Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

Abstract: A sub-assembly includes a glass substrate, a plurality of electronic devices, and a passivation layer. The glass substrate includes a first surface, a second surface opposite to the first surface, and a third surface extending between the first surface and the second surface. The glass substrate includes a plurality of laser damaged regions extending from the first surface to the second surface. The plurality of electronic devices are on the first surface of the glass substrate. The passivation layer is on the plurality of electronic devices and the third surface of the glass substrate. The passivation layer includes an opening to each laser damaged region of the plurality of laser damaged regions.

Abstract: Described herein are articles and methods of making articles, for example glass articles, including a sheet and a carrier, wherein the sheet and carrier are bonded together using a coating layer, which is, for example, a fluorocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the sheet, the carrier, or both, to control the fluorine content of the coating layer and van der Waals, hydrogen and covalent bonding between the sheet and the carrier. The coating layer bonds the sheet and carrier together with sufficient bond strength to prevent delamination of the sheet and the carrier during high temperature processing to while preventing a permanent bond at during high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material

Abstract: Disclosed devices (100) include a liquid crystal layer (140), a cover glass (105), a polarizer (115), and at least one anti-static coating disposed on at least one major surface (105A, 105C) of the cover glass, at least one major surface (115A, 115C) of the polarizer, or both. Methods for reducing mura (light leakage) in a touch-display device by means of this anti-static coating are also disclosed.

Abstract: Embodiments are related generally to conductive interconnects formed on substrates, and more particularly to a glass ceramic, or glass-ceramic substrate having copper interconnects disposed thereon.

Abstract: Ceramic assembly can comprise a ceramic article comprising a thickness defined between a first major surface and a second major surface. The thickness can be about 100 micrometers or less. The ceramic assembly can comprise a polymer coating deposited over at least an outer peripheral portion of the first major surface of the ceramic article. The polymer coating can comprise a thickness of about 30 micrometers or less. An edge strength of the ceramic assembly can be greater than an edge strength of the ceramic article by about 50 MegaPascals or more. Methods of forming a ceramic assembly can comprise depositing a polymer coating on an outer peripheral portion of a first major surface of a ceramic article. Methods can further comprise curing the polymer coating.

Abstract: Methods of manufacturing a glass-based article comprise: after mechanical polishing of a glass-based substrate, treating at least one surface of the glass-based substrate for protection of the at least one surface from contamination and/or for removal of contaminants from the at least one surface by a treatment other than ultrasonic cleaning; and exposing the glass-based substrate to an ion exchange treatment after the treating step to form the glass-based article. The treating step includes: exposing the at least one surface to a high pH soaking for removal of contaminants; deionizing the at least one surface for removal of contaminants; and/or applying a temporary coating to the at least one surface for protection of the at least one surface from contamination, and removing the temporary coating prior to the ion exchange treatment step. The ion exchange treatment may comprise a molten salt bath having an increased pH and temperature.

Abstract: A method of making polycrystalline silicon (p-Si), including: depositing amorphous silicon to produce an amorphous silicon super-mesa; dehydrogenating the amorphous silicon; patterning the super-mesa to produce a patterned substrate; depositing a capping oxide layer on the amorphous silicon on the patterned substrate; heating the capped, patterned substrate to the crystallization temperature of the a-Si; and flash lamp annealing the patterned substrate with a xenon lamp to produce p-Si having at least one super-mesa, and the super-mesa having supersized grains. Also disclosed are p-Si articles and devices incorporating the articles, and an apparatus for making the p-Si articles.

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

Abstract: Described herein are electronics that incorporate heterocyclic organic compounds. More specifically, described herein are organic electronics systems that are combined with donor-acceptor organic semiconductors, along with methods for making such devices, and uses thereof.

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Abstract: A polar elastomer dielectric layer is formed on a substrate by dynamically dispensing a solution containing the polar elastomer on the substrate and curing it at an elevated temperature. The polar elastomer can include poly(vinylidene fluoride-co-hexa-fluoropropylene) (e-PVDF-HFP). They dynamic dispensing process can include spinning the substrate at a first speed, depositing the polar elastomer solution on the substrate, and spinning the substrate at a second speed.

Abstract: Disclosed devices include a liquid crystal layer and a cover glass comprising at least one major surface having a depleted or enriched surface layer. Methods for reducing mura in a touch-display device are also disclosed.

Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.

Abstract: A method of making a device substrate article having a device modified substrate supported on a glass carrier substrate, including: treating at least a portion of the first surface of a device substrate, at least a portion of a first surface of a glass carrier, or a combination thereof, wherein the treating produces a surface having: silicon; oxygen; carbon; and fluorine amounts; and a metal to fluorine ratio as defined herein; contacting the treated surface with an untreated or like-treated counterpart device substrate or glass carrier substrate to form a laminate comprised of the device substrate bonded to the glass carrier substrate; modifying at least a portion of the non-bonded second surface of the device substrate of the laminate with at least one device surface modification treatment; and separating the device substrate having the device modified second surface from the glass carrier substrate.

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for reducing substrate surface disruption during via formation.

Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. In one or more embodiments, the interface exhibits an effective adhesion energy of about less than about 4 J/m2. In some embodiments, the interface is modified by the inclusion of a crack mitigating layer containing an inorganic material between the glass substrate and the film.