Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies arranged in an array of rows and columns in a first layer; and a second plurality of IC dies in a second layer not coplanar with the first layer. A first IC die in the first plurality is differently sized than surrounding IC dies in the first plurality, and a second IC die in the second plurality coupled to the first IC die comprises at least one of: a repeater circuitry and a fanout structure in an electrical pathway coupling the first IC die with an adjacent IC die in the first plurality.

Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer between the first layer and a third layer; and a third plurality of IC dies in the third layer. In some embodiments, the second plurality of IC dies comprises IC dies in an array of rows and columns, each IC die of the second plurality of IC dies is coupled to more than one IC die of the first plurality of IC dies, and the third plurality of IC dies is to provide electrical coupling between adjacent ones of the second plurality of IC dies.

Abstract: A bead handling system comprises a first lift assembly and a second lift assembly that each comprise an actuator and at least one vacuum tube for selectively engaging with a bead, such as a lyophilized bead. The actuators are configured to extend and retract their respective vacuum tubes for selective engagement with beads and selective positioning of the engaged beads into known positions. The actuators of the first and second lift assemblies may be extended and retracted oppositely from one another. Still further, the vacuum tube of each of the first and second lift assemblies may engage a bead when retracted, and position an engaged bead into a known position when in the extended position.

Abstract: A lateral test flow cassette and method of packaging lateral flow test strips includes providing an elongated first web comprising a thermo-formable material, thermoforming a plurality of recesses in the elongated first web at spaced intervals along the elongated first web, providing a supply of lateral flow test strips and providing an elongated second web, retaining lateral flow test strips within the recesses of the elongated first web by attaching the second web to the first web, and cutting the attached together first web and second web to separate the thus retained lateral flow test strips into packages. The second elongated web may comprise a thermo-formable material, with the method further including thermoforming features in the elongated second web at spaced intervals, such as recesses.

Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies arranged in an array of rows and columns in a first layer; and a second plurality of IC dies in a second layer not coplanar with the first layer. A first IC die in the first plurality is differently sized than surrounding IC dies in the first plurality, and a second IC die in the second plurality coupled to the first IC die comprises at least one of: a repeater circuitry and a fanout structure in an electrical pathway coupling the first IC die with an adjacent IC die in the first plurality.

Abstract: A microelectronic assembly is provided comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer between the first layer and a third layer; and a third plurality of IC dies in the third layer. In some embodiments, the second plurality of IC dies comprises IC dies in an array of rows and columns, each IC die of the second plurality of IC dies is coupled to more than one IC die of the first plurality of IC dies, and the third plurality of IC dies is to provide electrical coupling between adjacent ones of the second plurality of IC dies.

Abstract: A microelectronic assembly is provided, comprising: a first plurality of integrated circuit (IC) dies in a first layer; a second plurality of IC dies in a second layer; and a third plurality of IC dies in a third layer, in which: the second layer is between the first layer and the third layer, an interface between two adjacent layers comprises interconnects having a pitch of less than 10 micrometers between adjacent ones of the interconnects, and each of the first layer, the second layer, and the third layer comprises a dielectric material, and further comprises conductive traces in the dielectric material.

Abstract: A microelectronic assembly is provided, comprising: a first IC die coupled to a surface with first interconnects having a first pitch; and a second IC die coupled to the surface with second interconnects having a second pitch. The second pitch is greater than the first pitch, and the first pitch is less than 10 micrometers. In another embodiment, a microelectronic assembly is provided, comprising: a first stack coupled to a surface, the first stack comprising a first number of IC dies; and a second stack coupled to the surface, the second stack comprising a second number of IC dies, in which: the first stack and the second stack are laterally surrounded by a dielectric, the first stack and the second stack have a same thickness, and the first number is less than the second number.

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

Abstract: Techniques to schedule transmission of a packet from a computing platform include calculating adjustments to portions of the packet to cause corrections to at least one portion of the packet. An adjustment to a scheduled transmission of the packet is made based on the corrections.

Abstract: Embodiments may relate to a substrate for use in a system in package (SIP). The substrate may include a first couple to couple with a first component via a permanent couple such that the first component is communicatively coupled with a bridge. The substrate may further include a second couple to removably couple with an interposer such that the interposer is communicatively coupled with the bridge via a communicative couple. Other embodiments may be described or claimed.

Abstract: Techniques to schedule transmission of a packet from a computing platform include calculating adjustments to portions of the packet to cause corrections to at least one portion of the packet. An adjustment to a scheduled transmission of the packet is made based on the corrections.

Abstract: Described embodiments process data packets received by a switch coupled to a network processor. The switch determines whether one or more rules for classifying and processing the received packet are stored in an internal classification database of the switch. If one or more rules are stored in the internal database, the switch updates statistics corresponding to each of the rules and classifies and processes the received packet in accordance with the rules. If no associated rules are stored in the internal database, the switch tags the received packet with metadata and forwards the packet to the network processor. The network processor determines one or more rules for classifying and processing the forwarded packet in a classification database of the network processor and updates statistics corresponding to each rule. The network processor classifies and processes the packet in accordance with the rules and updates the internal database of the switch.

Abstract: Described embodiments process data packets received that include a source address and at least one destination address. If the destination address is stored in a memory of an I/O adapter, the received data packet is processed in accordance with bridging rules associated with each destination address stored in the I/O adapter memory. If the destination address is not stored in the I/O adapter memory, the I/O adapter sends a task message to a processor to determine whether the destination address is stored in an address table stored in a shared memory of the network processor. The I/O adapter memory has lower access latency than the address table. If the destination address is stored in the address table, the received data packet is processed in accordance with bridging rules stored in the address table and the bridging rules stored in the I/O adapter memory are updated.

Abstract: Described embodiments process data packets received by a network switch coupled to an external buffering device. The network switch determines a queue of an internal buffer of the network switch associated with a flow of the received packet and determines whether the received packet should be forwarded to the external buffering device. If the received packet should be forwarded to the external buffering device, the network switch sets an external buffering active indicator indicating that the network switch is in an external buffering mode for the flow, tags the received packet with metadata, and forwards the packet to the external buffering device. The external buffering device stores the forwarded packet in a queue of a memory of the external buffering device corresponding to the tagged metadata of the forwarded packet. The network switch processes packets stored in the internal buffer of the network switch.

Abstract: Described embodiments provide a network processor having a hardware accelerator that identifies a received packet and, based on a flow identification associated with the received packet, might pre-fetch pre-established portions of data from the received packet into local data memory (e.g., local data cache) for processing by a general purpose processor core. In addition to the packet data, the software necessary for the general-purpose processor core to process the data might also be pre-fetched into local instruction memory (e.g., local instruction cache). The flow identification might be used to select different portions of the packet and different software to be pre-fetched.

Abstract: A multiprocessor system or a system of hardware accelerators is provided to reduce cache ping-ponging and to provide improved single producer single consumer (SPSC) queues and methods. The systems are configured for specifying separate cache attributes for inner (e.g., local) cache and outer (e.g., shared) cache for promoting lower system overhead. Separate cache attributes are specified such that shared variables are cacheable only in a cache level shared by multiple processors.

Abstract: The apparatus for producing a pulsing flow of fluids to a fluid line including a housing having first, second and third passages. The first passage communicates with a source of compressed gas and a first conduit, communicating with a solvent liquid source, and passes through the housing. A narrowed transverse dimension between the conduit and the inner chamber of the housing creates a pulsing delivery of fluids from the gas and liquid sources.

Abstract: Described embodiments provide a system having a plurality of processor cores and common memory in direct communication with the cores. A source processing core communicates with a task destination core by generating a task message for the task destination core. The task source core transmits the task message directly to a receiving processing core adjacent to the task source core. If the receiving processing core is not the task destination core, the receiving processing core passes the task message unchanged to a processing core adjacent the receiving processing core. If the receiving processing core is the task destination core, the task destination core processes the message.

Abstract: Described embodiments provide for a reassembly system for processing an asynchronous transfer mode (ATM) cell of data into an ATM adaptation layer (AAL) packet. A preprocessor module identifies a first conversation identification of one or more minipackets in the ATM cell, and reassembles the one or more minipackets having the first conversation identification into a portion of the AAL packet. A preprocessor determines if a trigger has occurred. In response to a trigger, the preprocessor sends a portion of the reassembled minipackets having the first conversation identification to a destination processor.