Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: Grinding media, including shaped media such as spheres or rods ranging in size from about 0.5 micron to 100 mm in diameter, are formed from a multi-carbide material consisting essentially of two or more carbide-forming elements and carbon, with or without carbide-forming elements in their free elemental state. The media have extremely high mass density, extreme hardness, and extreme mechanical toughness.

Abstract: A card guide of an apparatus in one example comprises a plurality of card guide portions that serve to guide a circuit board into a chassis. The plurality of card guide portions comprise a first card guide portion and a second card guide portion. The first card guide portion serves to guide the circuit board substantially along a first direction during engagement of the circuit board with the first card guide portion. The second card guide portion serves to guide the circuit board substantially along a second direction that is nonlinear with the first direction during engagement of the circuit board with the second card guide portion.

Abstract: One aspect of the present invention provides a server card that is removably insertable into a server chassis. An electronic power switching mechanism is disposed on the server card and is configured to cause three power states of the server card including a fully operational state, a standby state, and a fully shutdown state. In the fully operational state, a system power of the server card is enabled and a standby power of the server card is enabled. In the standby state, a system power of the server card is disabled and the standby power of the server card is enabled. In a shutdown state, the system power of the server card is disabled and the standby power of the server card is disabled.

Abstract: Described are devices for cooling a component, and methods thereof. The device includes a base that can be coupled to the component so that heat is transferred from the component to the base. The device also includes fins coupled to the base. The fins are arranged to funnel air from an air intake end of the device toward a location on the base.

Abstract: An integrally formed chip lid and heat sink of the present invention comprises a chip lid portion, and a heat sink portion formed from said chip lid. The integrally formed chip lid portion and heat sink portion are manufactured as a single part, such that there is no interface between the chip lid portion and the heat sink portion.

Abstract: A circuit board of an apparatus in one example comprises one or more mounting pins that connect the circuit board with a chassis.

Abstract: An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.

Abstract: A method of testing an electronic device. A test pattern is transferred between a first data controller coupled to a first data interface and a second data controller coupled to a second data interface via an element coupling the first and second data interfaces. The test pattern is received and examined.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: A short card support for supporting a short printed circuit card insertable into an electronic system is disclosed. The short card support has a card guide end adapted to couple to the card guide of the electronic system and a card receptor end adapted to couple with a first edge of the short printed circuit card. A support span between the card guide end and the card receptor end permits the short card support to accommodate varying lengths of short printed circuit cards.

Abstract: In one embodiment, the present invention recites a lightpipe having a major axis, a first end, and a second end. A light emitting feature having a defined surface is located along the length of the lightpipe. The light emitting feature is adapted to transmit electromagnetic energy of a specific visible wavelength of light from inside the lightpipe to outside the lightpipe.

Abstract: A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.

Abstract: In one embodiment, the present invention recites a temperature control subsystem for use with an air conditioning system. The temperature control subsystem comprises a temperature sensor located in proximity to a heat-generating device disposed within a housing, where the temperature sensor generates data corresponding to the temperature of the heat-generating device. The temperature control subsystem further comprises an air-flow control feature coupled to the housing, whereby the air-flow control feature is configured to regulate the delivery of cooling air to the housing. Cooling air is provided by the air conditioning system. A local control subsystem is coupled to the air-flow control feature to control the air flow of cooling air to the housing so that the air flow is adjustable to correspond to the temperature data received from the temperature sensor.

Abstract: One embodiment disclosed relates to a system for power management of a group of computers. The system includes server side infrastructure (SSI) circuitry at each computer in the group and a centralized power management module (CPMM). The SSI circuitry includes local monitoring circuitry coupled to a central processing unit (CPU) of the computer. The CPMM has a management link to the SSI circuitry at each computer in the group. The local circuitry at each computer monitors power consumption at the CPU of that computer and transmits power consumption data to the CPMM. The CPMM applies a set of rules to the power consumption data to determine when and at which computers to enable and disable a CPU power throttling mode.

Abstract: A printed circuit board comprises a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board comprises a via signal barrel transecting the first and second conductive planes and a first anti-pad positioned between the first conductive plane and the via signal barrel. The first anti-pad has a first voided area. The printed circuit board comprises a second anti-pad positioned between the second conductive plane and the via signal barrel. The second anti-pad has a second voided area. The first voided area does not completely overlap the second voided area.