Abstract: A database management system is described that can encode data to generate a plurality of data vectors. The database management system can perform the encoding by using a dictionary. The database management system can adaptively reorder the plurality of data vectors to prepare for compression of the plurality of data vectors. During a forward pass of the adaptive reordering, most frequent values of a data vector of the plurality of data vectors can be moved-up in the data vector. During a backward pass of the adaptive reordering, content within a rest range of a plurality of rest ranges can be rearranged within the plurality of data vectors according to frequencies of the content. The reordering according to frequency can further sort the rest range by value. Related apparatuses, systems, methods, techniques, computer programmable products, computer readable media, and articles are also described.

Abstract: Methods and apparatus for edge protected glass cores are disclosed herein. An example package substrate includes a first glass layer including a first surface, a second surface opposite the first surface, and first lateral surfaces extending between the first and second surfaces, the first glass layer having a first via extending between the first surface and the second surface; and a dielectric material in contact with the first surface of the first glass layer and in contact with the first lateral surfaces of the first glass layer.

Abstract: A method for preparing virtual build volumes for the manufacture of three-dimensional objects. The virtual build volume represents an actual build volume over which one or more objects are to be built. The method includes the steps of: (a) receiving one or more object models, the object model(s) defining the intended dimensions of each of the objects; (b) applying a transformation to an initial virtual build volume to create a reduced virtual build volume smaller than the virtual build volume; (c) positioning the object model(s) within the reduced virtual build volume; and (d) applying an inverse transformation to expand the reduced virtual build volume to create an expanded virtual build volume including expanded object model(s); wherein each of the expanded object model(s) is larger than the respective object model(s).

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Systems, devices, and methods are discussed for providing virtualized ZTNA control across multiple networks.

Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: The auxiliary suspension device is relatively neutral at rest and responds in coordination with the existing suspension system upon application of a load. The redundant suspension device has an inflatable bellow that is mounted between a vehicle's frame and an existing vehicle suspension element.

Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Various approaches for providing scalable network access processing. In some cases, approaches discussed relate to systems and methods for providing scalable zero trust network access control.

Abstract: Multi-die packages including both photonic and electric integrated circuit (IC) die interconnected to each other through a routing structure built-up on a glass substrate. A glass preform comprising an optical waveguide may also be attached to the routing structure. A plurality of electrical IC (EIC) die may be arrayed over the routing structure along with a plurality of photonic IC (PIC). Each PIC may be coupled to an optical waveguide within the glass preform. Conductive vias may extend through the glass substrate and be further coupled with a host substrate. The host substrate may comprise glass and an optical waveguide embedded within the glass. A vertical coupler may be attached to the host substrate to optically couple the host substrate to the optical waveguide within the glass preform of the multi-die package. Many of the multi-die packages may be arrayed over a routing structure on the host substrate.

Abstract: Photonic integrated circuit packages and methods of manufacturing are disclosed. An example integrated circuit package includes: a semiconductor die; a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core including a through glass via extending between opposing first and second surfaces of the glass core, the glass core including a recess spaced apart from the through glass via, the recess defined by a third surface of the glass core, the recess having a different shape than the through glass via; and a reflective metal disposed on the third surface to define a mirror, the reflective metal also disposed between a wall of the through glass via and a conductive material disposed in the through glass via.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems, devices, and methods are discussed for providing ZTNA control across multiple related, but independently provisioned networks.

Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.