACHEHBOUNE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11814284Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.Type: GrantFiled: March 20, 2020Date of Patent: November 14, 2023Assignee: Cirrus Logic Inc.Inventors: Roberto Brioschi, Rkia Achehboune
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Patent number: 11736866Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.Type: GrantFiled: November 5, 2021Date of Patent: August 22, 2023Assignee: Cirrus Logic Inc.Inventors: Rkia Achehboune, Roberto Brioschi
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Patent number: 11337010Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.Type: GrantFiled: April 13, 2018Date of Patent: May 17, 2022Assignee: Cirrus Logic, Inc.Inventors: Marek Sebastian Piechocinski, Roberto Brioschi, Rkia Achehboune
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Patent number: 11299392Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.Type: GrantFiled: May 7, 2020Date of Patent: April 12, 2022Assignee: Cirrus Logic, Inc.Inventors: Rkia Achehboune, Roberto Brioschi, Dimitris Drogoudis, David Patten
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Publication number: 20220060835Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.Type: ApplicationFiled: November 5, 2021Publication date: February 24, 2022Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Rkia ACHEHBOUNE, Roberto BRIOSCHI
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Patent number: 11252513Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.Type: GrantFiled: March 19, 2020Date of Patent: February 15, 2022Assignee: Cirrus Logic, Inc.Inventors: Roberto Brioschi, Rkia Achehboune, David Patten
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Patent number: 11223907Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.Type: GrantFiled: March 18, 2020Date of Patent: January 11, 2022Assignee: Cirrus Logic, Inc.Inventors: Rkia Achehboune, Roberto Brioschi
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Patent number: 11172314Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially through the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.Type: GrantFiled: March 20, 2020Date of Patent: November 9, 2021Assignee: Cirrus Logic, Inc.Inventors: Roberto Brioschi, Rkia Achehboune
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Patent number: 11146894Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.Type: GrantFiled: March 19, 2020Date of Patent: October 12, 2021Assignee: Cirrus Logic, Inc.Inventors: Roberto Brioschi, Rkia Achehboune
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Publication number: 20210144482Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.Type: ApplicationFiled: April 13, 2018Publication date: May 13, 2021Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Marek Sebastian PIECHOCINSKI, Roberto BRIOSCHI, Rkia ACHEHBOUNE
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Publication number: 20200377363Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.Type: ApplicationFiled: May 7, 2020Publication date: December 3, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Rkia ACHEHBOUNE, Roberto BRIOSCHI, Dimitris DROGOUDIS, David PATTEN
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Publication number: 20200369514Abstract: The application describes a moulded interposer member for a MEMS transducer package. The interposer member comprises a void region and at least one through hole or channel.Type: ApplicationFiled: May 14, 2020Publication date: November 26, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE, David PATTEN
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Publication number: 20200304922Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.Type: ApplicationFiled: March 19, 2020Publication date: September 24, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE
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Publication number: 20200304923Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially though the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE
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Publication number: 20200304921Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.Type: ApplicationFiled: March 19, 2020Publication date: September 24, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE, David PATTEN
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Publication number: 20200299127Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.Type: ApplicationFiled: March 20, 2020Publication date: September 24, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE
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Publication number: 20200304920Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.Type: ApplicationFiled: March 18, 2020Publication date: September 24, 2020Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Rkia ACHEHBOUNE, Roberto BRIOSCHI
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Patent number: 10735868Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.Type: GrantFiled: November 2, 2018Date of Patent: August 4, 2020Assignee: Cirrus Logic, Inc.Inventors: Rkia Achehboune, Dimitris Drogoudis, Roberto Brioschi, Aleksey Sergeyevich Khenkin, David Patten
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Publication number: 20190158962Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.Type: ApplicationFiled: November 2, 2018Publication date: May 23, 2019Applicant: Cirrus Logic International Semiconductor Ltd.Inventors: Rkia ACHEHBOUNE, Dimitris DROGOUDIS, Roberto BRIOSCHI, Aleksey Sergeyevich KHENKIN, David PATTEN
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Patent number: 10252906Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.Type: GrantFiled: October 19, 2017Date of Patent: April 9, 2019Assignee: Cirrus Logic, Inc.Inventors: Roberto Brioschi, David Patten, Rkia Achehboune