Patents by Inventor Robert J. McMorrow
Robert J. McMorrow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230275363Abstract: Register banks are used to allow for fast beam switching in a phased array system. Each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: January 27, 2023Publication date: August 31, 2023Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 11652267Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: GrantFiled: July 7, 2021Date of Patent: May 16, 2023Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Patent number: 11637371Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: GrantFiled: June 30, 2021Date of Patent: April 25, 2023Assignee: Anokiwave, Inc.Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Publication number: 20220013922Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: September 23, 2021Publication date: January 13, 2022Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Publication number: 20210344099Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: ApplicationFiled: July 7, 2021Publication date: November 4, 2021Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Publication number: 20210328345Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Patent number: 11133603Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: GrantFiled: November 16, 2020Date of Patent: September 28, 2021Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 11081792Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: GrantFiled: March 7, 2019Date of Patent: August 3, 2021Assignee: Anokiwave, Inc.Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Patent number: 11063336Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: GrantFiled: April 4, 2019Date of Patent: July 13, 2021Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Publication number: 20210075125Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Publication number: 20210043996Abstract: An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.Type: ApplicationFiled: October 12, 2020Publication date: February 11, 2021Inventors: Gaurav Menon, Jonathan P. Comeau, Andrew M. Street, Scott Mitchell, Robert J. McMorrow, Christopher Jones
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Patent number: 10862222Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be preprogrammed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: GrantFiled: June 10, 2019Date of Patent: December 8, 2020Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. Mcmorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 10833391Abstract: An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.Type: GrantFiled: October 5, 2018Date of Patent: November 10, 2020Assignee: ANOKIWAVE, INC.Inventors: Gaurav Menon, Jonathan P. Comeau, Andrew Street, Scott Mitchell, Robert J. McMorrow, Christopher Jones
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Publication number: 20200350677Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: ApplicationFiled: March 7, 2019Publication date: November 5, 2020Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Patent number: 10777888Abstract: A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, and a plurality of (on chip) interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a signal interface, a first ground interface, and a second ground interface. The signal interface is configured to communicate an RF signal, and both the first and second ground interfaces are adjacent to the signal interface. The system also has a material ring circumscribing the plurality of interfaces, and at least one RF ground path coupled with the material ring.Type: GrantFiled: October 24, 2017Date of Patent: September 15, 2020Assignee: ANOKIWAVE, INC.Inventors: Vipul Jain, Noyan Kinayman, Robert J. McMorrow, Kristian N. Madsen, Shamsun Nahar, Nitin Jain
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Patent number: 10742288Abstract: A beamforming integrated circuit has a single channel with a transmit chain and a receive chain. The transmit chain is configured to transmit an output signal and, in a corresponding manner, the receive chain is configured to receive an input signal. The integrated circuit also has separate horizontal and vertical polarity ports, and a double pole, double throw switch operably coupled between the chains and the ports. The double pole, double throw switch is configured to switch between operation in a first mode and a second mode.Type: GrantFiled: December 14, 2018Date of Patent: August 11, 2020Assignee: ANOKIWAVE, INC.Inventors: Robert J. McMorrow, Vipul Jain, Wade C. Allen, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Nitin Jain
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Patent number: 10587044Abstract: A beamforming integrated circuit system for use in a phased array has a microchip with RF circuitry, a bottom surface, and a plurality of interfaces electrically connected with the RF circuitry. The plurality of interfaces includes a plurality of static interfaces and a plurality of RF interfaces. The plurality of static interfaces are on the bottom surface of the microchip and adjacent to each other. The plurality of RF interfaces are also on the bottom surface of the microchip, but radially outward of the plurality of static interfaces. The microchip is configured to be flip chip mounted.Type: GrantFiled: October 24, 2017Date of Patent: March 10, 2020Assignee: Anokiwave, Inc.Inventors: Vipul Jain, Noyan Kinayman, Robert J. McMorrow, Kristian N. Madsen, Shamsun Nahar, Nitin Jain
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Publication number: 20190312359Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: June 10, 2019Publication date: October 10, 2019Inventors: Kristian N. MADSEN, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Publication number: 20190312330Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: ApplicationFiled: April 4, 2019Publication date: October 10, 2019Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Patent number: 10382010Abstract: A circuit for attenuating a signal has an input configured to receive an input signal, an output configured to transmit an output signal, a first attenuation path (having a first active circuit device) between the input and the output, and a second attenuation path between the input and the output. The circuit also has an operational amplifier that, like most operational amplifiers, has a first op-amp input, a second op-amp input, and an op-amp output. In addition, the circuit has a voltage control device coupled with the first op-amp input, and a second active circuit device having a first active terminal coupled with the second op-amp input. A feedback loop is coupled between the op-amp output and a second active terminal of the second active circuit device. Moreover, the op-amp output also is coupled with the first active circuit device.Type: GrantFiled: March 31, 2017Date of Patent: August 13, 2019Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Robert J. McMorrow