Abstract: A multi-factor rate analysis system and method for analyzing service plan rates, service providers, and savings other information is provided. Rate information may be based on one or more of historical and other user specific usage information and preferences, current rate information for one or more services as well as other information. This information way be used to identify one or more rate plans that are advantageous to a user, enable the user to select from the identified plans, facilitate the ability Of the user to switch from one rate plan to another and provide other benefits and advantages.

Abstract: The present invention relates to compounds of the general formula (I) that have activity as S1P receptor modulating agents and the use of such compounds to treat diseases associated with inappropriate S1P receptor activity. The compounds may be used as immunomodulators, e.g., for treating or preventing diseases such as autoimmune and related immune disorders including systemic lupus erythematosus, inflammatory bowel diseases such as Crohn's disease and ulcerative colitis, type I diabetes, uveitis, psoriasis, myasthenia gravis, rheumatoid arthritis, non-glomerular nephrosis, hepatitis, Behçet's disease, glomerulonephritis, chronic thrombocytopenic purpura, hemolytic anemia, hepatitis and Wegner's granuloma; and for treating other conditions.

Abstract: A portable power tool having a housing with a rotation motor for powering a working implement, wherein sensors are provided to indicate the motor speed and the power supply, and a programmable evaluation unit is arranged to compare indicated speed and pressure values with stored limit values, and to accumulate the total operation time of the power tool and compare that with preset time limits for tool service intervals, and an optical information unit is provided on the housing to indicate whether those stored limit values have been reached.

Abstract: The present invention relates to compounds of the general formula (I) that have activity as S1P receptor modulating agents and the use of such compounds to treat diseases associated with inappropriate S1P receptor activity. The compounds may be used as immunomodulators, e.g., for treating or preventing diseases such as autoimmune and related immune disorders including systemic lupus erythematosus, inflammatory bowel diseases such as Crohn's disease and ulcerative colitis, type I diabetes, uveitis, psoriasis, myasthenia gravis, rheumatoid arthritis, non-glomerular nephrosis, hepatitis, Behçet's disease, glomerulonephritis, chronic thrombocytopenic purpura, hemolytic anemia, hepatitis and Wegner's granuloma; and for treating other conditions.

Abstract: A multi-factor rate analysis system and method for analyzing service plan rates, service providers, and savings other information is provided. Rate information may be based on one or more of historical and other user specific usage information and preferences, current rate information for one or more services as well as other information. This information may be used to identify one or more rate plans that are advantageous to a user, enable the user to select from the identified plans, facilitate the ability of the user to switch from one rate plan to another and provide other benefits and advantages.

Abstract: An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame.

Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

Abstract: A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.

Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

Abstract: Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers of the composition include recurring monomers having the formulas where: (1) each R is individually selected from the group consisting of hydrogen, —OH, aliphatics, and phenyls; and (2) L is selected from the group consisting of —SO2— and —CR?2—, where each R? is individually selected from the group consisting of hydrogen, aliphatics, phenyls, and —CX3, where each X is individually selected from the group consisting of the halogens. The resulting compositions are spin bowl compatible (i.e., they do not crosslink prior to the bake stages of the microlithographic processes or during storage at room temperature), are wet developable, and have superior optical properties.

Abstract: Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light, the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers).

Abstract: Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers are copolymers of a compound having the formulas and a compound having the formula where: (1) each R is individually selected from the group consisting of —OH, —NH2, hydrogen, aliphatics, and phenyls; and (2) L is selected from the group consisting of —SO2— and —CR?2—. The resulting compositions are spin bowl compatible (i.e., they do not crosslink prior to the bake stages of the microlithographic processes or during storage at room temperature), are wet developable, and have superior optical properties.

Abstract: Novel, wet developable anti-reflective coating compositions and methods of using those compositions are provided. The compositions comprise a polymer and/or oligomer having acid functional groups and dissolved in a solvent system along with a crosslinker and a photoacid generator. The preferred acid functional group is a carboxylic acid, while the preferred crosslinker is a vinyl ether crosslinker. In use, the compositions are applied to a substrate and thermally crosslinked. Upon exposure to light, the cured compositions will decrosslink, rendering them soluble in typical photoresist developing solutions (e.g., alkaline developers).

Abstract: A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surface that is coplanar with the active upper surface of the semiconductor chip, a first dielectric layer that is arranged on the plastic housing compound surface and on the active upper surface of the semiconductor chip, one or more interposer metallization levels, which are isolated via further dielectric layers and are connected to the active upper surface of the semiconductor chip, and external contact surfaces. The external contact surfaces are formed on the outermost interposer level and facilitate contact data transmission. The smart card module uses no bonding wires and has a very small physical volume.

Abstract: A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.

Abstract: A plastic package and to a semiconductor component including such a plastic package, as well as to a method for its production is disclosed. In one embodiment, the plastic package includes plastic outer faces, which include lower outer contact faces on a lower side of the plastic package and upper outer contact faces on an upper side, which are connected together via outer conductor tracks. The conductor tracks include conduction paths which are formed on exposed conducting deposits in the plastic package.

Abstract: In accordance with an embodiment of the present invention, a Software Communications Application associated with a digital magazine, catalog, book, or other digital media item will request a digital ad from a Digital Advertising Broker. The Digital Advertising Broker will analyze the metadata contained within the data request and send a digital ad to the Software Communications Application along with additional metadata. The Software Communications Application will place the digital advertisement into the digital media item and store the metadata associated with the transaction. The metadata will then be used for future metric and reporting associated with the transaction.

Abstract: One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

Abstract: Methods of preparing polyurethane and polyisocyanurate foams comprising the step of reacting and foaming a mixture of ingredients which react to form the polyurethane or polyisocyanurate foams in the presence of a blowing agent, wherein said blowing agent comprises an azeotrope-like composition consists essentially of 1,1,1,3,3-pentafluoropropane and n-pentane, as well as foams and foamable compositions comprising the azeotrope-like composition.