Patents by Inventor Robert A. Nicholas

Robert A. Nicholas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5987742
    Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: November 23, 1999
    Assignee: International Business Machines Corporation
    Inventors: Michael Acciai, Richard Ronald Hall, Robert Nicholas Ives
  • Patent number: 5948811
    Abstract: A compound of formula (I) or pharmaceutically acceptable salt thereof: ##STR1## wherein either Y is N and R.sub.2 is hydrogen, or Y is C--R.sub.1 ; where either one of R.sub.1 and R.sub.2 is hydrogen and the other is selected from the class of hydrogen, C.sub.3-8 cycloalkyl, C.sub.1-6 alkyl optionally interrupted by oxygen or substituted by hydroxy, C.sub.1-6 alkoxy or substituted arminocarbonyl, C.sub.1-6 alkylcarbonyl, C.sub.1-6 alkoxycarbonyl, C.sub.1-6 alkylcarbonyloxy, C.sub.1-6 alkoxy, nitro, cyano, halo, trifluoromethyl, CF.sub.3 S, or a group CF.sub.3 --A--, or a group CF.sub.2 H--A'--, trifluoromethoxy, C.sub.1-6 alkylsulphinyl, perfluoro C.sub.2-6 alkylsulphonyl, C.sub.1-6 alkylsulphonyl, C.sub.1-6 alkoxysulphinyl, C.sub.1-6 alkoxysulphonyl, aryl, heteroaryl, arylcarbonyl, heteroarylcarbonyl, phosphono, arylcarbonyloxy, heteroarylcarbonyloxy, arylsulphinyl, heteroarylsulphinyl, arylsulphonyl, heteroarylsulphonyl, C.sub.1-6 alkylcarbonylamino, C.sub.1-6 alkoxycarbonylamino, C.sub.
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: September 7, 1999
    Assignee: SmithKline Beegham p.l.c.
    Inventors: Wai Ngor Chan, John Morris Evans, Geoffrey Stemp, Neil Upton, Robert Nicholas Willette
  • Patent number: 5908860
    Abstract: This invention relates to the method of treatment and/or prophylaxis of anxiety and/or disorders treatable and/or preventable with anti-convulsive agents, such as epilepsy, using compounds of the formula (Ia): ##STR1##
    Type: Grant
    Filed: July 6, 1995
    Date of Patent: June 1, 1999
    Assignees: SmithKline Beecham plc,, SmithKline Beecham Corporation
    Inventors: Mervyn Thompson, John Morris Evans, Neil Upton, Wai Ngor Chan, Kuok Keong Vong, Robert Nicholas Willette
  • Patent number: 5873162
    Abstract: The technique involves attaching a stiffener to a flexible substrate that has solder balls on the substrate. The steps include locating the flexible substrate on the stiffener with the solder balls on the side away from the stiffener, and drawing a vacuum to hold the flexible substrate in place. Locating the stiffener on a support with a pressure sensitive adhesive on a surface facing away from the support, and drawing a vacuum to hold the stiffener in place. Then, applying a pressure around the solder balls against the flexible substrate in the order of 2000 pounds per square inch to force the flexible substrate against the stiffener.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: February 23, 1999
    Assignee: International Business Machines Corporation
    Inventors: Michael Acciai, Richard Ronald Hall, Robert Nicholas Ives
  • Patent number: 5818697
    Abstract: An electronic package is provided that includes a flexible polyimide film carrier having electronic circuitry on both of its major surfaces and a plurality of solder interconnection pads on a first major surface; solder mask layers located on both major surfaces, provided that areas between subsequently to be applied individual circuit chips on the first major surface exist that are free from the solder mask; and a plurality of modules attached to the film carrier by the solder balls or bumps. Also provided is a method for fabricating the electronic package that includes reflow of the solder balls or bumps to achieve attachment of the modules.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: October 6, 1998
    Assignee: International Business Machines Corporation
    Inventors: Gregg Joseph Armezzani, Robert Nicholas Ives, Mark Vincent Pierson, Terry Alan Tull
  • Patent number: 5693458
    Abstract: The invention provides a photographic element comprising a light-sensitive silver halide emulsion layer having associated therewith a dye-forming coupler of formula (I): ##STR1## wherein X is H or a coupling-off group, R.sub.1 is H or a substituent group; Y and Z are the same or different and are H or are independently selected from alkyl, aryl and heteroaryl groups; provided that Y and Z taken together with the nitrogen atom may form a 5-10 membered heterocyclic ring.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: December 2, 1997
    Assignee: Eastman Kodak Company
    Inventors: Bernard Arthur Clark, Robert Nicholas Gourley, Hamish McNab, Craig Cameron Sommerville
  • Patent number: 4052379
    Abstract: Azo dyes having the general formula: ##STR1## wherein R.sub.1 represents a substituent selected from the group consisting of hydrogen, methyl, ethyl, methoxy, ethoxy, halogen, nitro, acetyl, carbomethoxy, carboethoxy, cyano and thiocyanate, and A is an aniline, 1,2,3,4-tetrahydroquinoline or benzomorpholine coupling component, may be used as conventional disperse dyes on polyester, polyamide, acrylic, triacetate and other synthetic fabrics, and some are particularly suitable for use in the transfer printing of polyesters and polyamides.
    Type: Grant
    Filed: December 18, 1975
    Date of Patent: October 4, 1977
    Assignee: Eastman Kodak Company
    Inventor: Robert Nicholas Gourley
  • Patent number: 3971027
    Abstract: A vertical radio-interferometer sector-definition system, using an array of aerial elements which are arranged in a vertical straight line and are symmetrically disposed about the center of the array, which is unaffected by ground-reflected indirect-path signals.If .theta. is the angle of arrival, by a direct path, of a signal and p is the ground reflection coefficient, then from a symmetrical pair of aerial elements is derived a product of two functions f.sub.1 (.theta.).f(p) and from another symmetrical pair is derived another product f.sub.2 (.theta.).f(p): division of one product by the other "cancels out" f(p) to provide a quotient signal which is a function of .theta. but not of p. Either or both product functions may be derived with or without the aid of a central element.
    Type: Grant
    Filed: November 13, 1974
    Date of Patent: July 20, 1976
    Assignee: U.S. Philips Corporation
    Inventors: Robert Nicholas Alcock, Richard Paul Vincent, Stephen Joseph Robinson