Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a graphitic via in the interconnect region. The graphitic via vertically connects a first interconnect in a first interconnect level to a second interconnect in a second, higher, interconnect level. The graphitic via includes a cohered nanoparticle film of nanoparticles in which adjacent nanoparticles cohere to each other, and a layer of graphitic material disposed on the cohered nanoparticle film. The nanoparticles include one or more metals suitable for catalysis of the graphitic material. The cohered nanoparticle film is formed by a method which includes an additive process. The graphitic via is electrically coupled to an active component of the integrated circuit.

Abstract: The present invention provides modular trays having cutout features that are configured to engage with a mounting feature of one or more removable rails. The removable rails may be removably secured to a tray body in a plurality of positions to allow a user to install or uninstall rails to support different sized fiber optic modules. For example, a tray may support a twenty-four optical fiber module, two twelve optical fiber modules, or three eight optical fiber modules. Fiber optic enclosures housing the trays can be affixed to the outside of a fiber optic enclosure and allow for easy stacking and unstacking.

Abstract: Various embodiments of an aquarium and its method of use are disclosed. In some embodiments, the aquarium includes a first container for holding water and fish, plants, and/or other aquatic organism, a second container for collecting dirty water, and a passageway arranged to flush water from the first container to the second container. The passageway is in fluid communication with an outlet of the first container. The second container is arranged to receive the outlet such that fluid flows from the passageway, through the outlet, and into the second container. The outlet may be selectively opened by a user via a valve. Opening the valve causes gravity to flush water and debris from the first container, through the passageway, through the valve and into the second container, where the dirty water can be stored or discarded by disconnecting the second container from the aquarium ad dumping the dirty water.

Abstract: A channel equalization enclosure equalizes the length of cable variance with customers' equipment in a data center. The channel equalization modules serve as a connection point between cable from a financial institution and patch cords connected to customer equipment. The channel equalization enclosure includes a housing and a plurality of channel equalization modules mounted in the housing. Each channel equalization module has a spool of bulk fiber for accommodating a specified fiber length to equalize a communication channel in the data center.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

Abstract: Some examples include a machine-readable storage medium with instructions executable by a processing resource of a device to process a file according to a pre-defined workflow. The machine-readable storage medium comprises instructions to receive a message to process the file at a workflow queue, to forward the file, by a policy workflow worker, to a first workflow process worker that corresponds to the file, and to perform, at the first workflow process worker, a first workflow process on the message. The machine-readable storage medium further comprises instructions to return, by the first workflow process worker, the processed message to the workflow queue, wherein the processed message includes the file and a first result, to evaluate, by the policy workflow worker, the processed message against the pre-defined workflow and, based on the evaluation, to forward the processed message, by the policy workflow worker, to a second workflow process worker or an output queue.

Abstract: An integrated circuit has a thermal routing structure above a top interconnect level. The top interconnect level includes interconnects connected to lower interconnect levels, and does not include bond pads, probe pads, input/output pads, or a redistribution layer to bump bond pads. The thermal routing structure extends over a portion, but not all, of a plane of the integrated circuit containing the top interconnect level. The thermal routing structure includes a layer of nanoparticles in which adjacent nanoparticles are attached to each other. The layer of nanoparticles is free of an organic binder material. The thermal routing structure has a thermal conductivity higher than the metal in the top interconnect level. The layer of nanoparticles is formed by an additive process.

Abstract: Filtering device (20) to draw water from an aquarium and the like and make water circulate inside, including a container (30) comprising a first housing portion (32) having a first inlet (174) and a second inlet (176) for the entry of water taken from the aquarium into the first housing portion (32) which is able to contain at least one filter for filtering water, further including a flow control device (50) having an entry (60) for taking water from the aquarium and it has two operating positions, a first operating position or filtering position wherein the entry (60) is in communication with the first inlet (174), so that water taken from the aquarium is put into the first housing portion (32), passes through the first inlet (174), is filtered and then is put back into the aquarium, and a second operating position or cleaning position or backwash position, wherein the entry (60) is in communication with the second inlet (176), water taken from the aquarium enters into the first housing portion (32) through

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: Examples described herein include receiving text of an email, determining a header of an email message in the email, and determining a body of the email message. Examples also include modifying the text of the email to indicate a beginning boundary and an ending boundary of the header, modifying the text of the email to indicate a beginning boundary and an ending boundary of the body, generating a hash of the header, generating a hash of the body, and tracing the email based on the hash of the header.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: An integrated circuit has a substrate and an interconnect region disposed on the substrate. The interconnect region includes a plurality of interconnect levels. Each interconnect level includes interconnects in dielectric material. The integrated circuit includes a graphitic via in the interconnect region. The graphitic via vertically connects a first interconnect in a first interconnect level to a second interconnect in a second, higher, interconnect level. The graphitic via includes a cohered nanoparticle film of nanoparticles in which adjacent nanoparticles cohere to each other, and a layer of graphitic material disposed on the cohered nanoparticle film. The nanoparticles include one or more metals suitable for catalysis of the graphitic material. The cohered nanoparticle film is formed by a method which includes an additive process. The graphitic via is electrically coupled to an active component of the integrated circuit.

Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: Chip scale package such as a chip scale package having a chip integrated therein to provide an integrated chip scale package.

Abstract: The present invention provides modular trays having cutout features that are configured to engage with a mounting feature of one or more removable rails. The removable rails may be removably secured to a tray body in a plurality of positions to allow a user to install or uninstall rails to support different sized fiber optic modules. For example, a tray may support a twenty-four optical fiber module, two twelve optical fiber modules, or three eight optical fiber modules. Fiber optic enclosures housing the trays can be affixed to the outside of a fiber optic enclosure and allow for easy stacking and unstacking.

Abstract: A system for gathering and displaying data related to a wearer's performance and satisfaction in performing a job includes a wearable device to be worn by the wearer while performing the job. The wearable device includes sensors and is configured to collect and store data elements with values pertaining to one or more conditions associated with the ambient environment and/or the wearer. The wearable device also includes input and output devices to collect feedback data element regarding the wearer's job satisfaction. A server stores and analyzes the data elements to determine a job satisfaction score for the wearer and a correlation score that indicates a correlation between the job satisfaction values and one or more data elements pertaining to the ambient environment and/or the wearer. A reporting interface reports the job satisfaction and the correlation scores. A control interface allows an administrator to control settings related to operation of the system.

Abstract: The present invention relates to the field of safety management of one or more vehicles, and more particularly, to a system and method for analyzing information relating to a vehicle's performance characteristics such as speed against environmental attributes such as speed limits to assess a vehicle and operator's tendency to operate according to preset or other criteria.