Abstract: A system for payload delivery and drone recovery, wherein the system functions with the use of a lightweight parachute and a directional control module. The system can include a drop system for payload delivery, wherein the drop system releases the parachute and payload upon reaching a target site. The system can also include a recovery system, wherein the recovery system deploys the parachute and steers the failed drone to a target site. A lightweight ram-air parachute is used to provide a lighter steerable parachute system.

Abstract: A robotic palletizer system and method include selectively operating a palletizing robot between at least a pregrouping state, in which the palletizing robot groups to-be-grouped items at a pregrouping station, and a principal grouping state, in which the palletizing robot groups to-be-grouped items at a principal grouping station. The system and method further include selectively operating a load securing machine between a securing state, in which the load securing machine at least partially secures to be grouped items grouped at the principal grouping station, and a non-operational state. The palletizing robot can be operated in the pregrouping state during at least a portion of a time interval during which the load securing machine is operating in the securing state to secure the to-be-grouped items grouped at the principal grouping station.

Abstract: A robotic palletizer system and method include selectively operating a palletizing robot between at least a pregrouping state, in which the palletizing robot groups to-be-grouped items at a pregrouping station, and a principal grouping state, in which the palletizing robot groups to-be-grouped items at a principal grouping station. The system and method further include selectively operating a load securing machine between a securing state, in which the load securing machine at least partially secures to be grouped items grouped at the principal grouping station, and a non-operational state. The palletizing robot can be operated in the pregrouping state during at least a portion of a time interval during which the load securing machine is operating in the securing state to secure the to-be-grouped items grouped at the principal grouping station.

Abstract: An apparatus displaces and positions items in a predetermined configuration. The apparatus includes a grouping station, a grouping manipulator using at least two degrees of freedom and having a prehension end-effector and a placing manipulator using at least four degrees of freedom and having a prehension end-effector. The grouping manipulator is configured to pick items at a first item location, displace the items towards the grouping station, and release the items at the grouping station to form a group of items. The placing manipulator is configured to pick the group of items at the grouping station, change an orientation of the group of items, and release the group of items at a receiving station in the predetermined configuration. A method displaces and positions items in a predetermined configuration.

Abstract: An apparatus displaces and positions items in a predetermined configuration. The apparatus includes a grouping station, a grouping manipulator using at least two degrees of freedom and having a prehension end-effector and a placing manipulator using at least four degrees of freedom and having a prehension end-effector. The grouping manipulator is configured to pick items at a first item location, displace the items towards the grouping station, and release the items at the grouping station to form a group of items. The placing manipulator is configured to pick the group of items at the grouping station, change an orientation of the group of items, and release the group of items at a receiving station in the predetermined configuration. A method displaces and positions items in a predetermined configuration.

Abstract: A method of making a glass lenticular array is provided. The method comprises: heating a sheet of glass, the sheet of glass comprising contact regions located thereupon in substantially parallel linear rows; and deforming the heated sheet of glass by contacting the contact regions with a forming body so as to form a plurality of cylindrical lenses in the heated sheet of glass, the plurality of cylindrical lenses arranged in substantially parallel rows with depressed regions between adjacent cylindrical lenses. The depressed regions are formed at the contact regions while apex regions of the cylindrical lenses are kept untouched during the step of deforming.

Abstract: A method and apparatus is provided for attaching a bulk element processing an optical beam to a PLC and optically aligning the bulk element with an optical element formed on the PLC. The method begins by securing the bulk element to a first side of a substrate. A first side of a flexure element is secured to the first side of the substrate. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the bulk element and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the substrate to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the bulk element and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.

Abstract: A method and apparatus is provided for attaching a bulk element processing an optical beam to a PLC and optically aligning the bulk element with an optical element formed on the PLC. The method begins by securing the bulk element to a first side of a substrate. A first side of a flexure element is secured to the first side of the substrate. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the bulk element and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the substrate to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the bulk element and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.

Abstract: A method and apparatus is provided for attaching a external optical component processing an optical beam to a PLC and optically aligning the external optical component with an optical element formed on the PLC. The method begins by securing the external optical component to a first side of a submount. A first side of a flexure element is secured to the first side of the submount. A second side of the flexure element is secured to a first side of the PLC on which the optical element is formed such that the external optical component and the optical element are in optical alignment to within a first level of tolerance. Subsequent to the step of securing the second side of the flexure element, a force is exerted on at least a second side of the submount to thereby flex the flexure element. The force causes sufficient flexure of the flexure element to optically align the external optical component and optical element to within a second level of tolerance that is more stringent than the first level of tolerance.

Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.

Abstract: An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.

Abstract: An optical receiver module includes a silicon wafer defining opposed first and second surfaces and having a transverse opening through the silicon wafer. The opening has at least two generally planar surfaces which intersect to form a V-shaped registration comer. An optical detector is secured to the first surface of the silicon wafer adjacent the opening, and an optical fiber has an end portion positioned within the transverse opening. The optical fiber has an outer surface in contact with the generally planar surfaces to position the end portion of the optical fiber within the opening. A fiber holder includes a pair of silicon chips, each having a V-groove. The optical fiber is positioned in the V-grooves and sandwiched between the silicon chips. The silicon chips are secured to the silicon wafer to retain the optical fiber.

Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.

Abstract: An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330, 230, and/or 30) forming a transmission line (340) for propagating high frequency signals.

Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.

Abstract: According to the present invention, an optical waveguide is provided on a silica or silicon substrate using MPACVD and ICP etching processes. Optical fiber is coupled to the waveguide by positioning the fiber in a groove formed in the waveguide and compressing a top lid on the fiber. The top lid is secured to the waveguide and fiber by an epoxy or a solder. In a solder based embodiment, the cladding of the fiber may have a metallization evaporated thereon.

Abstract: The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

Abstract: The present invention involves a combination of active and passive optical or opto-electronic device alignment techniques. Passive alignment is used for two axial lateral directions and all three axial rotational directions (yaw, pitch and roll). In such passive alignment, only the substrate is micromachined with passive alignment structures. One-dimensional active alignment is then used for the remaining axial lateral direction.

Abstract: An optical subassembly for monitoring the emission of a semi-conductor laser is disclosed. The subassembly is diced from a wafer having mounted thereon the devices to be tested as well as the testing optical devices. The devices of the wafer are burned-in and those sections of the wafer having lasers that pass the burn-in testing are diced and form the subassemblies of the present invention.