Abstract: A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

Abstract: A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.

Abstract: A header for an optoelectronic package, the header includes an electrically conducting eyelet and an electrical feedthrough in an opening extending through the eyelet. The eyelet includes a cavity opening to a first side forming a mounting side for accommodating a thermoelectric cooler with a laser diode mounted thereon, so that in operation the laser diode is cooled by the thermoelectric cooler. The cavity is closed at a second side opposite to the first side so that a bottom of the cavity is formed, wherein the wall thickness measured from the bottom to the second side opposite to the first side is lower or less than the thickness of the eyelet.

Abstract: An electrical feedthrough includes a base body having a first side and an opposed second side and at least one through-hole extending through the base body from the first side to the second side, an insulating material received in the through-hole, the insulating material having a first surface on the first side of the base body and an opposed second surface on the second side of the base body, and an electrical conductor extending through the insulating material, the electrical conductor having a first diameter at the location of the first surface of the insulating material and a second diameter at the location of the second surface of the insulating material, wherein the first diameter of the electrical conductor is larger than the second diameter of the electrical conductor.

Abstract: A light transmitting component, in particular for a sensor head or for connection to a coupling light guide is provided, for transmitting electromagnetic radiation, in particular through a wall. The component includes a feed-through coupling element, which is configured for being arranged in a main body or in a wall opening, for incoupling and transmitting the electromagnetic radiation through the feed-through coupling element, in particular through the wall, without divergence. The feed-through coupling element includes a multi core fiber rod (MCR) and is designed with positional offset tolerance so that a lateral positional offset between the feed-through coupling element and a light transmitting component coupled thereto, such as a coupling light guide, of 10 ?m or more, results in a relative signal loss of 10% or less.

Abstract: A multilaser arrangement includes: a housing including a base plate, a housing cap fastened on the base plate, and a transparent element, the base plate including a bottom face, the housing cap including an opening with the transparent element assigned to the opening for the passage of electromagnetic radiation; lasers, each being arranged inside the housing at a distance from the bottom face of the base plate, the housing cap including an upper wall and a side wall, which includes a lower edge and a surface, is formed integrally with the upper wall, and ends with the lower edge fastened on the base plate, the side wall having a first thickness and a second thickness, the first thickness being measured in a direction perpendicular to the surface, the second thickness being measured at the lower edge and being less than or equal to the first thickness.

Abstract: A composite element includes: an outer holder; and an inner component which is held in the outer holder under a compressive stress, the outer holder and the inner component adjoining one another along a contour line which is closed, the contour line including two linear portions and two connecting portions, the two linear portions opposing one another and extending in a straight line, the two connecting portions connecting the two linear portions to form the contour line as closed, at least one of the two connecting portions having an arcuately extending curved region.

Abstract: A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.

Abstract: A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

Abstract: A housing cap for an electronics component includes a main body with an opening which is closed by a window. The window is connected to the main body using a compensation element, wherein there is an integral connection using a first connection material between the compensation element and the window and there is an integral connection using a second connection material between the compensation element and the main body, wherein a first coefficient of thermal expansion of the window is adapted to a second coefficient of thermal expansion of the compensation element or the first coefficient of thermal expansion is lower than the second coefficient of thermal expansion.

Abstract: A multi-fiber light guide includes: light guiding fibers, each fiber including an elongated glass core; a glass cladding, the cores being surrounded by the cladding to form a rigid and continuous glass element, the cores having a higher refractive index than the cladding such that light can be guided by a total reflection along the cores, which end in two abutting faces of the glass element such that light can be guided along the cores from one abutting face to the other abutting face; and an ion exchange layer at each of the abutting faces, the glass of the cores and the glass of the cladding including alkali ions, which are at least partly exchanged by alkali ions of a higher atomic number within the ion exchange layer at the abutting faces, the exchanged alkali ions within the ion exchange layer imparting a compressive stress at the abutting faces.

Abstract: A metal fixing material leadthrough for an igniter of airbags and/or belt tensioners includes a main body having a through-opening formed therein and at least one metal pin fused into a glass or glass-ceramic fixing material in the through-opening and having a core region. The at least one metal pin, at least in its core region, consists of ferritic stainless steel made to the EN 10020 standard. The ferritic stainless steel is selected in such a way that, when converted to a standard dimensioning of a metal pin diameter of 1.00±0.03 mm and a metal pin length of 11.68±0.02 mm, the at least one metal pin has a maximum elastic deflection Wmax of less than 0.24 mm.

Abstract: A metal fixing material leadthrough for igniters of airbags and/or belt tighteners includes at least one metal pin fused into a glass or glass-ceramic fixing material in a through-opening of a main body. The metal is present in a post-heated state, with an interface between the fixing material and the metal pin and an additional interface between the fixing material and an inner surface of the through-opening. The at least one metal pin, at least in its core region, consists of stainless steel, such as a chromium-containing stainless steel, the stainless steel having a thermal expansion coefficient.

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Abstract: A feedthrough includes: a main body including at least one passage opening running through the main body, the main body including titanium or a titanium alloy; an insulation material accommodated in the at least one passage opening running through the main body, the insulation material including glass, the insulation material having a contact angle of less than 90 degrees at least in a plurality of regions of the insulation material with respect to the main body; and at least one electrical conductor extending through the insulation material accommodated in the at least one passage opening.

Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Abstract: A composite element includes: an outer holder; and an inner component which is held in the outer holder under a compressive stress, the outer holder and the inner component adjoining one another along a contour line which is closed, the contour line including two linear portions and two connecting portions, the two linear portions opposing one another and extending in a straight line, the two connecting portions connecting the two linear portions to form the contour line as closed, at least one of the two connecting portions having an arcuately extending curved region.

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

Abstract: A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.