Abstract: An apparatus comprising a package substrate comprising a core layer; a pedestal embedded in the core layer; and a structure comprising a passive circuit component, wherein the structure is above the pedestal and is embedded in the core layer.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: A foundation layer and methods of forming a conductive via are described. A die pad is formed over a die. A seed layer is deposited over the die pad and the foundation layer. A first photoresist layer is deposited over the seed layer, and the first layer is patterned to form a conductive line opening over the die pad. A conductive material is deposited into the conductive line opening to form a conductive line. A second photoresist layer is deposited over the first layer, and the second layer is patterned to form a via opening over the conductive line. The conductive material is deposited into the via opening to form the conductive via, where the conductive material only deposits on portions of exposed conductive line. The second and first layers are removed. Portions of exposed seed layer are recessed, and then a top surface of the conductive via is exposed.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems, devices, and methods are discussed for automating incident management.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems, devices, and methods are discussed for providing ZTNA control across multiple related, but independently provisioned networks.

Abstract: An integrated circuit (IC) package substrate comprises an upper surface, a lower surface opposite the upper surface, and an outer side surface extending between the upper surface and the lower surface. At least one optical path is in a plane of the IC package substrate, and at least one vertical optical coupler at an upper or lower surface of the IC package substrate is optically coupled to the optical path.

Abstract: A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Systems and methods for remote monitoring of a Security Operations Center (SOC) via a mobile application are provided. According to one embodiment, a management service retrieves information regarding multiple network elements that are associated with an enterprise network and extracts parameters of the monitored network elements from the retrieved information. The management service prioritizes the monitored network elements by determining a severity level associated with security-related issues of the network elements and generates various monitoring views that summarize in real time various categories of potential security-related issues detected by the SOC. Further, the management service assigns a priority to each monitoring view and displays a video on the display device that cycles through monitoring views in accordance with their respective assigned priorities.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.

Abstract: An apparatus, comprising a substrate comprising a dielectric, a conductor, comprising a via embedded within the dielectric, the via has a first end and a second end, and substantially vertical sidewalls between the first end and the second end, and a conductive structure extending laterally from the first end of the via over the dielectric, wherein the via and the conductive structure have a contiguous microstructure.

Abstract: Various embodiments provide systems and methods for automatically defining and enforcing network sessions based upon at least four dimensions of segmentation.

Abstract: Systems, devices, and methods are discussed for treating a number of network security devices in a cooperative security fabric using a cloud based root.

Abstract: IC die package routing structures including a bulk layer of a first metal composition on an underlying layer of a second metal composition. The lower layer may be sputter deposited to a thickness sufficient to support plating of the bulk layer upon a first portion of the lower layer. Following the plating process, a second portion of the lower layer may be removed selectively to the bulk layer. Multiple IC die may be attached to the package with the package routing structures responsible for the transmission of high-speed data signals between the multiple IC die. The package may be further assembled to a host component that conveys power to the IC die package.