Abstract: A wall or room partition mountable modular rail rack component mounting system. The system includes wall racks shaped for interlocking engagement with each other at their opposite ends and cross stiffener members for placement between the wall rails to hold them in rigid space apart relationship. The wall rails each having a shaped opening at one end and a mating element at the other end thereof. The shaped opening and the mating element interlock with each other. The dimensions and spacings of openings and elements on the wall rails and rail racks for mounting thereon provide for rail racks mounted in vertically aligned closely space relationship that gives uninterrupted rail rack placement.

Abstract: A containment system for significantly reducing the emission of high frequency electromagnetic waves from a computer system into the external environment. The containment system includes the combination of two enclosures and a shielding assembly. One of the enclosures is associated with the high frequency components and the other with the low frequency components of the computer system. The shielding assembly is positioned between the two enclosures to prevent high frequency electromagnetic waves from passing from one chamber to the other over the connection between the two chambers.

Abstract: A print head assembly includes the feature of snap-in, tool-less replaceability. The print head is intended for an application where extended use is expected and replacement, due to wear, will be necessary by nontechnical users of the printing system. In one embodiment, the print head utilizes two pins which slide into slots formed in the printer body. The print head is free to pivot about the two pins and is urged against a platen by the force of bias springs and a loaded pin. The loaded pin engages with, and forces upwrd on the heat-radiating fins extending from the bottom of the print head. Shelves formed in the printer body cover engage the two pins of the print head and force the print head, against the forces of the bias springs, into a proper alignment position when the cover is closed. This allows firm engagement of the print head with the platen, and proper alignment thereof, without fixing the print head to a mounting structure.

Abstract: A method of doping selected areas of semiconductor material in the fabrication of integrated circuit devices, including placing a semiconductor substrate in a glow discharge reactor, introducing reactant gases into the reactor, subjecting the reactant gases to a plasma discharge, depositing, upon the substrate, a dopant carrier layer comprising an amorphous semiconductor material having a predetermined dopant concentration, controlling the thickness of the dopant carrier layer, and driving the dopant atoms out of the amorphous semiconductor dopant carrier layer into the selected areas of the semiconductor substrate by means of a controlled elevated temperature anneal.

Abstract: A method for forming electrical interconnections in an integrated circuit which involves forming an insulating layer on the silicon chip on the lower of two conductive layers to be interconnected, opening a window in the insulating layer, filling the window with a metallic plug by a lift-off technique, and then forming an interconnection pattern extending over the layer and contacting the plug.