Abstract: Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.

Abstract: Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.

Abstract: Information handling system (IHS) component immersion cooling systems and methods may employ a cold plate disposed on one or more IHS components of an IHS disposed in an immersion cooling tank and an immersible immersion fluid pump adapted to be deployed in the immersion cooling tank, the immersible immersion fluid pump in fluid flow communication with the cold plate, directing flow of immersion fluid in the immersion cooling tank to the cold plate. The immersible immersion fluid pump may be disposed on the cold plate or in an equipment bay of the IHS. A manifold may distribute flow from first and/or second immersible immersion fluid pump(s) to first and second cold plates. Power, etc. may be provided to the immersible immersion fluid pump via (a) fan connection(s) provided by the IHS. Tubing may extend from an outlet of the cold plate away from other components of the IHS.

Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.

Abstract: A cooling system interface for system cooling of a plurality of memory modules comprises a plurality of thermal interface material (TIM) blankets and a heatsink comprising a plurality of conductive fins. A TIM blanket may be positioned on each memory module and the heatsink may be positioned relative to the array of memory modules such that a conductive fin is positioned between two adjacent memory modules and a conduction fin is positioned relative to the memory modules on each end of the array. Each TIM blanket comprises a thickness based on components on the memory module and each conduction fin has a rigidity and thickness to ensure conformal contact between the TIM blanket and a conduction fin. Slidable contact between the conduction fins and TIM blankets allows the cooling system interface to be removed for servicing the memory module.

Abstract: An electronic device includes a packaged device and a thermal dissipater. The packaged device includes a component that generates thermal energy, a package that encapsulates the component, and an interconnect that forms a portion of a high thermal conduction between the component and a circuit card. The thermal dissipater obtains the thermal energy using the circuit card and radiates the thermal energy.

Abstract: A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may receive ambient temperature limits of information handling systems; may receive ambient temperatures associated with the information handling systems; may determine ambient temperature margins based at least on the ambient temperature limits and the ambient temperatures; may determine that each ambient temperature margin of the ambient temperature margins is above an ambient temperature margin threshold of ambient temperature margin thresholds associated with the information handling systems; in response to determining that each ambient temperature margin of the ambient temperature margins is above the ambient temperature margin threshold of the ambient temperature margin thresholds associated with the information handling systems, may determine that a supply air temperature of the computer room is to be increased; and may reduce a duty cycle of a cooling system of a computer room air handler associated with the computer room.

Abstract: In one or more embodiments, one or more systems, methods, and/or processes may receive ambient temperature limits of information handling systems; may receive ambient temperatures associated with the information handling systems; may determine ambient temperature margins based at least on the ambient temperature limits and the ambient temperatures; may determine that each ambient temperature margin of the ambient temperature margins is above an ambient temperature margin threshold of ambient temperature margin thresholds associated with the information handling systems; in response to determining that each ambient temperature margin of the ambient temperature margins is above the ambient temperature margin threshold of the ambient temperature margin thresholds associated with the information handling systems, may determine that a supply air temperature of the computer room is to be increased; and may reduce a duty cycle of a cooling system of a computer room air handler associated with the computer room.

Abstract: Components installed on a topside of printed circuit board (PCB), such as a motherboard, are provided airflow cooling by a plurality of cooling fans located on a proximal end of the PCB. A hardware component is installed on the topside of a distal end of the PCB, furthest from the cooling fans. The hardware component includes cooling elements that extend to the underside of the PCB. Cooling the hardware component is complicated by the distance from the cooling fans and the cooling elements that extend below the PCB. A plenum extending from the proximal end of the PCB towards the distal end of the PCB is installed on the underside of the PCB. The plenum draws airflow from the cooling fans and delivers the airflow to the hardware component along the underside of the PCB, thus avoiding heating by the components on the topside of the PCB.

Abstract: A chassis includes a front and back portion. The front portion includes a plurality of compute devices and a first plurality of fans. The back portion includes a plurality of input/output devices and a second plurality of fans. A first airflow zone extends from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans. A second airflow zone extends from the front portion to the back portion, the second airflow zone to provide a second airflow from the first fans to the input/output devices, and to isolate the second airflow from the first airflow zone.

Abstract: A fan characterization and control system includes a chassis housing a plurality of components and a fan system. A controller system is coupled to the components and the fan system and configured to detect fan devices in the fan system that are connected to the controller system via respective fan connectors. The controller system determines fan performance categories of each of the fan devices based on signals communicated by each of the fan devices through at least one pin on the respective fan connectors. The controller system accesses a fan performance database that stores different fan performance categories and respective fan performance characteristics for each of the different fan performance categories. The controller system uses fan performance information that is associated in the fan performance database with each of the fan performance categories determined for the fan devices to configure the components and the fan system for operation.

Abstract: A fan characterization and control system includes a chassis housing a plurality of components and a fan system. A controller system is coupled to the components and the fan system and configured to detect fan devices in the fan system that are connected to the controller system via respective fan connectors. The controller system determines fan performance categories of each of the fan devices based on signals communicated by each of the fan devices through at least one pin on the respective fan connectors. The controller system accesses a fan performance database that stores different fan performance categories and respective fan performance characteristics for each of the different fan performance categories. The controller system uses fan performance information that is associated in the fan performance database with each of the fan performance categories determined for the fan devices to configure the components and the fan system for operation.

Abstract: A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

Abstract: A fan characterization and control system includes a chassis housing a plurality of components and a fan system. A controller system is coupled to the components and the fan system and configured to detect fan devices in the fan system that are connected to the controller system via respective fan connectors. The controller system determines fan performance categories of each of the fan devices based on signals communicated by each of the fan devices through at least one pin on the respective fan connectors. The controller system accesses a fan performance database that stores different fan performance categories and respective fan performance characteristics for each of the different fan performance categories. The controller system uses fan performance information that is associated in the fan performance database with each of the fan performance categories determined for the fan devices to configure the components and the fan system for operation.

Abstract: A chassis includes a compute device and a liquid cooling enablement module. The compute device includes a processor, a cold plate, and first cold and hot liquid lines. The first cold liquid line directs cool liquid from a first cold liquid interconnect of the compute device to the cold plate. The first hot liquid line directs heated liquid from the cold plate to a first hot liquid interconnect of the compute device. The liquid cooling enablement module is a modular self-contained component, and includes a second cold liquid interconnect, and a second hot liquid interconnect. The second cold liquid interconnect directs the liquid from the liquid cooling enablement module to the first cold liquid line via the first cold liquid interconnect. The second hot liquid interconnect directs the liquid from the first hot liquid line to the liquid cooling enablement module via the first hot liquid interconnect.

Abstract: A chassis includes a front and back portion. The front portion includes a plurality of compute devices and a first plurality of fans. The back portion includes a plurality of input/output devices and a second plurality of fans. A first airflow zone extends from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans. A second airflow zone extends from the front portion to the back portion, the second airflow zone to provide a second airflow from the first fans to the input/output devices, and to isolate the second airflow from the first airflow zone.

Abstract: A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.

Abstract: An enhanced airflow chassis system includes a component chassis that defines a chassis enclosure including a chassis entrance and component slots. First component carriers are mounted to first components and positioned in each of the component slots. Each first component carrier defines first component carrier airflow apertures that direct airflow entering the chassis entrance to the first component mounted to that first component carrier. A backplane located in the chassis enclosure opposite the component slots from the chassis entrance defines backplane airflow apertures and includes a component connector located adjacent each of the component slots that is connected to the first component mounted to the component carrier positioned in that component slot.

Abstract: A fan characterization and control system includes a chassis housing a plurality of components and a fan system. A controller system is coupled to the components and the fan system and configured to detect fan devices in the fan system that are connected to the controller system via respective fan connectors. The controller system determines fan performance categories of each of the fan devices based on signals communicated by each of the fan devices through at least one pin on the respective fan connectors. The controller system accesses a fan performance database that stores different fan performance categories and respective fan performance characteristics for each of the different fan performance categories. The controller system uses fan performance information that is associated in the fan performance database with each of the fan performance categories determined for the fan devices to configure the components and the fan system for operation.