Abstract: A flat field transistor (FFT) based dynamic random-access memory (DRAM) (FFT-DRAM) is disclosed. The FFT-DRAM comprises an epitaxially grown source region comprising a source extension and an epitaxial source over and in contact with the source extension. The epitaxially grown source region is over a surface of a semiconductor substrate. The FFT-DRAM further comprises a trench capacitor structurally integrated into the epitaxially grown source region. The trench capacitor has a first terminal formed by the epitaxially grown source region and a second terminal being a conductive material filling one or more trenches of the trench capacitor. The second terminal is connected to a ground terminal or a fixed voltage terminal.

Abstract: A flat field transistor (FFT) based dynamic random-access memory (DRAM) (FFT-DRAM) is disclosed. The FFT-DRAM comprises an epitaxially grown source region comprising a source extension and an epitaxial source over and in contact with the source extension. The epitaxially grown source region is over a surface of a semiconductor substrate. The FFT-DRAM further comprises a trench capacitor structurally integrated into the epitaxially grown source region. The trench capacitor has a first terminal formed by the epitaxially grown source region and a second terminal being a conductive material filling one or more trenches of the trench capacitor. The second terminal is connected to a ground terminal or a fixed voltage terminal.

Abstract: A flat field transistor (FFT) based dynamic random-access memory (DRAM) (FFT-DRAM) is disclosed. The FFT-DRAM comprises an epitaxially grown source region comprising a source extension and an epitaxial source over and in contact with the source extension. The epitaxially grown source region is over a surface of a semiconductor substrate. The FFT-DRAM further comprises a trench capacitor structurally integrated into the epitaxially grown source region. The trench capacitor has a first terminal formed by the epitaxially grown source region and a second terminal being a conductive material filling one or more trenches of the trench capacitor. The second terminal is connected to a ground terminal or a fixed voltage terminal.

Abstract: This improved, fluctuation resistant FinFET, with a doped core and lightly doped epitaxial channel region between that core and the gate structure, is confined to the active-gate span because it is based on a channel structure having a limited extent. The improved structure is capable of reducing FinFET random doping fluctuations when doping is used to control threshold voltage, and the channel structure reduces fluctuations attributable to doping-related variations in effective channel length. Further, the transistor design affords better source and drain conductance when compared to prior art FinFETs. Two representative embodiments of the key structure are described in detail.

Abstract: A MOSFET structure and method of manufacture that minimize threshold variations associated with statistical uncertainties of implanted source and drain extensions. The source and drain extensions are fabricated very late in the process using a material added to etched recesses immediately adjacent to the transistor's channel. In various embodiments, the added material may be germanium grown by selective epitaxy, doped silicon grown by selective epitaxy, or metallic materials created by deposition or by deposition and reaction.

Abstract: A MOSFET structure and method of manufacture that minimize threshold variations associated with statistical uncertainties of implanted source and drain extensions. The source and drain extensions are fabricated very late in the process using a material added to etched recesses immediately adjacent to the transistor's channel. In various embodiments, the added material may be germanium grown by selective epitaxy, doped silicon grown by selective epitaxy, or metallic materials created by deposition or by deposition and reaction.

Abstract: A MOSFET structure and method of manufacture that minimize threshold variations associated with statistical uncertainties of implanted source and drain extensions. The source and drain extensions are fabricated very late in the process using a material added to etched recesses immediately adjacent to the transistor's channel. In various embodiments, the added material may be germanium grown by selective epitaxy, doped silicon grown by selective epitaxy, or metallic materials created by deposition or by deposition and reaction.

Abstract: This improved, fluctuation resistant FinFET, with a doped core and lightly doped epitaxial channel region between that core and the gate structure, is confined to the active-gate span because it is based on a channel structure having a limited extent. The improved structure is capable of reducing FinFET random doping fluctuations when doping is used to control threshold voltage, and the channel structure reduces fluctuations attributable to doping-related variations in effective channel length. Further, the transistor design affords better source and drain conductance when compared to prior art FinFETs. Two representative embodiments of the key structure are described in detail.

Abstract: An improved fin field-effect transistor (FinFET) is built on a compound fin, which has a doped core and lightly doped epitaxial channel region between that core and the gate dielectric. The improved structure reduces FinFET random doping fluctuations when doping is used to control threshold voltage. Further, the transistor design affords better source and drain conductance when compared to prior art FinFETs. Three representative embodiments of the key structure are described in detail.

Abstract: A Schottky diode exhibiting low series resistance is efficiently fabricated using a substantially standard CMOS process flow by forming the Schottky diode using substantially the same structures and processes that are used to form a field effect transistor (FET) of a CMOS IC device. Polycrystalline silicon, which is used to form the gate structure of the FET, is utilized to form an isolation structure between the Schottky barrier and backside structure of the Schottky diode. Silicide (e.g., cobalt silicide (CoSi2)) structures, which are utilized to form source and drain metal-to-silicon contacts in the FET, are used to form the Schottky barrier and backside Ohmic contact of the Schottky diode. Heavily doped drain (HDD) diffusions and lightly doped drain (LDD) diffusions, which are used to form source and drain diffusions of the FET, are utilized to form a suitable contact diffusion under the backside contact silicide.

Abstract: A Schottky diode is formed on an isolated well (e.g., a P-well formed in a buried N-well), and utilizes cobalt silicide (CoSi2) structures respectively formed on heavily doped and lightly doped regions of the isolated well to provide the Schottky barrier and backside (ohmic) contact structures of the Schottky diode. The surrounding buried N-well is coupled to a bias voltage. The Schottky barrier and backside contact structures are separated by isolation structures formed using polycrystalline silicon, which is used to form the gate structure of CMOS FETs, in order to minimize forward resistance. Heavily doped drain (HDD) diffusions and lightly doped drain (LDD) diffusions, which are used to form source and drain diffusions of the FET, are utilized to form a suitable contact diffusion under the backside contact silicide.

Abstract: A multi-bit programmable memory cell is provided that includes an access transistor and a plurality of N anti-fuse elements. The access transistor has a source coupled to a source line and a gate coupled to a word line. Each of the anti-fuse elements has a first terminal coupled to a drain of the access transistor, and a second terminal coupled to a corresponding bit line. At most, only one of the anti-fuse elements is programmed. The memory cell is capable of storing M bits, wherein N=2M−1. A method is provided for both programming and reading the memory cell. In another embodiment, the anti-fuse elements can be replaced with mask-programmable elements.

Abstract: A multi-bit programmable memory cell is provided that includes an access transistor and a plurality of N anti-fuse elements. The access transistor has a source coupled to a source line and a gate coupled to a word line. Each of the anti-fuse elements has a first terminal coupled to a drain of the access transistor, and a second terminal coupled to a corresponding bit line. At most, only one of the anti-fuse elements is programmed. The memory cell is capable of storing M bits, wherein N=2M−1. A method is provided for both programming and reading the memory cell. In another embodiment, the anti-fuse elements can be replaced with mask-programmable elements.

Abstract: A multi-bit programmable memory cell is provided that includes an access transistor and a plurality of N anti-fuse elements. The access transistor has a source coupled to a source line and a gate coupled to a word line. Each of the anti-fuse elements has a first terminal coupled to a drain of the access transistor, and a second terminal coupled to a corresponding bit line. At most, only one of the anti-fuse elements is programmed. The memory cell is capable of storing M bits, wherein N=2M−1. A method is provided for both programming and reading the memory cell. In another embodiment, the anti-fuse elements can be replaced with mask-programmable elements.

Abstract: A multiple-gap head for transferring data to or from a storage medium is disclosed. Data read by the gaps are directed over a plurality of serial data paths where the data are processed and synchronized. In some embodiments, all or part of a data synchronizer is shared by the serial data paths. The data are then assembled into a parallel data stream for delivery to a computer. Reading the data simultaneously with multiple gaps increases by several times the rate at which data can be transferred to or from a storage medium. In accordance with another aspect of the invention, a three-gap head is provided to reduce or eliminate the cross-talk or noise fringe problems which reduce the track density in a storage medium. A signal attenuator and a signal inverter are connected to each of the side gaps and the outputs thereof are summed with the signal originating at the center gap, such that the inverted signals from the side gaps cancel any cross-talk originating at the center gap.

Abstract: A resonant beam or cantilever is implemented in single crystal silicon or polysilicon. Adjacent the end of the cantilever is an electrode capable of receiving a variable voltage. The cantilever has a natural mechanical resonant frequency when vibrated, and the varying electrostatic field resulting from the variation of applied voltage to the electrode is used to alter the natural restoring force of the cantilever so that a chosen vibration frequency of the cantilever can be achieved. Such vibrating cantilever can be used as the bases for a voltage control oscillator.

Abstract: A multiple-gap head for transferring data to or from a storage medium is disclosed. Data read by the gaps are directed over a plurality of serial data paths where the data are processed and synchronized. In some embodiments, all or part of a data synchronizer is shared by the serial data paths. The data are then assembled into a parallel data stream for delivery to a computer. Reading the data simultaneously with multiple gaps increases by several times the rate at which data can be transferred to or from a storage medium. In accordance with another aspect of the invention, a three-gap head is provided to reduce or eliminate the cross-talk or noise fringe problems which reduce the track density in a storage medium. A signal attenuator and a signal inverter are connected to each of the side gaps and the outputs thereof are summed with the signal originating at the center gap, such that the inverted signals from the side gaps cancel any cross-talk originating at the center gap.

Abstract: An electrically-erasable, electrically programmable read-only memory (EEPROM) with multiple erase modes identifies sections of memory cells that have not received a write operation subsequent to the most recent erase operation and inhibits erasure of the memory cells in such sections. An indicator column is formed from indicator memory cells added to each section. During a write operation in which a section is first erased and then programmed, the EEPROM reads the indicator memory cell added to the section and inhibits the erase of the section if the memory cells in the section are in an erased state.

Abstract: A method for manufacturing bipolar semiconductor devices wherein damage to the active regions of the devices due to the direct implantation of impurities is suppressed. A material is selectively deposited on a semiconductor substrate, the material having a characteristic such that formation of the material occurs on some substances such as silicon and polysilicon, and formation of the material is suppressed on other substances such as silicon dioxide and silicon nitride. Impurities are introduced into the material rather than into the substrate. The impurities are then diffused into the active regions by standard processes such as rapid thermal anneal (RTA) or furnace anneal. The material generally contains germanium, and usually is a polycrystalline silicon-germanium alloy. The diffusion depth of the impurities may be controlled with great precision by manipulating several parameters.

Abstract: A multiple-gap head for transferring data to or from a storage medium is disclosed. Data read by the gaps are directed over a plurality of serial data paths where the data are processed and synchronized. In some embodiments, all or part of a data synchronizer is shared by the serial data paths. The data are then assembled into a parallel data stream for delivery to a computer. Reading the data simultaneously with multiple gaps increases by several times the rate at which data can be transferred to or from a storage medium. In accordance with another aspect of the invention, a three-gap head is provided to reduce or eliminate the cross-talk or noise fringe problems which reduce the track density in a storage medium. A signal attenuator and a signal inverter are connected to each of the side gaps and the outputs thereof are summed with the signal originating at the center gap, such that the inverted signals from the side gaps cancel any cross-talk originating at the center gap.