Patents by Inventor Rkia ACHEHBOUNE

Rkia ACHEHBOUNE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TRANSDUCER PACKAGING
    Publication number: 20180167742
    Abstract: The applications describes lid designs for transducer packaging. The lid comprising at least one side wall which extends between a foot of the lid and an upper surface of the lid. One or more grooves are provided in a surface of the side wall which serve to resist the flow of molten solder on the surface of the lid.
    Type: Application
    Filed: December 4, 2017
    Publication date: June 14, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Roberto BRIOSCHI, Rkia ACHEHBOUNE, Marek Sebastian PIECHOCINSKI
  • TRANSDUCER PACKAGING
    Publication number: 20180167744
    Abstract: The application describes a lid for a transducer package, wherein an interior surface of the lid is provided with a plurality of dimples. The dimples are provided in a ceiling surface of the lid or in a side-wall surface of the lid. The dimples may be arranged to form a regular array. The dimples serve to create a turbulent boundary layer to decouple the interior surface of lid from airflow arising inside the package chamber, thus alleviating noise.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 14, 2018
    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD.
    Inventors: Marek Sebastian Piechocinski, Roberto Brioschi, Rkia Achehboune, Aleksey Sergeyevich Khenkin
  • PACKAGE FOR MEMS DEVICE AND PROCESS
    Publication number: 20180127265
    Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.
    Type: Application
    Filed: October 19, 2017
    Publication date: May 10, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Roberto BRIOSCHI, David PATTEN, Rkia ACHEHBOUNE