Abstract: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.

Abstract: An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.

Abstract: A multi-zone electrical chuck (100) comprises at least two electrically distinct zones or regions. Each zone is electrically isolated from each other zone, and each zone is capable of being set to a different voltage. During semiconductor manufacturing, voltages may be applied to the zones to affect the growth of films onto the surface of a substrate residing on the chuck.