Patents by Inventor Robert Francis Darveaux

Robert Francis Darveaux has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10770312
    Abstract: Described herein methods of manufacturing dual-sided packaged electronic modules that control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include under-filling one or more components and deflashing a portion of the under-fill to remove under-fill material prior to attaching solder balls. The deflashing step removes a thin layer of under-fill material that may have coated contact pads for the ball grid array. Because the solder balls are not present during under-fill, there is little capillary action drawing material away from the components being under-filled. This can reduce the frequency of voids under the components being under-filled. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using under-fill deflash prior to attaching solder balls of the ball grid array.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 8, 2020
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Robert Francis Darveaux
  • Publication number: 20200227364
    Abstract: According to certain aspects, a method for manufacturing packaged radio-frequency (RF) devices can include: providing a packaging substrate configured to receive a plurality of components, the packaging substrate including a first side and a second side; mounting a first circuit on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where redundant ground pins may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; forming a second overmold structure over the component and the set of through-mold connections; and removing a portion of the second overmold structure.
    Type: Application
    Filed: December 1, 2019
    Publication date: July 16, 2020
    Inventors: Howard E. CHEN, Robert Francis DARVEAUX, Anthony James LOBIANCO
  • Publication number: 20200229298
    Abstract: Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.
    Type: Application
    Filed: December 18, 2019
    Publication date: July 16, 2020
    Inventors: Anthony James LOBIANCO, Howard E. CHEN, Robert Francis DARVEAUX, Hoang Mong NGUYEN, Matthew Sean READ, Lori Ann DEORIO
  • Publication number: 20200219802
    Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.
    Type: Application
    Filed: September 16, 2019
    Publication date: July 9, 2020
    Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
  • Publication number: 20200161222
    Abstract: According to certain aspects, a method can include: providing a packaging substrate having an upper side, a lower side, and a ground plane; implementing a radio-frequency circuit assembly on both of the upper and lower sides; forming an upper overmold on the upper side to cover an upper portion of the radio-frequency circuit assembly; forming one or more openings through the upper overmold to expose contact pads on the upper side; covering an upper surface and the one or more openings of the upper overmold with a conductive layer; implementing a plurality of contact features on the lower side; forming a lower overmold on the lower side to cover a lower portion of the radio-frequency circuit assembly and some or all of each of the contact features on the lower side; and processing the lower overmold to expose the contact features to allow the dual-sided module to be mounted on a circuit board.
    Type: Application
    Filed: July 22, 2019
    Publication date: May 21, 2020
    Inventors: Howard E. CHEN, Robert Francis DARVEAUX, Hoang Mong NGUYEN, Anthony James LOBIANCO
  • Publication number: 20200152483
    Abstract: Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use an encapsulant on solder balls in combination with a dam or a trench to control the distribution of an under-fill material between one or more components and a packaging substrate. The encapsulant can be used in the ball attach process. The fluxing agent leaves behind a material that encapsulates the base of each solder ball. The encapsulant reduces the tendency of the under-fill material to wick around the solder balls by capillary action which can prevent or limit the capillary under-fill material from flowing onto or contacting other components. The dam or trench aids in retaining the under-fill material within a keep out zone to prevent or limit the under-fill material from contacting other components.
    Type: Application
    Filed: October 29, 2019
    Publication date: May 14, 2020
    Inventor: Robert Francis DARVEAUX
  • Patent number: 10636717
    Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: April 28, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap
  • Publication number: 20200107433
    Abstract: A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.
    Type: Application
    Filed: September 30, 2019
    Publication date: April 2, 2020
    Inventors: Bhuvaneshwaran VIJAYAKUMAR, Lori Ann DEORIO, Anthony James LOBIANCO, Hoang Mong NGUYEN, Robert Francis DARVEAUX
  • Patent number: 10607944
    Abstract: A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: March 31, 2020
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Robert Francis Darveaux
  • Publication number: 20200099356
    Abstract: An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 ?m for electromagnetic signals having frequencies in a kilohertz range.
    Type: Application
    Filed: September 20, 2019
    Publication date: March 26, 2020
    Inventors: Dinhphuoc Vu Hoang, Robert Francis Darveaux
  • Patent number: 10593565
    Abstract: Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include forming a trench in a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a trench in a packaging substrate.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: March 17, 2020
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Robert Francis Darveaux
  • Publication number: 20200077510
    Abstract: Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.
    Type: Application
    Filed: August 31, 2019
    Publication date: March 5, 2020
    Inventors: Robert Francis DARVEAUX, Ki Wook LEE, Takeshi FURUSAWA, Sundeep Nand NANGALIA, Russ Alan REISNER, John C. BALDWIN
  • Publication number: 20200075349
    Abstract: Described herein methods of manufacturing dual-sided packaged electronic modules that control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include under-filling one or more components and deflashing a portion of the under-fill to remove under-fill material prior to attaching solder balls. The deflashing step removes a thin layer of under-fill material that may have coated contact pads for the ball grid array. Because the solder balls are not present during under-fill, there is little capillary action drawing material away from the components being under-filled. This can reduce the frequency of voids under the components being under-filled. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using under-fill deflash prior to attaching solder balls of the ball grid array.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 5, 2020
    Inventor: Robert Francis DARVEAUX
  • Patent number: 10524350
    Abstract: A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: December 31, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Anthony James Lobianco, Howard E. Chen, Robert Francis Darveaux, Hoang Mong Nguyen, Matthew Sean Read, Lori Ann Deorio
  • Patent number: 10497656
    Abstract: A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side of the packaging substrate and a first overmold structure implemented on the first side of the packaging substrate, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement redundant ground pins and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: December 3, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Robert Francis Darveaux, Anthony James Lobianco
  • Patent number: 10460957
    Abstract: Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use an encapsulant on solder balls to control the distribution of an under-fill material between one or more components and a packaging substrate. The encapsulant can be used in the ball attach process. The fluxing agent leaves behind a material that encapsulates the base of each solder ball. The encapsulant forms an obtuse angle with the substrate surface and with the ball surface. This reduces the tendency of the under-fill material to wick around the solder balls by capillary action which can prevent or limit the capillary under-fill material from flowing onto or contacting other components. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using an encapsulant on the solder balls.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: October 29, 2019
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Robert Francis Darveaux
  • Patent number: 10418318
    Abstract: An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: September 17, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Robert Francis Darveaux, David McCann, John McCormick, Louis W. Nicholls
  • Patent number: 10410885
    Abstract: Described herein methods of manufacturing dual-sided packaged electronic modules that control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include under-filling one or more components and deflashing a portion of the under-fill to remove under-fill material prior to attaching solder balls. The deflashing step removes a thin layer of under-fill material that may have coated contact pads for the ball grid array. Because the solder balls are not present during under-fill, there is little capillary action drawing material away from the components being under-filled. This can reduce the frequency of voids under the components being under-filled. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using under-fill deflash prior to attaching solder balls of the ball grid array.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: September 10, 2019
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Robert Francis Darveaux
  • Patent number: 10361145
    Abstract: Modules, devices and methods of manufacturing a dual-sided module are disclosed. A dual-sided module includes a packaging substrate having an upper side, a lower side, and a ground plane, a radio-frequency circuit assembly implemented on both of the upper and lower sides of the packaging substrate and an upper overmold implemented on the upper side of the packaging substrate defining one or more openings dimensioned to expose contact pads on the upper side. The module further includes a conductive layer configured to provide shielding for a region on the upper side of the packaging substrate, a lower overmold implemented on the lower side of the packaging substrate to cover a lower portion of the radio-frequency circuit assembly, the lower overmold defining a plurality of openings, and a contact feature implemented within each of the openings of the lower overmold to be in contact with the packaging substrate.
    Type: Grant
    Filed: July 14, 2018
    Date of Patent: July 23, 2019
    Assignee: Skyworks Solutions, Inc.
    Inventors: Howard E. Chen, Robert Francis Darveaux, Hoang Mong Nguyen, Anthony James Lobianco
  • Patent number: RE47890
    Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: March 3, 2020
    Assignee: Amkor Technology, Inc.
    Inventors: Ronald Patrick Huemoeller, David Bolognia, Robert Francis Darveaux, Brett Arnold Dunlap