Abstract: A magnetic storage medium is composed of a non-wettable substrate upon which a transient liquid metal layer is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer is deposited on the transient liquid metal layer resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer.

Abstract: A laser ablation damascene process for the planarizing of metal/polymer structures. More specifically, the process is especially adapted for the fabrication of both interlevel via metallization and circuitization layers in integrated circuit (IC) interconnects. Subsequent to the forming or etching of holes or depressions in a polymer insulating layer, a metal layer or film is deposited thereon for the purpose of fabricating vias or trenches for metallization and circulation layers in IC connects. Thereafter, the surface of the metal layer which has been deposited or superimposed on the polymer substrate through any suitable method known in the art is irradiated with at least one laser pulse which will cause the metal layer to melt and reflow and resultingly fill the vias and trenches etched in the polymer substrate while simultaneously ablating and removing the metal from the planarized surface of the substrate in the regions about the vias and trenches.

Abstract: A magnetic storage medium is composed of a non-wettable substrate upon which a transient liquid metal layer is deposited and maintained as a distribution of discontinuous liquid features. A magnetic film layer is deposited on the transient liquid metal layer resulting in a reaction of the liquid metal with the magnetic film. The topology of the magnetic film is controllable by adjusting the thickness of the transient liquid metal layer.

Abstract: Enhanced density of electrical and/or mechanical interconnections between adjacent wafers within integrated circuit assemblies and structural integrity of those interconnections under temperature cycling conditions, is attained by utilizing laser assisted chemical vapor deposition to fabricate precisely configured metal posts which serve as such interconnections.