Abstract: The present invention relates to a novel, accurate, passive alignment of optical and optoelectronic elements using silicon waferboard technology. The invention particularly relates to the use of etched v-grooves on monocrystalline materials in conjunction with alignment spheres to effect the passive alignment.

Abstract: A planar hybrid optical amplifier is fabricated on a single crystal substrate. The components that are common to a variety of optical amplifier circuits are mounted on the substrate and the planar device that results is readily interchanged in various applications. In one embodiment the multiplexed signal consisting of light from a pump laser and an optical signal are introduced into a rare earth doped fiber which amplifies the input signal through stimulated emission of radiation.

Abstract: A dielectric substrate of a material such as silicon is used to provide controlled impedance waveguides for coupling an optoelectronic device to an electronic device. The impedance is controlled by varying the thickness of the dielectric between the signal lines and the ground plane. In the preferred embodiment, the crystallographic structure of the silicon is employed to achieve great precision of the dielectric thickness.

Abstract: A passively aligned optical interconnect is described for use as a wavelength division multiplexer (WDM) and demultiplexer. The device makes use of silicon waferboard for a low cost interconnect. Computer generated holograms are used to effect the multiplexing/demultiplexing as well as focusing of the beams. In an alternative embodiment, the device is used as a beam splitter for monochromatic light. In yet another embodiment, the device is used to spatially separate the polarization states of light.

Abstract: A passively aligned bi-directional optoelectronic transceiver module assembly utilizes a computer generated hologram as a diffractor to split/combine light beams of two different wavelengths. The entire assembly is constructed of monocrystalline silicon which is photolithographically batch processed to provide a low cost, compact structure with precision tolerances which is inherently passively aligned upon assembly.

Abstract: A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.

Abstract: The disclosure describes an optical interconnect which utilizes a silicon waferboard (1) with grooves (3,4) etched to expose preferred crystallographic planes to effect alignment of focusing elements (5) between optical waveguides (6) and optoelectronic devices (2). The focusing elements (5) are made of silicon wafers and are etched to expose crystal planes which compliment crystal planes of cavities or grooves which are etched in the waferboard. The focusing elements may have holograms (7) formed thereon for efficient focusing to the optical waveguide (6).

Abstract: An opto-electronic interconnect is disclosed that provides for optical communication between chip devices. Optical signals, transmitted from one of the edges of a first chip device, are directed by a lens focusing apparatus to the edge of a second chip device, whereupon the signal is detected. The optical ports for transmission or reception of the optical signals are grouped into an optical segment, which may have either a semi-circular or planar geometry.

Abstract: A method of compensating for the angular coupling of optical fibers to a tilted facet optoelectronic component involves a precise calculation of the coupling angle with respect to the active layer of the component and with respect to the side walls of the package in which the component is to be mounted. With these angles computed, the tilted facet component is positioned on a carrier at an offset to the perpendicular such that input/output fibers can exit the component package perpendicularly to its sidewalls. The component is secured to the carrier by a solder having a high melting point such that subsequent soldering of parts to the carrier will not affect the component positioning. A localized cooling method then allows the sequential alignment and soldering of one optical fiber at a time to the offset tilted facet component, while previously aligned and soldered optical fibers are held fixed.

Abstract: A method for optically coupling multiple single-mode optical fibers to a single packaged optoelectronic array device uses a single graded index lens to magnify the images of the active semi-conductor elements and to expand the spacing between their light beams. These separated magnified light beams then coupled to an associated array of uptapered optical fibers. Simultaneous alignment is possible because the location of the semiconductor array beams can be known with high precision relative to the central beam in the array. A lens with known magnification is first positioned relative to the central beam. Alignment to this central beam automatically aligns other optical fibers held collectively in a fixture engineered with the geometry set by the known magnification of the lens. The coupling of single-mode optical fiber to two-dimensional semiconductor surface arrays utilizes the projected and magnified beams of the array which replicate the precise placement of the array elements.

Abstract: A method of optically coupling an optoelectronic device having a photoactive element to an uptapered single-mode optical fiber which connects said optoelectronic device to an external device includes securing a graded index lens to a substrate carrier within a housing at a distance calculated to provide a known magnification of a light beam emanating from said element, and further includes mechanically positioning and actively aligning the fiber to said magnified light beam to achieve optimal optical coupling to said optoelectronic device. The location of a plurality of reference marks and surfaces are determined such that the photoactive element, the lens and the uptapered end of the single-mode optical fiber may be positioned with respect to these references for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate.

Abstract: A package for an optoelectronic device, such as a laser, having a photo-active element optically coupled to an uptapered single-mode optical fiber which connects said optoelectronic array to an external device includes a housing having a solderable substrate to which the device is secured, a graded index lens also secured to said substrate at a distance calculated to provide a known magnification of light beam emanating from said laser and an uptapered single-mode optical fiber mechanically positioned and actively aligned to said mangified light beam to achieve optimal optical coupling to said optoelectronic device. The package includes a plurality of reference marks and surfaces such that the laser, the lens and the uptapered end of a single-mode optical fiber may be positioned for precise optical coupling using an active alignment for final adjustments. The reference surfaces include a pedestal for the laser and a plurality of stops for the lens integrally formed with the substrate.

Abstract: A package for an optoelectronic array device having an array of n active elements optically coupled to an array of n single-mode optical fibers which connect said optoelectronic array to an external device includes a housing having a solderable substrate to which the array device is secured, a graded index lens also secured to said array at a distance calculated to provide a known magnification of light beams emanating from said array and n uptapered single-mode optical fibers actively aligned to said magnified light beams to achieve optimal optical coupling to said optoelectronic array. The package optionally includes a multifiber holder having precisely calculated spacing based on the spacing of said active elements which are usually semiconductor lasers and the magnification of said lens. For a two-dimensional surface array, the package includes a mandrel to position the uptapered optical fibers.

Abstract: A localized cooling method allows the sequential alignment and soldering of one optical fiber at a time to a semiconductor package, while previously aligned and soldered optical fibers are held fixed. This method utilizes the mechanical property of a sharp melting point eutectic alloy solder or a pure metal solder for the fiber connections and is effective for multi-fiber optoelectronic packages demanding stability and high precision. A package design for optoelectronic components requiring multi-fiber alignment incorporates this feature of localized cooling internally. The localized cooling method and the novel package utilizing this method internally make it possible to eliminate the tilted angle optical fiber alignment problem by mounting tilted facet optical amplifier components at a predetermined offset angle.

Abstract: An apparatus and method for registration or alignment of thin film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system. On particular the alignment apparatus is comprised of a mask holder assembly, which supports the apertured mask, and a substrate carrier which engages with the holder assembly. Upon placing the engaged alignment apparatus in a a deposition chamber, a magnet is positioned adjacent the holder assembly in order to formly hold the apertured mask against a substrate prior to vacuum to deposition. Upon depositing the pattern material, the magnet and holder assembly are disengaged, resulting in a pattern of thin film structures remaining on the substrate. The present invention is effective for remotely operating automatic masking systems where there is a need to eliminate the need for breaking vacuum in a deposition system.

Abstract: A thin film electroluminescent display device energized with a rapid burst of pulses during a time less than the decay time of the phosphor yields substantially increased light output. Preferably, a burst of between two and forty pulses having a duration in the range between 5 and 20 microseconds and having alternating polarities is applied to the device. The pulse burst technique is advantageously applied to a dot matrix type EL display panel operating at a 60 Hz refresh rate. For a 512.times.256 element display panel, each row is addressed for approximately 65 microseconds, and four pulses of about 12-15 microseconds each are applied to the EL pixels during each row address time. The pulse burst technique provides increased brightness while minimizing the retained image problem.

Abstract: A method of aligning thin-film structure patterns on a substrate formed with the use of an apertured mask in a vacuum deposition system.

Abstract: A shadow mask is provided which can provide a precise patterning to a deposit at process temperature without destruction of the shadow mask itself. The shadow mask consists of a plurality of metallic strips having a series of interconnecting small arched bridges that hold the strips of the mask together. The shadow mask is used in a process for depositing electrode structures in an electroluminescent device wherein the mask is positioned over a substrate surface to be coated and deposit electrode material is sprayed from a geometrically broad source, through the mask and onto the substrate. Deposition occurs beneath the arched bridges resulting in a pattern deposition that does not readily reveal the presence of bridges because sufficient material is coated beneath to provide cosmetic and electrical continuity between areas separated by the bridges. This invention is particularly suited for a mask designed to provide a fine pattern of closely spaced parallel lines or electrode structures.

Abstract: The present invention provides a means of relieving stress on an apertured mask, typically used to deposit thin-film structures on a glass substrate, such that the mask easily conforms to the substrate surface when the mask is in its hold down and patterning position during the deposition process. In particular, the present invention provides a mask assembly having a structurally relieved inner apertured mask portion from an outer mask portion that serves to eliminate wrinkles or crimps in the mask during deposition which may produce unacceptable blurs or shorts between thin-film structures. The stress relieving feature includes a slot which is disposed peripherally about the inner mask and two small segments providing the interconnection between the inner and outer mask of the mask assembly.

Abstract: A photoelectrochemical cell comprising a sealed container having a light-transmitting window for admitting light into the container across a light-admitting plane, an electrolyte in the container, a photoelectrode in the container having a light-absorbing surface arranged to receive light from the window and in contact with the electrolyte, the surface having a plurality of spaced portions oblique to the plane, each portion having dimensions at least an order of magnitude larger than the maximum wavelength of incident sunlight, the total surface area of the surface being larger than the area of the plane bounded by the container, and a counter electrode in the container in contact with the electrolyte.