Abstract: Anisotropic conductive connections for interconnect bridges and related methods are disclosed herein. An example a package substrate for an integrated circuit package, the package substrate comprising a first pad disposed at a first end of an interconnect within the package substrate, the first pad disposed in a cavity in the package substrate, an interconnect bridge disposed in the cavity, the interconnect bridge including a second pad, and a third pad, and a layer disposed between the first pad and the second pad, the layer having a first conductivity between the first pad and the second pad, the layer having a second conductivity between the second pad and the third pad, the first conductivity greater than the second conductivity.

Abstract: An IC die package includes first and second IC die on a first surface of a glass layer, a bridge under the first and second IC die within an opening in the glass layer, and first and second package conductive features on a second surface of the glass layer opposite the first side. First interconnects comprising solder couple the bridge with the first and second IC die. Second interconnects excluding solder couple the first and second IC die with vias extending through the glass layer to the first package conductive features. Third interconnects excluding solder couple the bridge with the second package conductive features. The bridge couples the first and second IC die with each other, and the first and second IC die with the second package conductive features. A pitch of conductive features in the first interconnects is less than a pitch of conductive features in the second interconnects.

Abstract: A method, a system, and a computer program product for decompressing data. One or more compressed blocks in a set of stored compressed blocks responsive to a request to access data in the set of stored compressed blocks are identified. String prefixes inside the identified compressed blocks are decompressed using front coding. String suffixes inside the identified compressed blocks are decompressed using a re-pair decompression. Uncompressed data is generated.

Abstract: A technique for correcting a bone deformity, such as a bunion, may be performed using an instrument that defines a spacer body connected to a fulcrum. The spacer body portion of the instrument can be inserted into a joint space between opposed bone ends. The fulcrum body can be inserted between adjacent metatarsals. An angle set between the spacer body and fulcrum body can help properly position both features within different joint spaces for ensuring that subsequent steps of the surgical procedure are properly performed and instrumentation is appropriately aligned.

Abstract: An optical package comprising an optical die that is electrically coupled to a package substrate, and an optical interconnect adjacent the optical die. The optical interconnect comprises a first polarizing filter adjacent to a first lens, a second polarizing filter adjacent to a second lens; and a film comprising a magnetic material between the first polarizing filter and the second polarizing filter. The second polarizing filter is rotated with respect to the first polarizing filter and the magnetic material is to rotate a polarization vector of light incoming to the optical interconnect. An optical fiber interface port is immediately adjacent to the first lens. The second lens is immediately adjacent to an optical interface of the optical die.

Abstract: According to some embodiments, methods and systems may be associated with a cloud computing environment. A workload prediction framework may receive observed workload information associated with a database in the cloud computing environment (e.g., a DataBase as a Service (“DBaaS”)). Based on the observed workload information, a Statement Arrival Rate (“SAR”) prediction may be generated. In addition, a host variable assignment prediction may be generated based on the observed workload information. The workload prediction framework may then use the SAR prediction and the host variable assignment prediction to automatically create a workload prediction for the database. A physical database design advisor (e.g., a table partitioning advisor) may receive the workload prediction and, responsive to the workload prediction, automatically generate a recommended physical layout for the database (e.g., using a cost model, the current physical layout, and an objective function).

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.

Abstract: Systems, devices, and techniques can be used to perform an osteotomy on a bone of a foot, to realign a cut bone portion relative to an adjacent bone portion, and/or to fixate a moved position of the cut bone portion relative to the adjacent bone portion for fusion. In some examples, the disclosed devices and techniques can be used as part of a metatarsal correction procedure in which a metatarsal is treated to correct a bunion deformity.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: A foundation layer and methods of forming a conductive via are described. A die pad is formed over a die. A seed layer is deposited over the die pad and the foundation layer. A first photoresist layer is deposited over the seed layer, and the first layer is patterned to form a conductive line opening over the die pad. A conductive material is deposited into the conductive line opening to form a conductive line. A second photoresist layer is deposited over the first layer, and the second layer is patterned to form a via opening over the conductive line. The conductive material is deposited into the via opening to form the conductive via, where the conductive material only deposits on portions of exposed conductive line. The second and first layers are removed. Portions of exposed seed layer are recessed, and then a top surface of the conductive via is exposed.

Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.

Abstract: A database management system is described that can encode data to generate a plurality of data vectors. The database management system can perform the encoding by using a dictionary. The database management system can adaptively reorder the plurality of data vectors to prepare for compression of the plurality of data vectors. During a forward pass of the adaptive reordering, most frequent values of a data vector of the plurality of data vectors can be moved-up in the data vector. During a backward pass of the adaptive reordering, content within a rest range of a plurality of rest ranges can be rearranged within the plurality of data vectors according to frequencies of the content. The reordering according to frequency can further sort the rest range by value. Related apparatuses, systems, methods, techniques, computer programmable products, computer readable media, and articles are also described.

Abstract: Methods and apparatus for edge protected glass cores are disclosed herein. An example package substrate includes a first glass layer including a first surface, a second surface opposite the first surface, and first lateral surfaces extending between the first and second surfaces, the first glass layer having a first via extending between the first surface and the second surface; and a dielectric material in contact with the first surface of the first glass layer and in contact with the first lateral surfaces of the first glass layer.

Abstract: A method for preparing virtual build volumes for the manufacture of three-dimensional objects. The virtual build volume represents an actual build volume over which one or more objects are to be built. The method includes the steps of: (a) receiving one or more object models, the object model(s) defining the intended dimensions of each of the objects; (b) applying a transformation to an initial virtual build volume to create a reduced virtual build volume smaller than the virtual build volume; (c) positioning the object model(s) within the reduced virtual build volume; and (d) applying an inverse transformation to expand the reduced virtual build volume to create an expanded virtual build volume including expanded object model(s); wherein each of the expanded object model(s) is larger than the respective object model(s).

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Systems, devices, and methods are discussed for providing virtualized ZTNA control across multiple networks.

Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.