Abstract: A flexible automatic broiler and method of use for variable batch cooking for particular use in quick serve and fast food service restaurants. The automatic cooking devices include a conveyorized cooking surface for alignment and discharge of food products, an altering/pulsating infrared energy radiation heat sources, and a control system. The arrangement and method facilitate a combination of batch preparation and made-to-order assembly of fast-food sandwiches.

Abstract: A method that locates a plurality of die for forming a plurality of packaged integrated circuits. A frame is placed over the support structure, wherein the frame includes a plurality of openings therein and each opening of the plurality of openings has at least two walls. Each die of a plurality of die is placed over the support structure, wherein each die has at least two adjacent edges. The relative placing of the frame and the die results in each die being in an opening of the plurality of openings. Encapsulant is applied to the plurality of die. Either or both of the plurality of die and frame are moved in relation to the other in a manner that causes the two adjacent edges of each die of the plurality of die to substantially abut to and align with the two walls of an opening of the plurality of openings.

Abstract: A circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). At least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device (115) may be placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). The conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive or electrically non-conductive.

Abstract: A method of forming an embedded device build-up package (10) includes forming a first plurality of features (22) over a packaging substrate (12,16,18), wherein the first plurality of features (22) comprises a first feature and a second feature, forming at least a first crack arrest feature (28) in a first crack arrest available region (26), wherein the first crack arrest available region is between the first feature and the second feature, forming a second plurality of features (32) over the first plurality of features (22) wherein the second plurality of features includes a third feature and a fourth feature, and forming at least a second crack arrest feature (36) in a second crack arrest available region (34), wherein the second crack arrest feature (36) is between the third feature and the fourth feature, and the second crack arrest feature (36) is substantially orthogonal to the first crack arrest feature (28).

Abstract: A package assembly 200 includes a semiconductor die (e.g., an RF power amplifier) 208 fixed within the cavity of a conductive leadframe 204 using a thermally and electrically-conductive adhesive material 209. The semiconductor die 209 has a first side and a second side, wherein the first side includes at least one active area, and the second side includes at least one contact region. The conductive leadframe (e.g., a copper leadframe) 204 has two planar surfaces and a cavity formed therein. The adhesive material 209 is configured to couple the semiconductor die 208 within the cavity of the conductive leadframe 204 such that the first side of the semiconductor die is substantially coplanar with the first surface of the conductive leadframe.

Abstract: A multi-layer structure (102) includes a first build-up layer structure (202) configured to connect to a heat-generating module (120), a second build-up layer structure (206) configured to connect to a substrate, and a middle layer (204) provided between the first build-up layer structure and the second build-up layer structure, the middle layer including at least one semiconductor component (110) and a heat spreader (130). A first set of thermal vias (210) extend through the first build-up layer structure to the heat spreader, and a second set of thermal vias (2100 extend through the second build-up layer structure to the heat spreader, wherein at least a portion of the first set of thermal vias is in thermal contact with the heat-generating module.

Abstract: A circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). At least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). Additionally, a circuit device (115) may be placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). The conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126,326) may be electrically conductive or electrically non-conductive.

Abstract: In one embodiment, circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). In this embodiment, at least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). In one embodiment, circuit device (115) is placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). In this embodiment, conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive for some embodiments, and electrically non-conductive for other embodiments.

Abstract: Closely-spaced bonding wires may be used in a variety of different packaging applications to achieve improved electrical performance. In one embodiment, two adjacent bonding wires within a wire grouping are closely-spaced if a separation distance D between the two adjacent wires is met for at least 50 percent of the length of the shorter of the two adjacent wires. In one embodiment, the separation distance D is at most two times a diameter of the wire having the larger diameter of the two adjacent wires. In another embodiment, the separation distance D is at most three times a wire-to-wire pitch between the two adjacent wires. Each wire grouping may include two of more closely-spaced wires. Wire groupings of closely-spaced bonding wires may be used to form, for example, power-signal-ground triplets, signal-ground pairs, signal-power pairs, or differential signal pairs or triplets.

Abstract: In one embodiment, circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). In this embodiment, at least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). In one embodiment, circuit device (115) is placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). In this embodiment, conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive for some embodiments, and electrically non-conductive for other embodiments.

Abstract: In one embodiment, circuit device (15) is placed within an opening of a conductive layer (10) which is then partially encapsulated with an encapsulant (24) so that the active surface of the circuit device (15) is coplanar with the conductive layer (10). In this embodiment, at least a portion of the conductive layer (10) may be used as a reference voltage plane (e.g. a ground plane). In one embodiment, circuit device (115) is placed on a conductive layer (100) such that an active surface of circuit device (115) is between conductive layer (100) and an opposite surface of circuit device (115). In this embodiment, conductive layer (100) has at least one opening (128) to expose the active surface of circuit device (115). The encapsulant (24, 126, 326) may be electrically conductive for some embodiments, and electrically non-conductive for other embodiments.

Abstract: A dielectric resonator filter operating in a magnetic dipole mode includes a plurality of dielectric resonators disposed in a plurality of dielectric resonator cavities. A plurality of coupling mechanism provide an in-line coupling factor between respective resonators of electrically adjacent dielectric resonator cavities. At least one cross-coupling device provides cross-coupling between respective resonators of non-adjacent dielectric resonator cavities. A magnitude and sign of the in-line coupling factors and the cross-coupling factor, provide a dielectric resonator filter, for which a desired amplitude and phase response can be provided.

Abstract: Food cooking apparatus for melting cheese disposed on a food product. The cheese topped food product, for example a bun half, burger patty and cheese stack, is transferred in and out of a cooking chamber by a trolley. Entry of the trolley to the cooking chamber starts a cooking cycle. A steam generator provides pressurized steam from a location just above the cheese by a distance of up to about 2.0 inches for a short time until the cheese is melted. The trolley carries a transport medium upon which the food product is placed. A plurality of holes is disposed in the medium to remove from it any water formed by condensation. The steam generator includes a heated platen and a lid that form a steam generating chamber. Water is injected into the chamber onto the heated platen in a small enough quantity that substantially all of the water is converted to steam substantially instantaneously.

Abstract: Apparatus for high speed grilling and/or conditioning of a food product which comprises: a heatable surface which is capable caramelizing the food product at a temperature in the range between about 425.degree. F. to 575.degree. F.; a chamber for enclosing the food product on the heatable surface under pressure; and a steam injector for introducing steam into the chamber during the caramelization of the food product.

Abstract: A dielectric resonator filter operating in a magnetic dipole mode includes a plurality of dielectric resonators disposed in a plurality of dielectric resonator cavities. A plurality of coupling mechanism provide an in-line coupling factor between respective resonators of electrically adjacent dielectric resonator cavities. At least one cross-coupling device provides cross-coupling between respective resonators of non-adjacent dielectric resonator cavities. A magnitude and sign of the in-line coupling factors and the cross-coupling factor, provide a dielectric resonator filter, for which a desired amplitude and phase response can be provided.

Abstract: Apparatus for high speed grilling and/or conditioning of a food product which comprises: a heatable surface which is capable caramelizing the food product at a temperature in the range between about 425.degree. F. to 575.degree. F.; a chamber for enclosing the food product on the heatable surface under pressure; and a steam injector for introducing steam into the chamber during the caramelization of the food product.

Abstract: A unique instant-on feature for a cooking device that allows microprocessor control of the device after a period of idling. When activated, the instant-on enabler switch sends a signal to the microprocessor, which checks an internal clock to determine the amount of time the device has remained idle since the last cook cycle. This information is sent back to the instant-on enabler switch, which then selects among an appropriate array of cooking times. These times, longer than the initial pre-set cooking time, are based on testing and compensate for the degree of heat zone stratification in the cooking medium or surface caused by the extended idling. The instant-on enabler program immediately supplies additional heat to the cooking surface upon activation cooking cycle or operator input, allowing the maximum time for the cooking surface to reach proper cooking temperature.

Abstract: A dielectric resonator filter operating in a magnetic dipole mode includes a plurality of dielectric resonators disposed in a plurality of dielectric resonator cavities. A plurality of coupling mechanism provide an in-line coupling factor between respective resonators of electrically adjacent dielectric resonator cavities. At least one cross-coupling device provides cross-coupling between respective resonators of non-adjacent dielectric resonator cavities. A magnitude and sign of the in-line coupling factors and the cross-coupling factor, provide a dielectric resonator filter, for which a desired amplitude and phase response can be provided.

Abstract: A portable filter has an oil remove/return wand for insertion into a cooking apparatus utilizing hot oil. A flexible hose connects the wand to a motor pump and supports a motor direction control switch adjacent to the wand. A compartmentalized housing includes: a container having an inlet and an outlet, a removable filter holder mounted in the container, plumbing connecting the container inlet and outlet to the motor pump, a heating element for the outlet plumbing, a control panel having an OFF switch for connection to a power supply and FILTER and HEATER switches connected to the OFF switch, and indicator lights for the OFF, FILTER, HEATER switches. The motor direction switch is connected to the FILTER switch and to first and second delay circuits. The heater switch is connected to the heater element to apply power; while the heater switch is ON the filter switch cannot be activated.

Abstract: A forced air convection oven for use by restaurants and delicatessens for cooking ribs and other meat products. Liquid smoke or other liquid flavoring agent is sucked from a container, is atomized and is sprayed into the cooking chamber of the oven to impart a desired flavor to the meat.