Abstract: A hermetically sealed package includes: at least one cover substrate and a substrate arranged so as to adjoin the at least one cover substrate, which together define at least part of the package, the at least one cover substrate being in a thermally prestressed state and bonded to the substrate adjoining the at least one cover substrate in a hermetically sealing manner by at least one laser bonding line, the at least one cover substrate being made of a material which has a different characteristic value of a coefficient of thermal expansion than the adjoining substrate and a thermal prestress is established in the package; and at least one functional area enclosed in the package.

Abstract: A hermetically sealed package includes: a base substrate and a cover substrate which define at least part of the package, the base substrate and the cover substrate being hermetically sealed to one another by at least one laser bonding line, the at least one laser bonding line having a height perpendicular to its bonding plane, at least the cover substrate including a toughened layer at its surface, at least on a side opposite the at least one laser bonding line; and at least one functional area enclosed in the package.

Abstract: A glass-metal feedthrough includes: an external conductor having a coefficient of expansion ?external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including iron and having a coefficient of expansion ?internal, the external conductor and the internal conductor being configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture; and a glass material surrounding the internal conductor within the opening and having a coefficient of expansion ?glass, the coefficient of expansion of the internal conductor ?internal and the coefficient of expansion of the external conductor ?external are such that a joint pressure on the internal conductor of at least 30 MPa is generated in a temperature range of 20° C. to a glass transformation temperature of the glass material.

Abstract: A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

Abstract: A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

Abstract: A glass-metal feedthrough includes: an external conductor including steel, having a coefficient of expansion ?external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including steel and having a coefficient of expansion ?internal. The external conductor and the internal conductor are configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture. A glass material surrounds the internal conductor within the opening and has a coefficient of expansion ?glass. The coefficient of expansion ?external of the external conductor and the coefficient of expansion ?internal of the internal conductor both are greater than the coefficient of expansion ?glass of the glass material.

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

Abstract: A multi-laser arrangement, in particular an RGB laser module, having a housing with a housing cap having at least one opening formed therein and a transparent element associated therewith for the passing of electromagnetic radiation. The housing cap coupled to a base plate. A first laser emitting in the red spectral range, a second laser emitting in the green spectral range, and a third laser emitting in the blue spectral range are arranged in the housing. An electrical connection line is routed through the housing to each respective laser. During operation of a laser, a majority of its emitted light passes through the transparent element. Each laser is arranged on a pedestal; spaced apart from the lower surface of the base plate; and is aligned with one another. The main direction of laser emission is substantially parallel to the base plate of the housing.

Abstract: A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

Abstract: An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

Abstract: An electronic device is provided which can be worn on the body or implanted into the body, such as in the form of a pulse watch and/or a smartwatch and/or an implant. The electronic device includes a photoplethysmographic measuring device. A transmitter diode and a receiver diode are arranged under a window made of glass or glass ceramics. The window is implemented as a compression glass seal and/or as a fiber-optic plate.

Abstract: An electronic device that can be worn on the body or introduced into the body includes: a casing having a top and a bottom and an inorganic support including an opening and composed of a plurality of components; and at least one window made of at least one of glass or glass ceramic provided on the bottom. The window is secured in the inorganic support and seals the opening in the inorganic support.

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Abstract: A body, such as a lamp body, includes a tubular element. At least one conductor is introduced into the tubular element and a glass material surrounds the conductor. The glass material forms a seal between the tubular element and the conductor. The glass material includes a sintered glass, such as a sintered glass ring, and may completely surround the conductor.

Abstract: A photodiode with a lens cap is provided, having a header with a photodiode active surface area where the photodiode active surface area has a diameter dF. Further included is a cap having a fused-in lens, the fused-in lens having a diameter dL shown in a top plan view of the cap. The ratio of the diameter of the fused-in lens to the diameter of the photodiode active surface area, dL/dF, is greater than 30.

Abstract: A metal fixing material leadthrough for igniters of airbags and/or belt tighteners includes at least one metal pin fused into a glass or glass-ceramic fixing material in a through-opening of a main body. The metal is present in a post-heated state, with an interface between the fixing material and the metal pin and an additional interface between the fixing material and an inner surface of the through-opening. The at least one metal pin, at least in its core region, consists of stainless steel, such as a chromium-containing stainless steel, the stainless steel having a thermal expansion coefficient.

Abstract: A biocompatible composite element for a bioreactor is provided that includes an outer frame and an inner component. The outer frame is a polymeric material. The outer frame can be inseparably attached to a wall of the bioreactor. The inner component is a transparent material selected from a group consisting of glass, sapphire, and glass ceramic. The inner component is secured in the outer component in an inseparable hermetically tight manner. The inner component is configured for a spectral process control through the transparent material of the inner component.

Abstract: Pipe insulation includes indicia thereon to facilitate differentiating the pipe insulation from other pipe insulation, even when a majority of the pipe insulation is not visible to a user.

Abstract: A glass-metal feedthrough includes: an external conductor including steel, having a coefficient of expansion ?external, and having an opening formed therein; an internal conductor disposed in the opening, the internal conductor including steel and having a coefficient of expansion ?internal. The external conductor and the internal conductor are configured to not release nickel when in contact with a human or animal body or biological cells of a cell culture. A glass material surrounds the internal conductor within the opening and has a coefficient of expansion ?glass. The coefficient of expansion ?external of the external conductor and the coefficient of expansion ?internal of the internal conductor both are greater than the coefficient of expansion ?glass of the glass material.

Abstract: A bioreactor is provided that includes a container for receiving fluid media that contain biological material and a passage with a passage opening between an interior of the container and an exterior of the container. The bioreactor includes a holder configured to hold a sensor that extends at least partially in the passage opening of the passage. The holder has a sensor chamber and a fine-pored glass layer with a pore size of up to 0.2 ?m. The fine-pored glass layer bounds the sensor chamber at least partially, whereby, in particular, an exchange of fluids between the interior of the container for receiving fluid media that contain biological material and the interior of the sensor chamber is made possible.