Abstract: An abrasive article includes abrasive particles contained within a hybrid bond that may include a metal bond material and an organic bond material, the article having an average thickness of 250 microns or less and the metal bond material including a solid solution phase and an intermetallic phase distinct from the solid solution phase.

Abstract: An abrasive article includes abrasive particles contained within a hybrid bond that may include a metal bond material and an organic bond material, the article having an average thickness of 250 microns or less and the metal bond material including a solid solution phase and an intermetallic phase distinct from the solid solution phase.

Abstract: Abrasive tools and techniques are disclosed that can cut hard, brittle materials to relatively precise dimensions. The tools, which can include a hybrid bond of metal or metal alloy and a resin matrix together with fine abrasive grits, can be employed, for example, in mirror finish cutting applications, thereby enabling ‘1×’ or ‘single-pass’ multi-function abrasive processes. The specific selection of resin and metal or metal alloy types is such that the tool is sufficiently brittle for the purpose of manufacture and durability, but ductile enough to withstand the grinding and handling stresses (an exemplary hybrid bond includes bronze and polyimide). Numerous tool types and applications will be apparent in light of this disclosure, including abrasive products for electronic device manufacturing such as thin 1A8 blades (single blade or multi-blade configuration).

Abstract: An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub-less blade.

Abstract: An abrasive wheel is used to separate individual laminated chips from a strip by cutting through the copper bridging elements. The abrasive wheel is made up of abrasive particles bonded in a matrix having a high glass transition temperature and a cutting edge having a maximum thickness of the order of 350 micron, whereby the cut is substantially straight and free of smears and burrs.

Abstract: A cutting wheel, especially suitable for dicing silicon wafers and the like, which has a high degree of stiffness as a result of the wheel being a monolith with a thick inner section and thin outer or cutting section.