Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Systems, devices, and methods are discussed for providing virtualized ZTNA control across multiple networks.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.

Abstract: The auxiliary suspension device is relatively neutral at rest and responds in coordination with the existing suspension system upon application of a load. The redundant suspension device has an inflatable bellow that is mounted between a vehicle's frame and an existing vehicle suspension element.

Abstract: Aspects of the subject disclosure may include, for example, obtaining first data pertaining to an outage in a first portion of a communications system, obtaining second data pertaining to a relationship between the first portion of the communications system and a second portion of the communications system, analyzing the first data the second data to identify a risk to communication services facilitated by the second portion of the communications system, determining that the risk is greater than a threshold, and generating, based on the determining, a recommendation for reducing the risk. Other embodiments are disclosed.

Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.

Abstract: Medical devices for applying a cinch to a suture and methods for making and using such devices are disclosed. An example medical device may include an elongated shaft including a proximal region and a distal region. The distal region may define a lumen having a lumen dimeter, and a distally facing end surface. The medical device may also include an outer cinch member defining a bore and having an outer surface defining a shoulder. An elongated inner shaft may extend through and be longitudinally movable within the lumen and the bore and including a distal end section. An inner cinch member may be engaged with the distal end section of the elongated inner shaft.

Abstract: A carton including: a) a base; b) a lid having a top side and underside; c) a first side; d) a front side, wherein at least a portion of the front side is located adjacent to the first side and there is an arcuate transition between the first side and the front side; e) a second side, wherein at least a portion of the second side is located adjacent to the front side and there is an arcuate transition between the second side and the front side; and f) a back side, wherein a portion of the back side is located adjacent to the first side and a portion of the back side is located adjacent to the second side and the back side has no arcuate transitions between itself, the first side, or the second side.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Multi-die packages including both photonic and electric integrated circuit (IC) die interconnected to each other through a routing structure built-up on a glass substrate. A glass preform comprising an optical waveguide may also be attached to the routing structure. A plurality of electrical IC (EIC) die may be arrayed over the routing structure along with a plurality of photonic IC (PIC). Each PIC may be coupled to an optical waveguide within the glass preform. Conductive vias may extend through the glass substrate and be further coupled with a host substrate. The host substrate may comprise glass and an optical waveguide embedded within the glass. A vertical coupler may be attached to the host substrate to optically couple the host substrate to the optical waveguide within the glass preform of the multi-die package. Many of the multi-die packages may be arrayed over a routing structure on the host substrate.

Abstract: Various approaches for providing scalable network access processing. In some cases, approaches discussed relate to systems and methods for providing scalable zero trust network access control.

Abstract: Photonic integrated circuit packages and methods of manufacturing are disclosed. An example integrated circuit package includes: a semiconductor die; a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core including a through glass via extending between opposing first and second surfaces of the glass core, the glass core including a recess spaced apart from the through glass via, the recess defined by a third surface of the glass core, the recess having a different shape than the through glass via; and a reflective metal disposed on the third surface to define a mirror, the reflective metal also disposed between a wall of the through glass via and a conductive material disposed in the through glass via.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: A method of placing an implant at one or more bone portions includes inserting a pinning and drilling instrument a first distance into a bone portion at a location at the bone portion such that a pin portion of the pinning and drilling instrument is inserted into the bone portion at the location; after inserting the pinning and drilling instrument the first distance into the bone portion, creating an implant receiving aperture at the location by further inserting the pinning and drilling instrument a second further distance into the bone portion at the location at the bone portion such that a drill portion of the pinning and drilling instrument is inserted into the bone portion to create the implant receiving aperture at the location; and placing an implant at the implant receiving aperture.

Abstract: An implantable device includes one or more anchors. The anchors are configured to capture one or more leaflets of a native heart valve. The one or more anchors are configured to draw native valve leaflets into the device. The anchor portion can be extendable and retractable. The one or more anchors can be closed to secure the implantable device to the native valve leaflets.

Abstract: A method of fixating bones for fusion includes positioning an implant guide sleeve at a first bone and a second bone and across a separation between the first bone from the second bone. The method further includes using the implant guide sleeve to guide creation of a first implant hole in the first bone and to guide creation of a second implant hole in the second bone, aligning an inserter, operatively connected to an implant, with the implant guide sleeve, and advancing the inserter, relative to the implant guide sleeve, to position the implant in contact with the first bone and the second bone with the implant bridging between the first bone and the second bone.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.