Abstract: A novel AC superconducting article comprising a composite structure having a superconducting surface along with a high thermally conductive material wherein the superconducting surface has the desired physical properties, geometrical shape and surface finish produced by the steps of depositing a superconducting layer upon a substrate having a predetermined surface finish and shape which conforms to that of the desired superconducting article, depositing a supporting layer of material on the superconducting layer and removing the substrate, the surface of the superconductor being a replica of the substrate surface.

Abstract: A component card assembly includes a grooved guide adapted to interengage a component card edge between the card receiving and base ends of a support frame. The guide is fixedly attached to the frame base end and comprises an elastically elongatable section. A lever pivotally mounted on the card engages the guide at the frame card receiving end. The pivoting of the lever into a locked position on the frame elastically elongates the guide whereby the component card is controllably restrained in a home position on the frame.

Abstract: A method for selectively controlling the plating thickness on opposing sides of a body is disclosed. The method comprises providing an assembly of the body to be plated, a shield having apertures therein and a sealing member between body to be plated and the shield. The sealing member has an opening to allow plating solution to reach one surface of the body to be plated and has further openings to allow gases and depleted solution to escape from the assembly. The process provides a thinner layer of plated metal on the inner surface of the body to be plated and a thicker layer in the outer surface. It is particularly useful in plating ceramic circuit boards.