Patents by Inventor Robert Boyd Curtis

Robert Boyd Curtis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170188485
    Abstract: An enhanced airflow chassis system includes a component chassis that defines a chassis enclosure including a chassis entrance and component slots. First component carriers are mounted to first components and positioned in each of the component slots. Each first component carrier defines first component carrier airflow apertures that direct airflow entering the chassis entrance to the first component mounted to that first component carrier. A backplane located in the chassis enclosure opposite the component slots from the chassis entrance defines backplane airflow apertures and includes a component connector located adjacent each of the component slots that is connected to the first component mounted to the component carrier positioned in that component slot.
    Type: Application
    Filed: December 28, 2015
    Publication date: June 29, 2017
    Inventors: Chris Everett Peterson, Bernard Strmiska, Robert Boyd Curtis, Richard Andrew Crisp
  • Patent number: 8780550
    Abstract: An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: July 15, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert Boyd Curtis, Robert W. Skoog, Christian L. Belady, Jeffrey N. Metcalf
  • Publication number: 20110209855
    Abstract: A component cooling system comprising a heat spreader 104 configured to contact the top surfaces of components mounted on a component board 102. A heat pipe 106 is attached to the top side of the heat spreader 104. A pair of cooling manifolds 200, where each cooling manifold 200 comprises a body 206 having a channel 320 formed in the body 206 and running from a first end of the body 206 to a second end of the body 206. A fluid inlet 202 attached to the body 206 and coupled to the channel 320. A fluid outlet 204 attached to the second end of the body 206 and coupled to the channel 320. At least one heat pipe clamp 210 movable between an open position and a closed position, the heat pipe clamp 210 configured to hold one end of a heat pipe 106 to the top side of the body 206 when in the closed position.
    Type: Application
    Filed: October 31, 2008
    Publication date: September 1, 2011
    Inventors: Eric Peterson, Robert Boyd Curtis
  • Publication number: 20080074841
    Abstract: An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 27, 2008
    Inventors: Robert Boyd Curtis, Robert W. Skoog, Christian L. Belady, Jeffrey N. Metcalf
  • Patent number: 6674641
    Abstract: A computer chassis includes heat generating components and a fan housing adjacent the components. A plate is mounted in the fan housing. A first flexible member extends from the plate. A second flexible member extends from the plate and is spaced apart from the first member. A grip member interconnects a distal end of the first and second members spaced apart from the plate. A latch extends from adjacent the grip member. An anti-buckle member extends between the first and second members for maintaining the flexible members spaced apart.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: January 6, 2004
    Assignee: Dell Products L.P.
    Inventors: Ralph Warren Jensen, Bruce McLellan, Robert Boyd Curtis
  • Publication number: 20030011985
    Abstract: A computer chassis includes heat generating components and a fan housing adjacent the components. A plate is mounted in the fan housing. A first flexible member extends from the plate. A second flexible member extends from the plate and is spaced apart from the first member. A grip member interconnects a distal end of the first and second members spaced apart from the plate. A latch extends from adjacent the grip member. An anti-buckle member extends between the first and second members for maintaining the flexible members spaced apart.
    Type: Application
    Filed: July 16, 2001
    Publication date: January 16, 2003
    Inventors: Ralph Warren Jensen, Bruce McLellan, Robert Boyd Curtis