Patents by Inventor Robert J. Munoz

Robert J. Munoz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230197677
    Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies arranged in an array of rows and columns in a first layer; and a second plurality of IC dies in a second layer not coplanar with the first layer. A first IC die in the first plurality is differently sized than surrounding IC dies in the first plurality, and a second IC die in the second plurality coupled to the first IC die comprises at least one of: a repeater circuitry and a fanout structure in an electrical pathway coupling the first IC die with an adjacent IC die in the first plurality.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, Stephen R. Van Doren, Ritu Gupta, Gerald S. Pasdast, Robert J. Munoz, Shawna M. Liff
  • Publication number: 20230187362
    Abstract: A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer; and a third plurality of IC dies in a third layer, in which: the second layer is between the first layer and the third layer, an interface between two adjacent layers comprises interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects, and each of the first layer, the second layer, and the third layer comprises a dielectric material, and further comprises conductive traces in the dielectric material.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, Christopher M. Pelto, Kimin Jun, Brandon M. Rawlings, Shawna M. Liff, Bradley A. Jackson, Robert J. Munoz, Johanna M. Swan
  • Publication number: 20230187407
    Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer between the first layer and a third layer; and a third plurality of IC dies in the third layer. In some embodiments, the second plurality of IC dies comprises IC dies in an array of rows and columns, each IC die of the second plurality of IC dies is coupled to more than one IC die of the first plurality of IC dies, and the third plurality of IC dies is to provide electrical coupling between adjacent ones of the second plurality of IC dies.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: Intel Corporation
    Inventors: Carleton L. Molnar, Adel A. Elsherbini, Tanay Karnik, Shawna M. Liff, Robert J. Munoz, Julien Sebot, Johanna M. Swan, Nevine Nassif, Gerald S. Pasdast, Krishna Bharath, Neelam Chandwani, Dmitri E. Nikonov
  • Publication number: 20230170327
    Abstract: A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pitch; and a second IC die coupled to the surface with second interconnects having a second pitch. The second pitch is greater than the first pitch, and the first pitch is less than 10 micrometers. In another embodiment, a microelectronic assembly is provided, comprising: a first stack coupled to a surface, the first stack comprising a first number of IC dies; and a second stack coupled to the surface, the second stack comprising a second number of IC dies, in which: the first stack and the second stack are laterally surrounded by a dielectric, the first stack and the second stack have a same thickness, and the first number is less than the second number.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 1, 2023
    Applicant: Intel Corporation
    Inventors: Jin Yang, David Shia, Adel A. Elsherbini, Christopher M. Pelto, Kimin Jun, Bradley A. Jackson, Robert J. Munoz, Shawna M. Liff, Johanna M. Swan
  • Patent number: 11251171
    Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Michael Rifani, Robert J. Munoz, Thomas P. Thomas, John Mark Matson, Kursad Kiziloglu
  • Patent number: 10791057
    Abstract: Techniques to schedule transmission of a packet from a computing platform include calculating adjustments to portions of the packet to cause corrections to at least one portion of the packet. An adjustment to a scheduled transmission of the packet is made based on the corrections.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 29, 2020
    Assignee: Intel Corporation
    Inventors: Sarig Livne, Ben-Zion Friedman, Ronen Aharon Hyatt, Nir Tiser, Robert J. Munoz
  • Publication number: 20190385994
    Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Applicant: Intel Corporation
    Inventors: Michael Rifani, Robert J. Munoz, Thomas P. Thomas, John Mark Matson, Kursad Kiziloglu
  • Publication number: 20190068507
    Abstract: Techniques to schedule transmission of a packet from a computing platform include calculating adjustments to portions of the packet to cause corrections to at least one portion of the packet. An adjustment to a scheduled transmission of the packet is made based on the corrections.
    Type: Application
    Filed: October 30, 2018
    Publication date: February 28, 2019
    Inventors: Sarig LIVNE, Ben-Zion FRIEDMAN, Roneh Aharon HYATT, Nir TISER, Robert J. MUNOZ
  • Patent number: 9755947
    Abstract: Described embodiments process data packets received by a switch coupled to a network processor. The switch determines whether one or more rules for classifying and processing the received packet are stored in an internal classification database of the switch. If one or more rules are stored in the internal database, the switch updates statistics corresponding to each of the rules and classifies and processes the received packet in accordance with the rules. If no associated rules are stored in the internal database, the switch tags the received packet with metadata and forwards the packet to the network processor. The network processor determines one or more rules for classifying and processing the forwarded packet in a classification database of the network processor and updates statistics corresponding to each rule. The network processor classifies and processes the packet in accordance with the rules and updates the internal database of the switch.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: September 5, 2017
    Assignee: Intel Corporation
    Inventor: Robert J. Munoz
  • Patent number: 9727508
    Abstract: Described embodiments process data packets received that include a source address and at least one destination address. If the destination address is stored in a memory of an I/O adapter, the received data packet is processed in accordance with bridging rules associated with each destination address stored in the I/O adapter memory. If the destination address is not stored in the I/O adapter memory, the I/O adapter sends a task message to a processor to determine whether the destination address is stored in an address table stored in a shared memory of the network processor. The I/O adapter memory has lower access latency than the address table. If the destination address is stored in the address table, the received data packet is processed in accordance with bridging rules stored in the address table and the bridging rules stored in the I/O adapter memory are updated.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: August 8, 2017
    Assignee: Intel Corporation
    Inventors: Robert J. Munoz, Joseph A. Manzella, Zhong Guo, Walter A. Roper
  • Patent number: 9485200
    Abstract: Described embodiments process data packets received by a network switch coupled to an external buffering device. The network switch determines a queue of an internal buffer of the network switch associated with a flow of the received packet and determines whether the received packet should be forwarded to the external buffering device. If the received packet should be forwarded to the external buffering device, the network switch sets an external buffering active indicator indicating that the network switch is in an external buffering mode for the flow, tags the received packet with metadata, and forwards the packet to the external buffering device. The external buffering device stores the forwarded packet in a queue of a memory of the external buffering device corresponding to the tagged metadata of the forwarded packet. The network switch processes packets stored in the internal buffer of the network switch.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: November 1, 2016
    Assignee: Intel Corporation
    Inventor: Robert J. Munoz
  • Patent number: 9444737
    Abstract: Described embodiments provide a network processor having a hardware accelerator that identifies a received packet and, based on a flow identification associated with the received packet, might pre-fetch pre-established portions of data from the received packet into local data memory (e.g., local data cache) for processing by a general purpose processor core. In addition to the packet data, the software necessary for the general-purpose processor core to process the data might also be pre-fetched into local instruction memory (e.g., local instruction cache). The flow identification might be used to select different portions of the packet and different software to be pre-fetched.
    Type: Grant
    Filed: February 1, 2013
    Date of Patent: September 13, 2016
    Assignee: Intel Corporation
    Inventor: Robert J. Munoz
  • Patent number: 9304920
    Abstract: A multiprocessor system or a system of hardware accelerators is provided to reduce cache ping-ponging and to provide improved single producer single consumer (SPSC) queues and methods. The systems are configured for specifying separate cache attributes for inner (e.g., local) cache and outer (e.g., shared) cache for promoting lower system overhead. Separate cache attributes are specified such that shared variables are cacheable only in a cache level shared by multiple processors.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: April 5, 2016
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventor: Robert J. Munoz
  • Patent number: 9233404
    Abstract: The apparatus for producing a pulsing flow of fluids to a fluid line including a housing having first, second and third passages. The first passage communicates with a source of compressed gas and a first conduit, communicating with a solvent liquid source, and passes through the housing. A narrowed transverse dimension between the conduit and the inner chamber of the housing creates a pulsing delivery of fluids from the gas and liquid sources.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: January 12, 2016
    Inventors: Robert J. Munoz, Karl T. Matis, Matthew D. Sibilio
  • Patent number: 9081742
    Abstract: Described embodiments provide a system having a plurality of processor cores and common memory in direct communication with the cores. A source processing core communicates with a task destination core by generating a task message for the task destination core. The task source core transmits the task message directly to a receiving processing core adjacent to the task source core. If the receiving processing core is not the task destination core, the receiving processing core passes the task message unchanged to a processing core adjacent the receiving processing core. If the receiving processing core is the task destination core, the task destination core processes the message.
    Type: Grant
    Filed: May 18, 2010
    Date of Patent: July 14, 2015
    Assignee: Intel Corporation
    Inventors: David P. Sonnier, William G. Burroughs, Narender R. Vangati, Deepak Mital, Robert J. Munoz
  • Patent number: 9065761
    Abstract: Described embodiments provide for a reassembly system for processing an asynchronous transfer mode (ATM) cell of data into an ATM adaptation layer (AAL) packet. A preprocessor module identifies a first conversation identification of one or more minipackets in the ATM cell, and reassembles the one or more minipackets having the first conversation identification into a portion of the AAL packet. A preprocessor determines if a trigger has occurred. In response to a trigger, the preprocessor sends a portion of the reassembled minipackets having the first conversation identification to a destination processor.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: June 23, 2015
    Assignee: Intel Corporation
    Inventors: Robert J. Munoz, Mark A. Bordogna
  • Patent number: 8949578
    Abstract: Described embodiments provide a system having at least two network processors that each have a plurality of processing modules. The processing modules process a packet in a task pipeline by transmitting task messages to other processing modules on a task ring, the task messages related to desired processing of the packet. A series of tasks within a network processor may result in no processing or reduced processing for certain processing modules creating a virtual pipeline depending on the packet received by the network processor. At least two of the network processors communicate tasks. This communication allows ter the extension of the virtual pipeline of or IC network processor to at least two network processors.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: February 3, 2015
    Assignee: LSI Corporation
    Inventors: Joseph A. Manzella, Nilesh S. Vora, Walter A. Roper, Robert J. Munoz, David P. Sonnier
  • Publication number: 20140351519
    Abstract: Aspects of the disclosure pertain to a system and method for providing cache-aware lightweight producer consumer queues. The system is a multiprocessor system configured for specifying separate cache attributes for inner (e.g., local) cache and outer (e.g., shared) cache for promoting lower system overhead. Separate cache attributes are specified such that shared variables are cacheable only in a cache level shared by multiple processors.
    Type: Application
    Filed: June 3, 2013
    Publication date: November 27, 2014
    Inventor: Robert J. Munoz
  • Publication number: 20140258375
    Abstract: Aspects of the disclosure pertain to a system and method for large object cache management in a network. A proxy server of the present disclosure implements a token-based policing mechanism via a cache tracking table to evaluate objects for potential inclusion in a cache controlled by the proxy server and to age-out objects already stored in the cache. Use of the tracking table and token-based policing mechanism by the proxy server promoting efficient usage of caching resources and promotes efficient handling of client requests for large data objects, such as video files.
    Type: Application
    Filed: April 3, 2013
    Publication date: September 11, 2014
    Applicant: LSI Corporation
    Inventor: Robert J. Munoz
  • Patent number: 8761204
    Abstract: Described embodiments provide for processing received data packets into packet reassemblies for transmission as output packets of a network processor. A packet assembler determines an associated packet reassembly of data portions and enqueues an identifier for each data portion in an input queue corresponding to the packet reassembly associated with the data portion. A state data entry corresponding to each packet reassembly identifies whether the packet reassembly is actively processed by the packet assembler. Iteratively, until an eligible data portion is selected, the packet assembler selects a given data portion from a non-empty input queue for processing and determines if the selected data portion corresponds to a reassembly that is actively processed. If the reassembly is active, the packet assembler sets the selected data portion as ineligible for selection. Otherwise, the packet assembler selects the data portion for processing and modifies the packet reassembly based on the selected data portion.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: June 24, 2014
    Assignee: LSI Corporation
    Inventors: James T. Clee, Deepak Mital, Robert J. Munoz