Abstract: The present invention relates generally to a method of enclosing a via in a dual damascene process. In one embodiment of the disclosed method, the via is etched first and a first barrier metal or liner is deposited in the via, the trench is then etched and a second barrier metal or liner is deposited in the trench, and finally the via and trench are filled or metallized in a dual damascene process, thereby forming a via or interconnect and a line. Alternatively, the trench may be etched first and a first barrier metal or liner deposited in the trench, then the via is etched and a second barrier metal or liner is deposited in the via, and finally the trench and via are filled or metallized in a dual damascene process. The barrier metal or liner encloses the via, thereby reducing void formation due to electromigration.

Abstract: Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.

Abstract: Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.

Abstract: Substantially nonconductive or semiconductive surfaces of through holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.

Abstract: The present invention entails an automatic soil sampling machine that is pulled through the field by a prime mover. A disk is utilized and is power driven by an internal combustion engine or other power source. About the outer circumference of the disk there is provided structure that effectively engages the soil as the disk is powered therethrough and flings the soil upwardly out of the ground into a rooster tail airborne configuration. A catching basket or container is mounted on the soil sampling machine and catches the soil particles being flung from the ground.