Abstract: Recesses formed at the tops and bottoms of through glass via (TGV) metal regions during TGV formation can create glass-metal-air triple points. These triple points can be the source of cracks or other damage to a glass layer during thermal treatment in downstream processing due to the coefficient of thermal expansion mismatch between the TGV metal and the glass. To relieve stress at the triple points, the recesses can be filled with a conductive paste or a metal layer formed via electroless plating. Alternatively, during TGV formation, regions of low-modulus dielectric material can be formed where the triple points would otherwise be formed. The low-modulus dielectric material can provide local stress relief and mitigate the formation of glass layer damage in downstream processing.

Abstract: Recesses formed at the tops and bottoms of through glass via (TGV) metal regions during TGV formation can create glass-metal-air triple points. These triple points can be the source of cracks or other damage to a glass layer during thermal treatment in downstream processing due to the coefficient of thermal expansion mismatch between the TGV metal and the glass. To relieve stress at the triple points, the recesses can be filled with a conductive paste or a metal layer formed via electroless plating. Alternatively, during TGV formation, regions of low-modulus dielectric material can be formed where the triple points would otherwise be formed. The low-modulus dielectric material can provide local stress relief and mitigate the formation of glass layer damage in downstream processing.

Abstract: Systems and methods for remote monitoring of a Security Operations Center (SOC) via a mobile application are provided. According to one embodiment, a management service retrieves information regarding multiple network elements that are associated with an enterprise network and extracts parameters of the monitored network elements from the retrieved information. The management service prioritizes the monitored network elements by determining a severity level associated with security-related issues of the network elements and generates various monitoring views that summarize in real time various categories of potential security-related issues detected by the SOC. Further, the management service assigns a priority to each monitoring view and displays a video on the display device that cycles through monitoring views in accordance with their respective assigned priorities.

Abstract: An apparatus comprising a package substrate, the package substrate comprising a glass structure; at least one buildup layer above the glass structure; and at least one buildup layer below the glass structure; wherein the glass structure comprises a first portion having a first thickness and a second portion that extends outward from the first portion, wherein the second portion has a second thickness that is smaller than the first thickness.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems, devices, and methods are discussed for treating a number of network security devices in a cooperative security fabric as a unified object for configuration purposes.

Abstract: Architectures and process flows for frames for glass core hybrid panels for semiconductor packaging. The glass core includes a layer of glass defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area and at least one through-glass via (TGV) in the layer of glass, substantially filled with a conductive material. The frame comprises a coefficient of thermal expansion (CTE) that can be manipulated based on selection of frame material and/or percentage of copper in the frame material. The frame has a CTE of less than 11. The frame can enclose a panel, sub-panel or wafer and can include one or more cavities therein for respective glass cores.

Abstract: An apparatus comprising a package substrate, the package substrate comprising a glass layer, a first layer comprising a photo-imageable dielectric (PID) material above the glass layer, a second layer below the glass layer, the second layer comprising the PID material, at least one buildup layer above the first layer, and at least one buildup layer below the second layer.

Abstract: Systems, devices, and methods are discussed for treating a number of network security devices in a cooperative security fabric using a cloud based root.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: An apparatus comprising a package substrate comprising a core layer; a pedestal embedded in the core layer; and a structure comprising a passive circuit component, wherein the structure is above the pedestal and is embedded in the core layer.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: A foundation layer and methods of forming a conductive via are described. A die pad is formed over a die. A seed layer is deposited over the die pad and the foundation layer. A first photoresist layer is deposited over the seed layer, and the first layer is patterned to form a conductive line opening over the die pad. A conductive material is deposited into the conductive line opening to form a conductive line. A second photoresist layer is deposited over the first layer, and the second layer is patterned to form a via opening over the conductive line. The conductive material is deposited into the via opening to form the conductive via, where the conductive material only deposits on portions of exposed conductive line. The second and first layers are removed. Portions of exposed seed layer are recessed, and then a top surface of the conductive via is exposed.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: A foundation layer and methods of forming a conductive via are described. A die pad is formed over a die. A seed layer is deposited over the die pad and the foundation layer. A first photoresist layer is deposited over the seed layer, and the first layer is patterned to form a conductive line opening over the die pad. A conductive material is deposited into the conductive line opening to form a conductive line. A second photoresist layer is deposited over the first layer, and the second layer is patterned to form a via opening over the conductive line. The conductive material is deposited into the via opening to form the conductive via, where the conductive material only deposits on portions of exposed conductive line. The second and first layers are removed. Portions of exposed seed layer are recessed, and then a top surface of the conductive via is exposed.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems, devices, and methods are discussed for automating incident management.