Abstract: A thermostat for a building zone includes at least one of a model predictive controller and an equipment controller. The model predictive controller is configured to obtain a cost function that accounts for a cost of operating HVAC equipment during each of a plurality of time steps, use a predictive model to predict a temperature of the building zone during each of the plurality of time steps, and generate temperature setpoints for the building zone for each of the plurality of time steps by optimizing the cost function subject to a constraint on the predicted temperature. The equipment controller is configured to receive the temperature setpoints generated by the model predictive controller and drive the temperature of the building zone toward the temperature setpoints during each of the plurality of time steps by operating the HVAC equipment to provide heating or cooling to the building zone.

Abstract: A model predictive maintenance (MPM) system for building equipment includes one or more processing circuits having one or more processors and memory. The memory store instructions that, when executed by the one or more processors, cause the one or more processors to perform operations including estimating a degradation state of the building equipment, using a degradation impact model to predict an amount of one or more input resources consumed by the building equipment to produce one or more output resources based on the degradation state of the building equipment, generating a maintenance schedule for the building equipment based on the amount of the one or more input resources predicted by the degradation impact model, and initiating a maintenance activity for the building equipment in accordance with the maintenance schedule.

Abstract: Systems and methods for reducing health risks with respect to an infectious disease in buildings. Health data for an infectious diseases is used to determine a health risk level for building spaces and individuals in the building. An air handling action or a disinfection action is performed based on the health risk level.

Abstract: A model predictive maintenance (MPM) system for building equipment includes one or more processing circuits including one or more processors and memory storing instructions that, when executed by the one or more processors, cause the one or more processors to perform operations. The operations include obtaining one or more performance indicators for the building equipment and determining whether a trigger condition has been satisfied based on the one or more performance indicators. The operations include triggering a model predictive maintenance process to generate a maintenance schedule for the building equipment in response to determining that the trigger condition has been satisfied. The operations include initiating a maintenance activity for the building equipment in accordance with the maintenance schedule.

Abstract: A thermostat for a building zone includes at least one of a model predictive controller and an equipment controller. The model predictive controller is configured to obtain a cost function that accounts for a cost of operating HVAC equipment during each of a plurality of time steps, use a predictive model to predict a temperature of the building zone during each of the plurality of time steps, and generate temperature setpoints for the building zone for each of the plurality of time steps by optimizing the cost function subject to a constraint on the predicted temperature. The equipment controller is configured to receive the temperature setpoints generated by the model predictive controller and drive the temperature of the building zone toward the temperature setpoints during each of the plurality of time steps by operating the HVAC equipment to provide heating or cooling to the building zone.

Abstract: A controller for equipment that operate to provide heating or cooling to a building or campus includes a processing circuit configured to obtain utility rate data indicating a price of resources consumed by the equipment to serve energy loads of the building or campus, obtain an objective function that expresses a total monetary cost of operating the equipment over an optimization period as a function of the utility rate data and an amount of the resources consumed by the equipment, determine a relationship between resource consumption and load production of the equipment, optimize the objective function over the optimization subject to a constraint based on the relationship between the resource consumption and the load production of the equipment to determine a distribution of the load production across the equipment, and operate the equipment to achieve the distribution.

Abstract: A substrate having an edge; a first and second active trace, wherein the first active trace corresponds to a first signal of a differential pair and the second active trace corresponds to a second signal of the differential pair; and a first and second conductive via which are located at different distances from the edge. The first active trace is routed to the first conductive via, and the second active trace is routed around the first conductive via to the second conductive via such that the second active trace is between the first conductive via and the edge. The substrate includes a first plating trace in electrical contact with the first active trace, and a second plating trace in electrical contact with the second active trace, wherein the first and second plating traces are routed to the edge on different metal layers of the substrate.

Abstract: A substrate having an edge; a first and second active trace, wherein the first active trace corresponds to a first signal of a differential pair and the second active trace corresponds to a second signal of the differential pair; and a first and second conductive via which are located at different distances from the edge. The first active trace is routed to the first conductive via, and the second active trace is routed around the first conductive via to the second conductive via such that the second active trace is between the first conductive via and the edge. The substrate includes a first plating trace in electrical contact with the first active trace, and a second plating trace in electrical contact with the second active trace, wherein the first and second plating traces are routed to the edge on different metal layers of the substrate.

Abstract: A semiconductor device includes an integrated circuit die on a substrate. A first subset of wire bonds is between the substrate and the die. A second subset of wire bonds is between the substrate and the die. A dielectric material coats the first subset of the wire bonds along a majority of length of the first subset of the wire bonds. A medium is in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds.

Abstract: A semiconductor device includes an integrated circuit die on a substrate. A first subset of wire bonds is between the substrate and the die. A second subset of wire bonds is between the substrate and the die. A dielectric material coats the first subset of the wire bonds along a majority of length of the first subset of the wire bonds. A medium is in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds.

Abstract: A circuit device is placed within an opening of a conductive layer which is then partially encapsulated with an encapsulant so that the active surface of the circuit device is coplanar with the conductive layer. At least a portion of the conductive layer may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device may be placed on a conductive layer such that an active surface of circuit device is between conductive layer and an opposite surface of circuit device. The conductive layer has at least one opening to expose the active surface of circuit device. The encapsulant may be electrically conductive or electrically non-conductive.

Abstract: A flexible automatic broiler and method of use for variable batch cooking for particular use in quick serve and fast food service restaurants. The automatic cooking devices include a conveyorized cooking surface for alignment and discharge of food products, an altering/pulsating infrared energy radiation heat sources, and a control system. The arrangement and method facilitate a combination of batch preparation and made-to-order assembly of fast-food sandwiches.

Abstract: A flexible automatic broiler and method of use for variable batch cooking for particular use in quick serve and fast food service restaurants. The automatic cooking devices include a conveyorized cooking surface for alignment and discharge of food products, an altering/pulsating infrared energy radiation heat sources, and a control system. The arrangement and method facilitate a combination of batch preparation and made-to-order assembly of fast-food sandwiches.

Abstract: A package assembly 200 includes a semiconductor die (e.g., an RF power amplifier) 208 fixed within the cavity of a conductive leadframe 204 using a thermally and electrically-conductive adhesive material 209. The semiconductor die 209 has a first side and a second side, wherein the first side includes at least one active area, and the second side includes at least one contact region. The conductive leadframe (e.g., a copper leadframe) 204 has two planar surfaces and a cavity formed therein. The adhesive material 209 is configured to couple the semiconductor die 208 within the cavity of the conductive leadframe 204 such that the first side of the semiconductor die is substantially coplanar with the first surface of the conductive leadframe.

Abstract: A structure includes a semiconductor die that has an arrangement of die pads on a surface of the semiconductor die. A first row of die pads consists of a first group of four die pads and run in a first direction. A second row of die pads are adjacent to the first row and consist of a second group of four die pads running in the first direction. The second row begins at a first offset in the first direction from where the first row begins. A third row of die pads are adjacent to the second row and comprise a third group of four die pads that run in the first direction. The third row begins at a second offset in the first direction from where the second row begins. This allows for relatively easy access to all of the die pads.

Abstract: A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.

Abstract: A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.

Abstract: A method that locates a plurality of die for forming a plurality of packaged integrated circuits. A frame is placed over the support structure, wherein the frame includes a plurality of openings therein and each opening of the plurality of openings has at least two walls. Each die of a plurality of die is placed over the support structure, wherein each die has at least two adjacent edges. The relative placing of the frame and the die results in each die being in an opening of the plurality of openings. Encapsulant is applied to the plurality of die. Either or both of the plurality of die and frame are moved in relation to the other in a manner that causes the two adjacent edges of each die of the plurality of die to substantially abut to and align with the two walls of an opening of the plurality of openings.

Abstract: A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality of semiconductor die is placed on the adhesive layer. The semiconductor die are laterally separated from each other and have electrical contacts that are in contact with the adhesive layer. A layer of encapsulating material is formed overlying and between the plurality of semiconductor die and has a distribution of filler material. A concentration of the filler material is increased in all areas laterally adjacent each of the plurality of semiconductor die.

Abstract: A semiconductor device includes a semiconductor die having a plurality of contact pad sites, a plurality of contact pads, an encapsulant barrier, and an encapsulant. A plurality of contact pads is in electrical contact with a predetermined corresponding different one of the contact pad sites. An encapsulant barrier is positioned at an outer perimeter of the semiconductor die. The encapsulant barrier has a height that is as high as or greater than a highest of the plurality of contact pads. The encapsulant barrier is in physical contact with a same surface of the semiconductor die as the contact pad sites. An encapsulant surrounds the semiconductor die and one side of the encapsulant barrier. The encapsulant is blocked from making physical contact with any of the plurality of contact pads by the encapsulant barrier when the device is encapsulated while being supported by a temporary base support layer.